Patents by Inventor Theodorus Martinus Michielsen
Theodorus Martinus Michielsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140194753Abstract: A local power-delivery/data-reception unit is installed within an insertion end of a sealed catheter. The local power-delivery/data-reception unit wirelessly powers a separately sealed sensor that is attached to the insertion end and configured for wirelessly sending a data signal to the local power-delivery/data-reception unit. The catheter may further feature a remote power-delivery/data-reception unit disposed within the handle and configured for wirelessly communicating with the local power-delivery/data-reception unit and a controller for controlling the sensor.Type: ApplicationFiled: March 13, 2014Publication date: July 10, 2014Applicant: KONINKLIJKE PHILIPS N.V.Inventors: Ronald Dekker, Antoon Marie-Henrie Tombeur, Theodorus Martinus Michielsen
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Patent number: 8708922Abstract: A local power-delivery/data-reception unit is installed within an insertion end of a sealed catheter. The local power-delivery/data-reception unit wirelessly powers a separately sealed sensor that is attached to the insertion end and configured for wirelessly sending a data signal to the local power-delivery/data-reception unit. The catheter may further feature a remote power-delivery/data-reception unit disposed within the handle and configured for wirelessly communicating with the local power-delivery/data-reception unit and a controller for controlling the sensor.Type: GrantFiled: December 19, 2007Date of Patent: April 29, 2014Assignee: Koninklijke Philips N.V.Inventors: Ronald Dekker, Antoon Marie Henrie Tombeur, Theodorus Martinus Michielsen
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Publication number: 20120038032Abstract: The rollable device of the invention comprises a substrate of an insulating material with apertures extending from a first to a second side. On the first side switching elements are present, as well as interconnect lines and the like, covered by a coating of organic material. On the second side a functional layer is present. Examples of such functional layers include capacitors, antennas and particularly electro-optical layers. Thus, with a rollable display that may include an antenna and a driver circuit is obtained.Type: ApplicationFiled: October 24, 2011Publication date: February 16, 2012Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: Ronald Dekker, Theodorus Martinus Michielsen
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Patent number: 8105873Abstract: Provided is a flexible device (100) having an integrated circuit (5) and an antenna (6) which is incorporated or directly coupled to the interconnect structure of the integrated circuit (5). An electrically insulating or dielectric layer (4) is present as support layer for both antenna (6) and integrated circuit (5). Preferably the substrate (10) is removed at non-silicon areas (10B) outside the active areas (10A) of the integrated circuit (5). This removal can be combined with the use of a substrate of monocrystalline silicon. The flexible device is very suitable for integration in identification labels and security paper, and can be manufactured using a temporarily attached carrier substrate.Type: GrantFiled: September 9, 2010Date of Patent: January 31, 2012Assignee: Koninklijke Philips Electronics N.V.Inventors: Ronald Dekker, Theodorus Martinus Michielsen, Antoon Marie Henrie Tombeur
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Patent number: 8067802Abstract: The rollable device of the invention comprises a substrate of an insulating material (12) with apertures (15) extending from a first to a second side. On the first side switching elements (13) are present, as well as interconnect lines and the like, covered by a coating of organic material (3). On the second side a functional layer is present. Examples of such functional layers include capacitors, antennas and particularly electro-optical layers. Thus, with a rollable display that may include an antenna and a driver circuit is obtained.Type: GrantFiled: November 4, 2003Date of Patent: November 29, 2011Assignee: Koninklijke Philips Electronics N.V.Inventors: Ronald Dekker, Theodorus Martinus Michielsen
