Abstract: The invention relates to a process for manufacturing a piezoelectric component and to the component resulting from such a process.According to the invention, the manufacturing process comprises the stacking of at least one piezoelectric element (1) and of at least two metallic electrodes (2), each piezoelectric element (1) being inserted between two metallic electrodes (2), characterized in that each piezoelectric element and each metallic electrode is produced, respectively, by coiling a piezoelectric film and by coiling a metallized film.

Abstract: A method of producing at least one non-metallized strip on metallized flexible plastic film rolls and a method of producing stacked or wound capacitors using such rolls.One feature of the process of producing at least one non-metallized strip is that the said non-metallized strip is produced by a laser beam applied to the lateral face of a roll at a non-zero angle of incidence .alpha..

Abstract: In a method for the manufacture of stacked or wound type capacitors, made by the stacking and cutting out into unit blocks or by the winding of metallized polyethylene naphthalene films, at least after the stacking phase for the stacked type capacitors or the winding phase for the wound type capacitors, the capacitors are subjected to at least one annealing operation at a temperature of 240.degree. C. to 295.degree. C. for a period of at least one hour. The method can be applied notably to the making of chip capacitors for SMC mounting.

Abstract: A device for positioning at least one masking strip in a machine for metallizing wide film, enabling a film to be obtained with metallized zones and non-metallized zones. This device has at least two rollers with smooth surfaces which drive the masking strips, and are positioned to bring the masking strips over the film during the metallization. At least one comb is mounted near the metallization site to position and guide the masking strips over the film. The invention applies to machines for metallizing plastic films used, for example, in the manufacture of chip-type capacitors.

Abstract: A stacked or coiled type of metallized flexible dielectric film capacitor is made by the direct superimposition of at least two metallized films, laterally offset with respect to one another so as to form alternating even-order and odd-order layers, designed to be connected to one another by lateral electrical connections. One of the faces of the films is entirely metallized and the gap between two same-order layers is filled with an insulator material itself covered by the lateral electrical connections.