Abstract: A press-fit insertion method is provided. The press-fit insertion method includes loading press-fit pins into a connector, heating a printed circuit board (PCB) defining plated through holes (PTHs) into which the press-fit pins are insertable and pressing the connector onto the PCB to insert the press-fit pins into the PTHs with the PCB remaining heated.

Abstract: A press-fit insertion method is provided. The press-fit insertion method includes loading press-fit pins into a connector, heating a printed circuit board (PCB) defining plated through holes (PTHs) into which the press-fit pins are insertable and pressing the connector onto the PCB to insert the press-fit pins into the PTHs with the PCB remaining heated.

Abstract: An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.

Abstract: Aspects of the invention include a stutter step press-fit connector insertion process. A non-limiting example of a method includes applying a force to at least one press-fit pin for causing the press-fit pin to move in a direction of a through-hole of a printed circuit board, wherein a value of the force increases as the press-fit pin moves in the direction of the through-hole. In response to detecting contact between the press-fit pin and a surface profile of the through-hole, a first pause of the force is introduced for a pre-determined time interval, wherein the value of the force remains generally static during the pre-determined time interval. The force is reapplied to the press-fit pin upon completion of the time interval, wherein the value of the force increases during the reapplying until the press-fit pin is inserted into the through-hole.

Abstract: Embodiments of the invention include a dye and pry process for removing a surface mount technology (SMT) dual in-line memory module (DIMM) from card assemblies. Aspects of the invention include immersing a semiconductor package assembly in a solution comprising dye and placing the immersed semiconductor package assembly under vacuum pressure. Vacuum conditions ensure that the dye solution is pulled into any cracks in the solder formed between the semiconductor package assembly and the SMT DIMM. The package assembly is dried, and a dummy card stock is installed in the SMT DIMM using an epoxy. The SMT DIMM is then removed by applying a force to an exposed cavity between the dummy card stock and the semiconductor package assembly. The semiconductor package assembly and the SMT DIMM can then be inspected for the dye to locate cracks.

Abstract: A press-fit insertion method is provided. The press-fit insertion method includes loading press-fit pins into a connector, heating a printed circuit board (PCB) defining plated through holes (PTHs) into which the press-fit pins are insertable and pressing the connector onto the PCB to insert the press-fit pins into the PTHs with the PCB remaining heated.

Abstract: Provided is a system for removing an electronic component from a printed circuit board (PCB). The system may comprise a heating well configured to hold a rework liquid. The system may further comprise a head system configured to create a liquid-tight seal around an electronic component. The system may further comprise a nozzle and a mechanical capture device disposed within the head system. The mechanical capture device may be configured to attach to the electronic component. The system may further comprise a controller. The controller may be configured to release the rework liquid through the nozzle and onto the electronic component and lift the electronic component off the PCB.

Abstract: A method comprises inserting a press-fit element into a through hole on a substrate board. The method also comprises obtaining a target heat-application plan for the press-fit element. The method also comprises applying heat to the press-fit element. The method also comprises determining that the target heat-application plan has been completed. The method also comprises withdrawing heat from the press-fit element.

Abstract: Aspects of the invention include a stutter step press-fit connector insertion process. A non-limiting example of a method includes applying a force to at least one press-fit pin for causing the press-fit pin to move in a direction of a through-hole of a printed circuit board, wherein a value of the force increases as the press-fit pin moves in the direction of the through-hole. In response to detecting contact between the press-fit pin and a surface profile of the through-hole, a first pause of the force is introduced for a pre-determined time interval, wherein the value of the force remains generally static during the pre-determined time interval. The force is reapplied to the press-fit pin upon completion of the time interval, wherein the value of the force increases during the reapplying until the press-fit pin is inserted into the through-hole.

Abstract: Aspects of the invention include an apparatus to aid a surface mount connection process including a barrier, a substrate in a facing spaced relationship with the barrier, a hybrid land grid array (LGA) socket interposed between the barrier and the substrate, and at least one fastening mechanism securing the barrier to the substrate at a selected distance such that a gap is formed between the barrier and the hybrid LGA socket.

Abstract: Embodiments of the invention include a dye and pry process for removing a surface mount technology (SMT) dual in-line memory module (DIMM) from card assemblies. Aspects of the invention include immersing a semiconductor package assembly in a solution comprising dye and placing the immersed semiconductor package assembly under vacuum pressure. Vacuum conditions ensure that the dye solution is pulled into any cracks in the solder formed between the semiconductor package assembly and the SMT DIMM. The package assembly is dried, and a dummy card stock is installed in the SMT DIMM using an epoxy. The SMT DIMM is then removed by applying a force to an exposed cavity between the dummy card stock and the semiconductor package assembly. The semiconductor package assembly and the SMT DIMM can then be inspected for the dye to locate cracks.

Abstract: An interposer comprises a metal-plated via that spans the depth of a printed circuit board. The interposer also comprises a metal plug inserted into a first end of the metal-plated via. The metal plug is attached to the metal-plated via. The metal plug may take the form of a solid plug or a sintered via plug. The interposer also comprises a solder ball soldered to the metal plug.

Abstract: The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.

Abstract: The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.

Abstract: The illustrative embodiments provide a method for manufacturing a socket and attaching the socket to a printed circuit board. Surface mounted contacts for a bottom surface of a socket are provided. The surface mounted contacts are a plurality of conductive metal pads that directly attach to surface connections on a printed circuit board. An elongated housing is formed comprising at least two members that are coupled together and disposed to form an aperture in between the at least two members. At least one dimension of the at least two members is selected to compensate for a difference between coefficients of thermal expansion between the socket and the printed circuit board. The at least two members and the surface mounted contacts are aligned with the printed circuit board using a clip. In response to completing a solder reflow process, the clip is removed and a module is inserted into the aperture.

Abstract: The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.

Abstract: The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.

Abstract: The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.