Abstract: An integrated circuit containing an array of SRAM cells with T-shaped contacts in the inverters, in which drain connecting segments may extend beyond gate connecting segments by a distance greater than 10 percent of a separation distance between ends of opposite drain connecting segments. The drain connecting segments may also extend beyond gate connecting segments by a distance greater than one-third of the width of the gate connecting segments. A process of forming an integrated circuit containing an array of SRAM cells with T-shaped contacts in which drain connecting segments may extend beyond gate connecting segments by a distance greater than 10 percent of a separation distance between ends of opposite drain connecting segments. A process may also form the drain connecting segments to extend beyond gate connecting segments by greater than one-third of the width of the gate connecting segments.

Abstract: An integrated circuit including an array of SRAM cells containing a write port with a write word line and two read buffers with read word lines. The write port includes passgate transistors connected to each data node of the SRAM cell. A process of operating the integrated circuit in which source nodes of read buffer driver transistors are biased during a read operation. A process of operating the integrated circuit in which source nodes of read buffer driver transistors are floated during a read operation. A process of operating the integrated circuit in which the write port and the read ports share data lines and the source nodes of read buffer driver transistors are floated during a write operation.

Abstract: A functional memory of the integrated circuit includes row and column periphery units and an array of memory cells having a core storage element and a read buffer. The functional memory further includes a read buffer supply line that is connected to the read buffer, wherein the read buffer supply line is switchable between an operating mode output and a low-power mode output of a read buffer supply that is separate from core storage element supplies.

Abstract: The present invention provides a body bias coordinator for use with a transistor employing a body region. In one embodiment, the body bias coordinator includes a control unit configured to control the transistor and make it operable to provide a virtual supply voltage from a source voltage during activation of the transistor. The body bias coordinator also includes a connection unit coupled to the control unit and configured to connect the body region to the virtual supply voltage during activation of the transistor. In an alternative embodiment, the connection unit is further configured to connect the body region to another voltage during non-activation of the transistor. These embodiments improve transistor active and passive performance, permit smaller transistor sizing and reduce leakage current.

Abstract: Methods for measuring the read margin, write margin, and stability margin of SRAM bits with operational circuitry that includes effects of the SRAM array architecture and circuit design. In addition, methods for measuring the read margin, write margin, and stability margin of SRAM that excludes the effects of SRAM array architecture and circuit design.

Abstract: An integrated circuit containing an array of SRAM cells with T-shaped contacts in the inverters, in which drain connecting segments may extend beyond gate connecting segments by a distance greater than 10 percent of a separation distance between ends of opposite drain connecting segments. The drain connecting segments may also extend beyond gate connecting segments by a distance greater than one-third of the width of the gate connecting segments. A process of forming an integrated circuit containing an array of SRAM cells with T-shaped contacts in which drain connecting segments may extend beyond gate connecting segments by a distance greater than 10 percent of a separation distance between ends of opposite drain connecting segments. A process may also form the drain connecting segments to extend beyond gate connecting segments by greater than one-third of the width of the gate connecting segments.

Abstract: An integrated circuit containing an array of SRAM cells with T-shaped contacts in the inverters, in which drain connecting segments may extend beyond gate connecting segments by a distance greater than 10 percent of a separation distance between ends of opposite drain connecting segments. The drain connecting segments may also extend beyond gate connecting segments by a distance greater than one-third of the width of the gate connecting segments. A process of forming an integrated circuit containing an array of SRAM cells with T-shaped contacts in which drain connecting segments may extend beyond gate connecting segments by a distance greater than 10 percent of a separation distance between ends of opposite drain connecting segments. A process may also form the drain connecting segments to extend beyond gate connecting segments by greater than one-third of the width of the gate connecting segments.

Abstract: The present invention pertains to semiconductor memory devices, and particularly to a system and method for adaptively setting the operating voltages for SRAM for both Vtrip and SNM to reduce power while maintaining functionality and performance, based on modeling and characterizing a test structure. One embodiment comprises an SRAM array, a test structure that characterizes one or more parameters that are predictive of the SRAM functionality and outputs data of the parameters, a test controller that reads the parameters and identifies an operating voltage that satisfies predetermined yield criteria, and a voltage controller to set an operating voltage for the SRAM array based on the identified operating voltage. One method sets an operating voltage for an SRAM by reading test structure data of the parameters, analyzing the data to identify an operating voltage that satisfies predetermined yield criteria, and setting the operating voltage for the SRAM based on the identified operating voltage.

Abstract: An integrated circuit containing logic transistors and an array of SRAM cells in which the logic transistors are formed in semiconductor material with one crystal orientation and the SRAM cells are formed in a second semiconductor layer with another crystal orientation. A process of forming an integrated circuit containing logic transistors and an array of SRAM cells in which the logic transistors are formed in a top semiconductor layer with one crystal orientation and the SRAM cells are formed in an epitaxial semiconductor layer with another crystal orientation. A process of forming an integrated circuit containing logic transistors and an array of SRAM cells in which the SRAM cells are formed in a top semiconductor layer with one crystal orientation and the logic transistors are formed in an epitaxial semiconductor layer with another crystal orientation.