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Publication number: 20100328028Abstract: Provided is a flexible device (100) having an integrated circuit (5) and an antenna (6) which is incorporated or directly coupled to the interconnect structure of the integrated circuit (5). An electrically insulating or dielectric layer (4) is present as support layer for both antenna (6) and integrated circuit (5). Preferably the substrate (10) is removed at non-silicon areas (10B) outside the active areas (10A) of the integrated circuit (5). This removal can be combined with the use of a substrate of monocrystalline silicon. The flexible device is very suitable for integration in identification labels and security paper, and can be manufactured using a temporarily attached carrier substrate.Type: ApplicationFiled: September 9, 2010Publication date: December 30, 2010Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: Ronald Dekker, Theodorus Martinus Michielsen, Antoon Marie Henrie Tombeur, Pieter Werner Hooijmans
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Patent number: 7845378Abstract: A method for bonding two plate-shaped objects (5) with an adhesive which is cured by ultraviolet light irradiation and by heating. The two plate-shaped objects (5) with the adhesive in between are transported into a cure chamber (11) comprising an ultraviolet lamp (12) and a heating element (13). A movable heat-shielding member (3) is temporary present between the objects (5) and the heating element (13) during at least the first part of the irradiation treatment. Preferably, the heat-shielding member (3) is positioned outside the cure chamber (11) during a part of the cure treatment.Type: GrantFiled: July 3, 2007Date of Patent: December 7, 2010Assignee: Koninklijke Philips Electronics N.V.Inventors: Henricus Godefridus Rafael Maas, Theodorus Martinus Michielsen, Richard Jozef Maria Waelen
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Patent number: 7816774Abstract: A flexible device has an integrated circuit and an antenna incorporated or directly coupled to an interconnect structure of the integrated circuit. The interconnect structure extends outside of the active area. An electrically insulating or dielectric layer is present as support layer for both antenna and integrated circuit. The substrate is removed outside the active areas of the integrated circuit.Type: GrantFiled: July 1, 2004Date of Patent: October 19, 2010Assignee: Koninklijke Philips Electronics N.V.Inventors: Ronald Dekker, Theodorus Martinus Michielsen, Antoon Marie Henrie Tombeur, Pieter Werner Hooijmans
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Publication number: 20100164079Abstract: The assembly (100) comprises a laterally limited semiconductor substrate region (15) in which an electrical element (20) is defined. Thereon, an interconnect structure (21) is present. This is provided, at its first side (101) with contact pads (25,26) for coupling to an electric device (30), and at its second side (102) with connections (20) to the electrical element (11). Terminals (52,53) are present at the second side (102) of the interconnect structure (21), and coupled to the interconnect structure (21) through extensions (22,23) that are laterally displaced and isolated from the semiconductor substrate region (15). An electric device (30) is assembled to the first side (101) of the interconnect structure (21), and an encapsulation (40) extending on the first side (101) of the interconnect structure (21) so as to support it and encapsulating the electric device (30) is present.Type: ApplicationFiled: June 23, 2006Publication date: July 1, 2010Applicant: KONINKLIJKE PHILIPS ELECTRONICS, N.V.Inventors: Ronald Dekker, Marc Andre De Samber, Wilhelmus Hendrikus De Haas, Theodorus Martinus Michielsen, Franciscus Adrianus Cornelis Maria Schoofs, Nicolaas Johannes Anthonius Van Veen
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Patent number: 7736948Abstract: Individual devices (100) are locally attached to a carrier substrate (10), so that they can be removed therefrom individually. This is achieved through the use of a patterned release layer, particularly a layer that is removable through decomposition into gaseous or vaporized decomposition products. The mechanical connection between the carrier substrate (10) and the individual devices (100) is provided by a bridging portion (43) of an adhesion layer (40).Type: GrantFiled: November 3, 2006Date of Patent: June 15, 2010Assignee: Koninklijke Philips Electronics N.V.Inventors: Ronald Dekker, Greja Johanna Adriana Maria Verheijden, Theodorus Martinus Michielsen, Carel Van Der Poel, Cornelis Adrianus Henricus Antonius Mutsaers
