Abstract: A pan includes a base, a sidewall, and a lip. The sidewall extends from and around a first periphery of the base. The base and the sidewall cooperatively define a cavity. The lip extends from and at least partially along a second periphery of an end of the sidewall opposite the base. The lip has a first portion and a second portion. The first portion of the lip is configured to engage a third portion of a second pan when the pan and the second pan are in a nested arrangement such that engagement between the first portion of the lip and the third portion of the second pan forms an air gap between the pan and the second pan when in the nested arrangement.

Abstract: A pan includes a base, a sidewall, and a lip. The sidewall extends from and around a first periphery of the base. The base and the sidewall cooperatively define a cavity. The lip extends from and at least partially along a second periphery of an end of the sidewall opposite the base. The lip has a first portion and a second portion. The first portion of the lip is configured to engage a third portion of a second pan when the pan and the second pan are in a nested arrangement such that engagement between the first portion of the lip and the third portion of the second pan forms an air gap between the pan and the second pan when in the nested arrangement.

Abstract: The present invention comprises three-terminal molecules devices that provide an electronic switching or modulation function in response to an electric field that is optimally directed normally to the length of the molecule or molecules which form the conductive path between tow electrodes. This invention also provides synthetic routes that can be implemented to realize these devices using top-down and bottom-up fabrication approaches that are compatible with ultra-high density integration onto substrates.

Abstract: This invention is directed toward a process of manufacturing, including a technique of assembling parts of an apparatus. The technique includes forming electrode structures on a substrate, suspending the apparatus part or parts in a dielectric medium between electrodes of the electrode structure, and using near-field (that is, short range) electric field forces to align the part or parts in pre-determined positions in accordance with the desired apparatus topography. The part or parts may include semiconductor die, nanometer wires for making connections to devices, or other components requiring precision alignment.