Abstract: A modular instrumentation chassis includes a backplane PCB; multiple slots located on the backplane PCB and configured to receive multiple insertable modules, respectively; an AC-DC power supply configured to generate an isolated DC output voltage; and multiple DC-DC switching regulator units corresponding to the multiple of slots, respectively, each DC-DC switching regulator unit separately receiving the isolated DC output voltage from the AC-DC power supply. Each DC-DC switching regulator unit includes at least one DC-DC switching regulator configured to convert the received isolated DC output voltage to at least one different DC voltage, respectively, available to the slot of the multiple slots corresponding to the DC-DC switching regulator unit. A switching frequency of the at least one DC-DC switching regulator in each DC-DC switching regulator unit is separately adjustable to provide the at least one different DC voltage.

Abstract: A modular instrumentation chassis includes a backplane PCB; multiple slots located on the backplane PCB and configured to receive multiple insertable modules, respectively; an AC-DC power supply configured to generate an isolated DC output voltage; and multiple DC-DC switching regulator units corresponding to the multiple of slots, respectively, each DC-DC switching regulator unit separately receiving the isolated DC output voltage from the AC-DC power supply. Each DC-DC switching regulator unit includes at least one DC-DC switching regulator configured to convert the received isolated DC output voltage to at least one different DC voltage, respectively, available to the slot of the multiple slots corresponding to the DC-DC switching regulator unit. A switching frequency of the at least one DC-DC switching regulator in each DC-DC switching regulator unit is separately adjustable to provide the at least one different DC voltage.

Abstract: An apparatus comprises a printed circuit board (PCB) having a first surface and a second surface, a plurality of blind press-fit vias penetrating the first surface and extending partially through the PCB toward the second surface, the blind press-fit vias configured to receive press-fit connectors of at least one component to be connected to the PCB, and a plurality of electrical connectors disposed in a region of the second surface opposite the blind press-fit vias and configured to interface with one or more signal processing components disposed on the second surface.

Abstract: An apparatus comprises a printed circuit board (PCB) having a first surface and a second surface, a plurality of blind press-fit vias penetrating the first surface and extending partially through the PCB toward the second surface, the blind press-fit vias configured to receive press-fit connectors of at least one component to be connected to the PCB, and a plurality of electrical connectors disposed in a region of the second surface opposite the blind press-fit vias and configured to interface with one or more signal processing components disposed on the second surface.