Abstract: An integrated circuit card with two connection modes. The integrated circuit card includes a card body in which there is embedded a link circuit for linking a contactless coupling element (1) to a module having an integrated circuit (6) connected to conductive areas carried by a support film (4). The link circuit extends in register with conductive areas (18) dedicated to making a contactless link and is connected to said conductive areas by an electrically conductive material (32, 36, 42) filling blind holes (31, 35, 41). The blind holes have sections that increase from a bottom of each hole towards an opening thereof over at least a portion of their height.

Abstract: The chip of an invention for an electronic circuit card comprises a semiconductor microplate having an active face provided with contact pads and on which projections are formed of different heights. The active face of the microplate is coated, at least in part, in a layer of insulating material having a thickness that is greater than or equal to the height of the highest projection, said layer being shaped so as to give free access to the contact pads and having an outer face parallel to the periphery of the active face of the microplate. The layer enables the chip to be implanted in a card body while remaining accurately parallel thereto, which is essential to enable conductive tracks to be made subsequently by silk-screen printing.