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Publication number: 20100042010Abstract: A local power-delivery/data-reception unit is installed within an insertion end of a sealed catheter. The local power-delivery/data-reception unit wirelessly powers a separately sealed sensor that is attached to the insertion end and configured for wirelessly sending a data signal to the local power-delivery/data-reception unit. The catheter may further feature a remote power-delivery/data-reception unit disposed within the handle and configured for wirelessly communicating with the local power-delivery/data-reception unit and a controller for controlling the sensor.Type: ApplicationFiled: December 19, 2007Publication date: February 18, 2010Applicant: KONINKLIJKE PHILIPS ELECTRONICS N. V.Inventors: Ronald Dekker, Antoon Marie Henrie Tombeur, Theodorus Martinus Michielsen
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Publication number: 20090283891Abstract: The present invention relates to an integrated-circuit device comprising a multitude of separate rigid substrate islands (202 to 208) with circuit elements, a respective substrate island being connected to respective neighbor substrate islands by respective elastically deformable connections 210 to 222), which contain at least one respective signaling layer that is made of an electrically conductive material. At least one elastically deformable connection between substrate islands has a signaling layer, which is not electrically connected and thus forms a dummy signaling layer (210a to 210c), and the elastically deformable connections, which connect a respective substrate island to respective neighbor substrate islands along a first direction, have an elastic deformability in the first direction governed by respective moduli of elasticity, the ratio of which is between 0.5 and 2.0. This reduces the inhomogeneity of strain in the network of substrate islands that is formed by the integrated-circuit device.Type: ApplicationFiled: April 3, 2007Publication date: November 19, 2009Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: Ronald Dekker, Theodorus Martinus Michielsen, Theodoros Zoumpoulidis
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Publication number: 20090127702Abstract: The package (100) of the invention comprises at least one semiconductor device (30) provided with bond pads (32); an encapsulation (40), an interconnect element (20) and a heatsink (90). This element comprises a system of electrical interconnects (12) and is at least substantially covered by a thermally conductive, electrically insulating layer (11) at a first side (1) and that is provided with an electric isolation (13) at a second side (2), such that the isolation (13) and the thermally conducting layer (11) electrically isolate the electrical interconnects (12) from each other. At least one component of the encapsulation (40) and the heatsink (90) has an interface with the interconnect element (20), which interlace extends over substantially the complete side (1,2) to which the said component (40,90) is attached.Type: ApplicationFiled: June 22, 2006Publication date: May 21, 2009Applicant: KONINKLIJKE PHILIPS ELECTRONICS, N.V.Inventors: Ronald Dekker, Theodorus Martinus Michielsen, Eduard Johannes Meijer
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Publication number: 20080315440Abstract: Individual devices (100) are locally attached to a carrier substrate (10), so that they can be removed therefrom individually. This is achieved through the use of a patterned release layer, particularly a layer that is removable through decomposition into gaseous or vaporized decomposition products. The mechanical connection between the carrier substrate (10) and the individual devices (100) is provided by a bridging portion (43) of an adhesion layer (40).Type: ApplicationFiled: November 3, 2006Publication date: December 25, 2008Applicant: KONINKLIJKE PHILIPS ELECTRONICS, N.V.Inventors: Ronald Dekker, Greja Johanna Adriana Maria Verheijden, Theodorus Martinus Michielsen, Carel Van Der Poel, Cornelis Adrianus Henricus Antonius Mutsaers
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Patent number: 7271075Abstract: A method for bonding two plate-shaped objects (5) with an adhesive which is cured by ultraviolet light irradiation and by heating. The two plate-shaped objects (5) with the adhesive in between are transported into a cure chamber (11) comprising an ultraviolet lamp (12) and a heating element (13). A moveable heat-shielding member (3) is temporary present between the objects (5) and the heating element (13) during at least the first part of the irradiation treatment. Preferably, the heat-shielding member (3) is positioned outside the cure chamber (11) during a part of the curve treatment.Type: GrantFiled: August 4, 2003Date of Patent: September 18, 2007Assignee: Koninklijke Philips Electronics N.V.Inventors: Henricus Godefridus Rafael Maas, Theodorus Martinus Michielsen, Richard Jozef Maria Waelen
