Abstract: A chip assembly configuration includes an substrate with an integrated circuit on one side and a conversion mechanism on the other side. The integrated circuit and the conversion mechanism are electrically coupled by a short electrical transmission line through the substrate. Moreover, the conversion mechanism converts signals between an electrical and an optical domain, thereby allowing high-speed communication between the integrated circuit and other components and devices using optical communication (for example, in an optical fiber or an optical waveguide).

Abstract: An optical interconnect is provided that optically connects two adjacent printed circuit boards, or electrical component. The optical interconnect includes a floating frame which is flexibly connected to one electrical component. The floating frame includes a plurality of optical guides. The optical guides are connected to the electrical component either electronically or optically. A second frame, coupled to a second electrical component also contains a plurality of optical guides. A mechanical guide assembly positions the first frame and the second frame are optically coupled. The optical guide in the second frame connects to the second electrical component providing a path for a signal from the first electrical component to the second electrical component.