Abstract: Embodiments of the invention are directed to an integrated sensing system that includes a movable orientation device configured to dynamically position the movable orientation device based on receiving an air-flow. A gas sensor is coupled to the movable orientation device. The gas sensor includes a recognition element configured to detect a chemical in a plume. The movable orientation device is configured to perform a synchronized sensing operation that includes, based at least in part on the movable orientation device receiving the air-flow, moving the movable orientation device to dynamically maintain a predetermined orientation of the movable orientation device relative to a direction of the air-flow. The predetermined orientation includes positioning the gas sensor in a path of the air-flow, wherein the air-flow is influencing the plume to move along the path such that the recognition element is exposed to the plume.

Abstract: Heuristic-based techniques for gas leak source identification are provided. In one aspect, a method for identifying a location of a gas leak source includes: obtaining gas sensor data and wind data synchronously from a gas leak detection system having a network of interconnected motes comprising gas sensors and wind sensors, with the gas sensors arranged around possible gas leak sources in a given area of interest; identifying the location of the gas leak source using the gas sensor data and wind data; and determining a magnitude of gas leak from the gas leak source using the location of the gas leak source and a distance d between the location of the gas leak source and a select one of the gas sensors from which the gas sensor data was obtained. A gas leak detection system is also provided.

Abstract: A method for clustering time stamps in time series data includes receiving a one-dimensional array of ordered timestamps and an expected frequency; determining a set of time intervals; determining a first binary array that indicates whether each time interval in the set of time intervals is greater than or less than the expected frequency; determining a second binary array of differences between a corresponding pair of adjacent elements of the first binary array; appending an ith timestamp to one of a set of opening interval bounds, a set of closing interval bounds, or a set of isolated points; merging the set of set of opening interval bounds and the set of closing interval bounds into a set of cluster intervals ?; and outputting the set of cluster intervals and the set of isolated points.

Abstract: An accelerometer without internal mechanical attachments. Three parallel cylindrical magnets are fixed within a housing. Each cylindrical magnet has a long axis extending through the housing and a cylindrical cross-section. The cylindrical cross-sections of the cylindrical magnets are organized to form a triangular formation. The magnetization of the cylindrical magnets is tangential to the triangular formation. A diamagnetic mass object levitates within the three cylindrical magnets by the magnetization of the cylindrical magnets at an equilibrium position near the center of the triangular formation and near a central axis of the three parallel cylindrical magnets when no external force is applied. Sensors detect the location of the diamagnetic mass object when the diamagnetic mass object is displaced from the equilibrium position near the center of the triangular formation and the three parallel cylindrical magnets by an external force to the housing.

Abstract: Heuristic-based techniques for gas leak source identification are provided. In one aspect, a method for identifying a location of a gas leak source includes: obtaining gas sensor data and wind data synchronously from a gas leak detection system having a network of interconnected motes comprising gas sensors and wind sensors, with the gas sensors arranged around possible gas leak sources in a given area of interest; identifying the location of the gas leak source using the gas sensor data and wind data; and determining a magnitude of gas leak from the gas leak source using the location of the gas leak source and a distance d between the location of the gas leak source and a select one of the gas sensors from which the gas sensor data was obtained. A gas leak detection system is also provided.

Abstract: Embodiments of the invention are directed to an integrated sensing system that includes a movable orientation device configured to dynamically position the movable orientation device based on receiving an air-flow. A gas sensor is coupled to the movable orientation device. The gas sensor includes a recognition element configured to detect a chemical in a plume. The movable orientation device is configured to perform a synchronized sensing operation that includes, based at least in part on the movable orientation device receiving the air-flow, moving the movable orientation device to dynamically maintain a predetermined orientation of the movable orientation device relative to a direction of the air-flow. The predetermined orientation includes positioning the gas sensor in a path of the air-flow, wherein the air-flow is influencing the plume to move along the path such that the recognition element is exposed to the plume.

Abstract: Dust-sized and light transparent semiconductor chips are provided and are used in a transparent electronic system. The dust-sized and light transparent semiconductor chips are composed entirely of materials that are transparent to visible light. The dust-sized and light transparent semiconductor chips are used as a component of a transparent electronic system.

Abstract: Techniques for facilitating event driven gas sensing and source attribution are provided. In one example, a computer-implemented method comprises generating, by a device operatively coupled to a processor, a gas sensor signal indicative of sensing a gas based on the sensing the gas by one or more sensors. Additionally, the computer-implemented method can comprise converting, by the device, the gas sensor signal from an analog signal to a digital signal to identify one or more peak events based on the digital signal being determined to have satisfied a condition.