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Patent number: 6775350Abstract: A method of examining a wafer of crystalline semiconductor material by means of X-rays, in which method a surface of the wafer is scanned by means of an X-ray beam and secondary radiation generated by said X-ray beam is detected. Prior to the examination the surface of the wafer which is to be scanned by the X-ray beam during the examination is glued to a substrate, after which crystalline semiconductor material is removed at the side which is then exposed, removal taking place as far as the top layer which adjoins the surface. The top layer can thus be examined without the examination being affected by crystal defects or impurities present in layers of the wafer which are situated underneath the top layer.Type: GrantFiled: September 13, 2002Date of Patent: August 10, 2004Assignee: Koninklijke Philips Electronics N.V.Inventors: Catharina Huberta Henrica Emons, Henricus Godefridus Rafael Maas, Theodorus Martinus Michielsen, Ronald Dekker, Antonius Johannes Janssen, Ingrid Annemarie Rink
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Patent number: 6762510Abstract: A flexible monolithic integrated circuit which is essentially formed from flexible circuit elements, connecting elements between the flexible circuit elements, and a flexible coating which comprises at least one layer of a coating material comprising a polymer, is suitable as a small and convenient integrated circuit for electronic devices on flexible data carriers for the logistic tracking of objects and persons. The invention also relates to a method of manufacturing a flexible integrated monolithic circuit whereby integrated monolithic circuit elements and connecting elements are formed in and on a semiconductor substrate, the main surface of the integrated circuit elements facing away from the semiconductor substrate are coated with a polymer resin, and the semiconductor substrate is removed. The method is based on conventional process steps in semiconductor technology and leads to a flexible integrated monolithic circuit in a small number of process steps.Type: GrantFiled: May 8, 2002Date of Patent: July 13, 2004Assignee: Koninklijke Philips Electronics N.V.Inventors: Johann-Heinrich Fock, Wolfgang Schnitt, Hauke Pohlmann, Andreas Gakis, Michael Burnus, Martin Schaefer, Henricus Godefridus Rafael Maas, Theodorus Martinus Michielsen, Ronald Dekker
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Publication number: 20030057525Abstract: A flexible monolithic integrated circuit which is essentially formed from flexible circuit elements, connecting elements between the flexible circuit elements, and a flexible coating which comprises at least one layer of a coating material comprising a polymer, is suitable as a small and convenient integrated circuit for electronic devices on flexible data carriers for the logistic tracking of objects and persons.Type: ApplicationFiled: May 8, 2002Publication date: March 27, 2003Inventors: Johann-Heinrich Fock, Wolfgang Schnitt, Hauke Pohlmann, Andreas Gakis, Michael Burnus, Martin Schaefer, Henricus Godefridus Rafael Maas, Theodorus Martinus Michielsen, Ronald Dekker
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Publication number: 20030053590Abstract: A method of examining a wafer of crystalline semiconductor material by means of X-rays, in which method a surface of the wafer is scanned by means of an X-ray beam and secondary radiation generated by said X-ray beam is detected. Prior to the examination the surface of the wafer which is to be scanned by the X-ray beam during the examination is glued to a substrate, after which crystalline semiconductor material is removed at the side which is then exposed, removal taking place as far as the top layer which adjoins the surface. The top layer can thus be examined without the examination being affected by crystal defects or impurities present in layers of the wafer which are situated underneath the top layer.Type: ApplicationFiled: September 13, 2002Publication date: March 20, 2003Inventors: Catharina Huberta Henrica Emons, Henricus Godefridus Rafael Maas, Theodorus Martinus Michielsen, Ronald Dekker, Antonius Johannes Janssen, Ingrid Annemarie Rink