Patents by Inventor Thiam Lim

Thiam Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked Die in Die BGA Package
    Publication number: 20080096316
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: December 18, 2007
    Publication date: April 24, 2008
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Stacked Die in Die BGA Package
    Publication number: 20080032449
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: October 15, 2007
    Publication date: February 7, 2008
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Bioabsorbable plug implants and method for bone tissue regeneration
    Publication number: 20070083268
    Abstract: A bioabsorbable plug implant, suitable for bone tissue regeneration, comprising a first portion, and a second portion extending outwardly from the first portion, the first and second portions formed from expandable material. A method for bone tissue regeneration comprising the steps of: providing a bioabsorbable plug implant, wherein the implant comprises a first portion and a second portion extending outwardly from the first portion, the first and second portions formed from expandable material; inserting the second portion into a defect or gap of a bone, the first surface engaging the outside contour of the defect or gap; allowing the plug implant to contact body fluids, thereby expanding the size of the plug implant so that the plug fits into the defect or gap.
    Type: Application
    Filed: November 22, 2004
    Publication date: April 12, 2007
    Applicant: Osteopore International Pte Ltd
    Inventors: Swee Teoh, Kim Cheng Tan, Dietmar Hutmacher, Thiam Lim, Jan-Thorsten Schantz, Ning Chou
  • Stacked die in die BGA package
    Publication number: 20060292743
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: August 29, 2006
    Publication date: December 28, 2006
    Applicant: Micron Technolgoy, Inc.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Stacked die in die BGA package
    Publication number: 20060292745
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: August 29, 2006
    Publication date: December 28, 2006
    Applicant: Micron Technology, Inc.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Stacked die in die BGA package
    Publication number: 20060292746
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: August 29, 2006
    Publication date: December 28, 2006
    Applicant: Micron Technology, Inc.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Stacked die in die BGA package
    Publication number: 20060216864
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: May 25, 2006
    Publication date: September 28, 2006
    Applicant: Micron Technology, Inc.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour