Abstract: An electroless nickel or cobalt plating solution, comprising nickel ions or cobalt ions, Ti3+ ions as reducing agent for reducing said nickel ions and cobalt ions, at least one accelerator selected from the group consisting of sulfites, dithionites, thiosulfates, tetrathionates, polythionates, disulfites, sulfides, disulfide, polysulfide, elemental sulfur and mixtures thereof; and one or more than one complexing agent, wherein the pH value of the plating solution is from 5 to 10.5.