Patents by Inventor Theresa M. Besozzi

Theresa M. Besozzi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME
    Publication number: 20240023242
    Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
    Type: Application
    Filed: September 21, 2023
    Publication date: January 18, 2024
    Inventors: Jennifer ADAMCHUK, Gerard T. BUSS, Theresa M. BESOZZI
  • Dielectric substrate and method of forming the same
    Patent number: 11805600
    Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
    Type: Grant
    Filed: January 23, 2023
    Date of Patent: October 31, 2023
    Assignee: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
    Inventors: Jennifer Adamchuk, Gerard T. Buss, Theresa M. Besozzi
  • Dielectric substrate and method of forming the same
    Patent number: 11596064
    Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: February 28, 2023
    Assignee: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
    Inventors: Jennifer Adamchuk, Gerard T. Buss, Theresa M. Besozzi
  • COPPER-CLAD LAMINATE AND METHOD OF FORMING THE SAME
    Publication number: 20220039256
    Abstract: The present disclosure relates to a copper-clad laminate that may include a copper foil layer and a dielectric coating overlying the copper foil layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.
    Type: Application
    Filed: July 26, 2021
    Publication date: February 3, 2022
    Inventors: Jennifer ADAMCHUK, Gerard T. Buss, Theresa M. Besozzi
  • DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME
    Publication number: 20220039254
    Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
    Type: Application
    Filed: July 26, 2021
    Publication date: February 3, 2022
    Inventors: Jennifer ADAMCHUK, Gerard T. BUSS, Theresa M. BESOZZI
  • DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME
    Publication number: 20220033617
    Abstract: The present disclosure relates to a dielectric substrate that may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.
    Type: Application
    Filed: July 26, 2021
    Publication date: February 3, 2022
    Inventors: Jennifer ADAMCHUK, Gerard T. Buss, Theresa M. Besozzi
  • Reclaimed Wafer And A Method For Reclaiming A Wafer
    Publication number: 20140084422
    Abstract: Embodiments of the present invention relate to a reclaimed wafer, a method for reclaiming a wafer, a method for reclaiming a batch of wafers, and a method for forming electronic structures. After being reclaimed, the reclaimed wafers are essentially free of a residue.
    Type: Application
    Filed: September 12, 2013
    Publication date: March 27, 2014
    Inventors: Tigran Dolukhanyan, George Glavin, Christopher D. Jones, Maureen A. Brosnan, Theresa M. Besozzi