Abstract: A method for increasing the performance of a thermoelectric system with one or more thermoelectric assemblies to provide heating, cooling, and ventilation through electrical pulsing. The thermoelectric assemblies are individually controllable with constant or pulsing controls so that the performance of the thermoelectric system can be increased. In a multi-assembly system, the thermoelectric system is comprised of thermoelectric assemblies, a control unit that determines the optimal pulsing conditions, and fans to supply and exhaust heating or cooling to an occupied space.

Abstract: A hydronic system includes a partition, a first conduit embedded in a first side of the partition, a second conduit embedded in a second side of the partition, a first sheet of finishing material covering the first conduit, a second sheet of finishing material covering the second conduit, and at least one valve and at least one pump. The at least one valve and at least one pump are configured to control a flow of a fluid inside the first conduit and the second conduit. When the hydronic system is operating in an isolating mode, the fluid flows in a first closed loop through the first conduit and the fluid flows in a second closed loop through the second conduit. When the hydronic system is operating in a heat exchange mode, the fluid flows between the first conduit and the second conduit in a third closed loop.

Abstract: One or more temperature control units are distributed throughout an environment to provide localized heating and cooling. The temperature control units include a thermal storage system including one or more substances of high latent heat capacity, a heat distribution surface, a solid-state heat pump positioned between the thermal storage system and the heat distribution surface, an environmental sensing module including a proximity sensor, and unit control modules in communication with the solid-state heat pumps. The solid-state heat pumps are individually controllable so that heating and cooling can be provided simultaneously from separate heat pumps in the same temperature control unit, or separate temperature control units in the same environment.

Abstract: A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.

Abstract: A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.

Abstract: A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.

Abstract: Embodiments of the invention are directed to doped pnictogen chalcogenide nanoplates, where each nanoplate comprises a rhombohedral crystal of Bi2Te3, Bi2Se3, or Sb2Te3 that is sulfur doped. Another embodiment of the invention is directed to a microwave activated method of preparation of the doped pnictogen chalcogenide nanoplates. Other embodiments of the invention are directed to bulk assemblies or fused films of the doped pnictogen chalcogenide nanoplates and their preparation from the doped pnictogen chalcogenide nanoplates such that the bulk assembly or fused film can be employed in a thermoelectric device.

Abstract: A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.

Abstract: Embodiments of the invention are directed to doped pnictogen chalcogenide nanoplates, where each nanoplate comprises a rhombohedral crystal of Bi2Te3, Bi2Se3, or Sb2Te3 that is sulfur doped. Another embodiment of the invention is directed to a microwave activated method of preparation of the doped pnictogen chalcogenide nanoplates. Other embodiments of the invention are directed to bulk assemblies or fused films of the doped pnictogen chalcogenide nanoplates and their preparation from the doped pnictogen chalcogenide nanoplates such that the bulk assembly or fused film can be employed in a thermoelectric device.