Abstract: An accelerometer without internal mechanical attachments. Three parallel cylindrical magnets are fixed within a housing. Each cylindrical magnet has a long axis extending through the housing and a cylindrical cross-section. The cylindrical cross-sections of the cylindrical magnets are organized to form a triangular formation. The magnetization of the cylindrical magnets is tangential to the triangular formation. A diamagnetic mass object levitates within the three cylindrical magnets by the magnetization of the cylindrical magnets at an equilibrium position near the center of the triangular formation and near a central axis of the three parallel cylindrical magnets when no external force is applied. Sensors detect the location of the diamagnetic mass object when the diamagnetic mass object is displaced from the equilibrium position near the center of the triangular formation and the three parallel cylindrical magnets by an external force to the housing.

Abstract: A method for clustering time stamps in time series data includes receiving a one-dimensional array of ordered timestamps and an expected frequency; determining a set of time intervals; determining a first binary array that indicates whether each time interval in the set of time intervals is greater than or less than the expected frequency; determining a second binary array of differences between a corresponding pair of adjacent elements of the first binary array; appending an ith timestamp to one of a set of opening interval bounds, a set of closing interval bounds, or a set of isolated points; merging the set of set of opening interval bounds and the set of closing interval bounds into a set of cluster intervals ?; and outputting the set of cluster intervals and the set of isolated points.

Abstract: A method and a package for circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substrate; a metal foil disposed on the circuit chip in thermal contact with the chip; a metal lid having (i) a third CTE that is different from the first CTE and (ii) a bottom edge region, where the metal lid is disposed on the metal foil in thermal contact with the metal foil; and an adhesive layer along the bottom edge of the metal lid, cured at a first temperature, bonding the lid to the substrate, producing an assembly which, at a second temperature, is transformed to a bent circuit chip package.

Abstract: A method and a package for circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substrate; a metal foil disposed on the circuit chip in thermal contact with the chip; a metal lid having (i) a third CTE that is different from the first CTE and (ii) a bottom edge region, where the metal lid is disposed on the metal foil in thermal contact with the metal foil; and an adhesive layer along the bottom edge of the metal lid, cured at a first temperature, bonding the lid to the substrate, producing an assembly which, at a second temperature, is transformed to a bent circuit chip package.

Abstract: A method of assembling a bent circuit chip package and a circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substrate; a metal foil disposed on the circuit chip in thermal contact with the chip; a metal lid having (i) a third CTE that is different from the first CTE and (ii) a bottom edge region, where the metal lid is disposed on the metal foil in thermal contact with the metal foil; and an adhesive layer along the bottom edge of the metal lid, cured at a first temperature, bonding the lid to the substrate, producing an assembly which, at a second temperature, is transformed to a bent circuit chip package.

Abstract: A method of assembling a bent circuit chip package and a circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substrate; a metal foil disposed on the circuit chip in thermal contact with the chip; a metal lid having (i) a third CTE that is different from the first CTE and (ii) a bottom edge region, where the metal lid is disposed on the metal foil in thermal contact with the metal foil; and an adhesive layer along the bottom edge of the metal lid, cured at a first temperature, bonding the lid to the substrate, producing an assembly which, at a second temperature, is transformed to a bent circuit chip package.

Abstract: A system (and method) for real-time measurement of trace metal concentration in a chemical mechanical polishing (CMP) slurry, includes an electromagnetic radiation flow cell carrying a CMP slurry, a slurry pickup head coupled to the flow cell, and an analyzer for measuring properties of the slurry flowing through the flow cell.

Abstract: An apparatus for cooling a surface having a metal structure made of a material with high thermal conductivity, and designed to provide efficient cooling of the surface while minimizing mechanical stress between the metal structure and the surface.

Abstract: A system (and method) for real-time measurement of trace metal concentration in a chemical mechanical polishing (CMP) slurry, includes an electromagnetic radiation flow cell carrying a CMP slurry, a slurry pickup head coupled to the flow cell, and an analyzer for measuring properties of the slurry flowing through the flow cell.

Abstract: The present invention is a method and apparatus for cooling a heat source. In one embodiment a heat exchanger is provided and includes a channel for receiving a coolant, the channel having a first surface and an opposing second surface. A mesh plug is disposed in the channel for turbulently mixing the coolant within the channel. The first surface of the channel is disposed proximate a semiconductor heat source. In one embodiment the first surface comprises plastic. In one embodiment, the second surface comprises metal, for example, copper. In one embodiment the mesh plug comprises a nickel-coated copper mesh.

Abstract: The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is disposed between the heat sink and substrate. The channel has at least one wall defined by the heat sink. The surface area of the channel wall defined by the heat sink is about 10 to about 100 times the surface area of a bottom surface of the semiconductor heat source. A coolant, for example liquid metal, circulates within the channel.

Abstract: An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.