Abstract: A support stand apparatus and method to elevate an electronic device above a flat surface to enhance heat dissipation and cooling is provided. The support stand apparatus includes a base member with a top face having a concave surface and a bottom face having a slot, a magnet disposed within the slot and coupled to the base member, a metallic member detachably coupled to a bottom portion of the electronic device and having a convex surface. The base member is oriented to permit the concave surface of the top face to receive the convex surface of the metallic member to support the electronic device in an elevated position above the flat surface.