Patents by Inventor Thierry Du

Thierry Du has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of thinning a semiconductor die
    Patent number: 12341130
    Abstract: A method for thinning a semiconductor die includes providing the semiconductor die having electrical contacts electrically connected to and protruding from a top surface of the semiconductor die. The electrical contacts are spaced from one another on the top surface of the semiconductor die. The electrical contacts are encapsulated and a portion of the top surface of the semiconductor die is covered by a semisolid filler. The semisolid filler fills the space between the electrical contacts. An adhesive layer is applied to a top surface of the semisolid filler, and a backgrinding process is performed on a bottom surface of the semiconductor die. The method allows for thin semiconductor dies to be manufactured while reducing the risk of manufacturing defects associated with backgrinding.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: June 24, 2025
    Assignee: Western Digital Technologies, Inc.
    Inventors: Meiqin Hao, Izzie Zhang, Elley Zhang, Thierry Du, Maggie Deng, Bo Fu, Caiden Zhong
  • Method of Thinning a Semiconductor Die
    Publication number: 20230326906
    Abstract: A method for thinning a semiconductor die includes providing the semiconductor die having electrical contacts electrically connected to and protruding from a top surface of the semiconductor die. The electrical contacts are spaced from one another on the top surface of the semiconductor die. The electrical contacts are encapsulated and a portion of the top surface of the semiconductor die is covered by a semisolid filler. The semisolid filler fills the space between the electrical contacts. An adhesive layer is applied to a top surface of the semisolid filler, and a backgrinding process is performed on a bottom surface of the semiconductor die. The method allows for thin semiconductor dies to be manufactured while reducing the risk of manufacturing defects associated with backgrinding.
    Type: Application
    Filed: April 8, 2022
    Publication date: October 12, 2023
    Applicant: Western Digital Technologies, Inc.
    Inventors: Meiqin Hao, Izzie Zhang, Elley Zhang, Thierry Du, Maggie Deng, Bo Fu, Caiden Zhong