Abstract: The invention relates to a method for producing a module having an electronic chip including metallizations which are accessible from a first side of the metallizations and an integrated circuit chip which is arranged on the second side of the metallizations, opposite the first side. The method comprises the step of forming electrical interconnection elements which are separate from the metallizations, directly connecting the chip, and are arranged on the second side of the metallizations. The invention also relates to a module corresponding to the method and to a device comprising said module.

Abstract: The invention relates to a method for producing a module having an electronic chip including metallisations which are accessible from a first side of the metallisations and an integrated circuit chip which is arranged on the second side of the metallisations, opposite the first side. The method comprises the step of forming electrical interconnection elements which are separate from the metallisations, directly connecting the chip, and are arranged on the second side of the metallisations. The invention also relates to a module corresponding to the method and to a device comprising said module.

Abstract: The present invention relates to a smart card comprising a card body and an electronic module placed within a recess of the card body and further comprising at least one colored layer placed between the electronic module and the bottom of the recess of the card body.

Abstract: The present invention relates to a smart card comprising a card body and an electronic module placed within a recess of the card body and further comprising at least one coloured layer placed between the electronic module and the bottom of the recess of the card body.

Abstract: The invention generally relates to devices comprising semiconductor chips. More specifically, the invention relates to an electronic module (1) comprising at least one integrated circuit chip (10) which is connected to the conductor tracks of an insulating support and at least one light-emitting diode (16). According to one aspect of the invention, the assembly formed by the integrated circuit (10) and the light-emitting diode (16) is coated with a translucent resin (32), thereby forming an element for the mechanical protection of the assembly and for the transmission of the light emitted by the diode (16). According to another aspect of the invention, the coated assembly comprises at least one indicator light (LED) and a radio-frequency coil (preferably in the module).

Abstract: In a method for producing a portable electronic device with an integrated circuit, a resin band is deposited around the chip of an integrated circuit and connection wires. The resin is highly viscous and can be polymerized with U.V. radiation. A low-viscosity filling resin which can be polymerized with U.V. radiation is deposited in the space defined by the resin band, and the protected resins are polymerized by exposure to U.V. radiation. The filling resin contains mechanically reinforcing fibers. The entire process can be carried out in a continuous manner.