Patents by Inventor Theodore H. Klein

Theodore H. Klein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabrication of conductor-clad composites using molding compounds and techniques
    Patent number: 4393111
    Abstract: Conductor-clad composites are advantageously fabricated using molding compounds and associated processing techniques. The conductive cladding is applied and bonded to the composite during the molding process. The conductor-clad composite may be used as printed wiring board, and in this embodiment results in improved physical, chemical, mechanical, and electrical properties.
    Type: Grant
    Filed: July 31, 1981
    Date of Patent: July 12, 1983
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventor: Theodore H. Klein
  • Fabrication of conductor-clad composites using molding compounds and techniques
    Patent number: 4323421
    Abstract: Conductor-clad composites are advantageously fabricated using molding compounds and associated processing techniques. The conductive cladding is applied and bonded to the composite during the molding process. The conductor-clad composite may be used as printed wiring board, and in this embodiment results in improved physical, chemical, mechanical, and electrical properties.
    Type: Grant
    Filed: February 15, 1980
    Date of Patent: April 6, 1982
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventor: Theodore H. Klein
  • Reinforced flexible printed wiring board
    Patent number: 4177553
    Abstract: An improved reinforced flexible printed wiring board is disclosed. The reinforcement in this printed wiring board is composed of a fabric woven from a yarn of plied continuous filaments of polyester and glass. The fabric is impregnated with an appropriate resin which is subsequently cured. This printed wiring board is found to have improved mechanical and thermal characteristics with little degradation in electrical properties.
    Type: Grant
    Filed: February 27, 1978
    Date of Patent: December 11, 1979
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventor: Theodore H. Klein