Abstract: A semiconductor package is disclosed. In one embodiment the package includes comprises a semiconductor chip including an active surface with a plurality of chip contact areas and a package substrate including a plurality of first contact areas and a plurality of second contact areas on its bottom surface. The chip is mounted on the package substrate with its active surface facing the package substrate. A plurality of conducting means provide electrical contact between the chip contact areas and the first contact areas. A heat spreading means comprises a planar area and at least one protrusion. The planar area is attached to the upper surface of the chip and the protrusion is attached to the upper surface of the package substrate.