Abstract: A method and an electronic assembly for attaching a component to a substrate, or printed circuit board, is recited. The printed circuit board comprises a solder-nonwettable surface and a bond pad being formed of a solder-wettable surface. The printed circuit board defines a through hole extending through the printed circuit board and the bond pad. A plate lining a first portion of the through hole in the printed circuit board is formed of a solder-wettable material. Solder paste is applied to the bond pad and into the through hole. A component including a terminal overlies the bond pad in an arrangement. Reflowing the solder paste forms a solder fillet that bonds the terminal to the bond pad. The solder fillet extends within the through hole attaching the component to the printed circuit board.

Abstract: A method and assembly for preserving solder connections of components mounted on a thin laminate circuit board during wave soldering of leaded components to the circuit board. The method generally entails supporting the circuit board on a pallet with pedestals that contact the surface of the circuit board directly opposite surface-mount components on the board. The pallet also includes an access directly opposite leaded components assembled to the board so that their leads are exposed. The pallet and board assembly are then placed on a wave soldering apparatus and wave soldered while applying and maintaining a force to the circuit board that ensures contact between the pedestals and the surface of the board opposite the surface-mount components, so that the leads of the leaded components are soldered to the circuit board.