Abstract: A memory array is provided having a memory cell coupled to a read word line and a write word line of the memory array and peripheral circuits for reading and writing to the memory cell. The memory cell comprises a storage element for storing a logical state of the memory cell powered at a reduced voltage during at least one functional operation and a write access circuit configured to connect the storage element to at least a first write bit line in the memory array in response to a write signal on the write word line for writing the logical state to the memory cell. The memory cell further comprises a read access circuit including an input node connected to the storage element and an output node connected to a read bit line of the memory array. The read access circuit is enabled and configured to read the logic state of the storage element in response to a read signal on the read word line.

Abstract: An integrated circuit (IC) includes at least one memory array having a plurality of memory cells arranged in a plurality of rows and columns, the array also having a plurality of word lines for accessing rows of cells and a plurality bit lines for accessing columns of cells. A voltage differential generating circuit is operable to provide a differential wordline voltage (VWL) relative to an array supply voltage, wherein the differential is a function of the array supply voltage.

Abstract: An integrated circuit including a ram array with SRAM cells containing a write port with a write word line and two read buffers with read word lines. The write port includes passgate transistors connected to each data node of the SRAM cell. A process of operating the integrated circuit in which source nodes of read buffer driver transistors are biased during a read operation. A process of operating the integrated circuit in which source nodes of read buffer driver transistors are floated during a read operation. A process of operating the integrated circuit in which the write port and the read ports share data lines and the source nodes of read buffer driver transistors are floated during a write operation.

Abstract: The present invention provides a thermostatic biasing controller for use with an integrated circuit. In one embodiment, the thermostatic biasing controller includes a temperature sensing unit configured to determine an operating temperature of the integrated circuit. Additionally, the thermostatic biasing controller also includes a voltage controlling unit coupled to the temperature sensing unit and configured to provide a back-bias voltage corresponding to the operating temperature based on reducing a quiescent current of the integrated circuit.

Abstract: An integrated circuit includes a memory array having a plurality of SRAM memory cells arranged in a plurality of rows and columns, the array also having a plurality of word lines for accessing rows of cells and a plurality bit lines for accessing columns of cells. The plurality of memory cells include a plurality of asymmetric cells, each of the asymmetric cells configured with a strong side including a first inverter having a strong side latch node, and a strong side pass transistor coupled to the strong side latch node, and a weak side including a second inverter cross-coupled with the first inverter having a weak side latch node and a weak side pass transistor coupled to the weak side latch node. Separate ones of the plurality of word lines are coupled to a gate of the strong side pass transistor and a gate of the weak side pass transistor.

Abstract: An integrated circuit containing an array of SRAM cells with NMOS drivers and passgates, and an n-well bias control circuit which biases n-wells in each SRAM column independently. An integrated circuit containing an array of SRAM cells with PMOS drivers and passgates, and a p-well bias control circuit which biases p-wells in each SRAM column independently. A process of operating an integrated circuit containing an array of SRAM cells with NMOS drivers and passgates, and an n-well bias control circuit which biases n-wells in each SRAM column independently.

Abstract: An array with cells that have adjacent similar structures that are displaced from each other across a common cell border in a direction that is not perpendicular to the cell border thus avoiding an across cell border design rule violation between the adjacent similar structures. A method of forming reduced area memory arrays by displacing adjacent similar structures along a common cell border. A method of building arrays using conventional array building software by forming unit pairs with cells that are not identical and are not mirror images or rotated versions of each other.

Abstract: An array with cells that have adjacent similar structures that are displaced from each other across a common cell border in a direction that is not perpendicular to the cell border thus avoiding an across cell border design rule violation between the adjacent similar structures. A method of forming reduced area memory arrays by displacing adjacent similar structures along a common cell border. A method of building arrays using conventional array building software by forming unit pairs with cells that are not identical and are not mirror images or rotated versions of each other.

Abstract: An integrated circuit containing an SRAM that provides a switch to decouple the SRAM wordline voltage from the SRAM array voltage during screening and that also provides different wordline and array voltages during a portion of the SRAM bit screening test. A method for screening SRAM bits in an SRAM array in which the wordline voltage is different than the array voltage during a portion of the screening test.

Abstract: An integrated circuit having an SRAM array includes SRAM cells arranged in rows and columns, and a global read circuit connected to globally read SRAM cells corresponding to accessed rows and columns of the SRAM array. The SRAM array also includes a separate, local sense and feedback circuit connected to a local column of the SRAM array, wherein a sensing portion indicates a memory state of an SRAM cell in an accessed row of the local column and a feedback portion rewrites the memory state back into the SRAM cell. Additionally, a method of operating an integrated circuit having an SRAM array includes providing an SRAM cell in an addressed condition of the SRAM array. The method also includes locally sensing a current memory state of the SRAM cell and locally feeding back to the SRAM cell to retain the memory state during the addressed condition.

Abstract: A memory array is provided having a memory cell coupled to a read word line and a write word line of the memory array and peripheral circuits for reading and writing to the memory cell. The memory cell comprises a storage element for storing a logical state of the memory cell powered at a reduced voltage during at least one functional operation and a write access circuit configured to connect the storage element to at least a first write bit line in the memory array in response to a write signal on the write word line for writing the logical state to the memory cell. The memory cell further comprises a read access circuit including an input node connected to the storage element and an output node connected to a read bit line of the memory array. The read access circuit is enabled and configured to read the logic state of the storage element in response to a read signal on the read word line.