Abstract: A variety of circuits, methods and devices are implemented for radiofrequency amplifiers. According to one such implementation, a radiofrequency amplifier circuit is implemented in a SMD package. The circuit amplifies a radiofrequency signal having a base-band portion and a plurality of carrier signals frequency-spaced larger than the base-band bandwidth. The circuit includes a radiofrequency transistor connected to a circuit output having a parasitic output capacitance. The source-drain terminal is electrically connected to the circuit output. An internal shunt inductor provides compensation for the parasitic output capacitance. A high-density capacitor is connected between the internal shunt inductor and a circuit ground. The high-density capacitor has a terminal with a surface area can be at least ten times that of a corresponding planar surface.

Abstract: A variety of circuits, methods and devices are implemented for radiofrequency amplifiers. According to one such implementation, a radiofrequency amplifier circuit is implemented in a SMD package. The circuit amplifies a radiofrequency signal having a base-band portion and a plurality of carrier signals frequency-spaced larger than the base-band bandwidth. The circuit includes a radiofrequency transistor connected to a circuit output having a parasitic output capacitance. The source-drain terminal is electrically connected to the circuit output. An internal shunt inductor provides compensation for the parasitic output capacitance. A high-density capacitor is connected between the internal shunt inductor and a circuit ground. The high-density capacitor has a terminal with a surface area can be at least ten times that of a corresponding planar surface.

Abstract: A RF amplifier device (22) including an amplifier element (24) compensated by a compensating circuit (26, 28) with respect to its output capacitance and frequency decoupled from its power supply (26), wherein the decoupling circuit is directly connected to the compensating circuit (26, 28) and a RF amplifier device including an amplifier element (56, 80) and a compensating circuit comprising an internal shunt inductor having a compensating inductance (58, 60, 62) and a compensating capacitance (64, 92) and arranged in parallel to a terminal of the amplifier element (56, 80) to compensate a terminal capacitance of the amplifier element (56, 80), and a decoupling and power supply lead (76, 98) which is connected to the compensating capacitance (64, 92) and/or a decoupling circuit (100) and/or a combination of the compensating capacitance and the decoupling circuit (130) and a module thereof and a method for decoupling the mentioned RF amplifier device.