Patents by Inventor Thierry Lazerand

Thierry Lazerand has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for plasma dicing a semi-conductor wafer
    Patent number: 9343365
    Abstract: The present invention provides a method for plasma processing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing at least two cutting regions on the substrate, the cutting regions being positioned between all adjacent device structures on the substrate; generating a plasma using the plasma source; and processing the work piece using the generated plasma.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: May 17, 2016
    Assignee: Plasma-Therm LLC
    Inventors: Thierry Lazerand, David Pays-Volard, Linnell Martinez, Chris Johnson, Russell Westerman, Gordon M. Grivna
  • Method and apparatus for plasma dicing a semi-conductor wafer
    Patent number: 9202737
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising: providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate on a carrier support to form a work piece; providing an intermediate ring interposed between the substrate and the frame; loading the work piece onto the work piece support; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: December 1, 2015
    Assignee: Plasma-Therm LLC
    Inventors: Rich Gauldin, Dwarakanath Geerpuram, Ken Mackenzie, Thierry Lazerand, David Pays-Volard, Linnell Martinez, Russell Westerman, Gordon M. Grivna, Jason Doub
  • Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
    Publication number: 20150270154
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising: providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate on a carrier support to form a work piece; providing an intermediate ring interposed between the substrate and the frame; loading the work piece onto the work piece support; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Application
    Filed: June 2, 2015
    Publication date: September 24, 2015
    Applicant: PLASMA-THERM LLC
    Inventors: Rich Gauldin, Dwarakanath Geerpuram, Ken Mackenzie, Thierry Lazerand, David Pays-Volard, Linnell Martinez, Russell Westerman, Gordon M. Grivna, Jason Doub
  • Method and apparatus for plasma dicing a semi-conductor wafer
    Patent number: 9082839
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising: providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate on a carrier support to form a work piece; providing an intermediate ring interposed between the substrate and the frame; loading the work piece onto the work piece support; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: July 14, 2015
    Assignee: Plasma-Therm LLC
    Inventors: Rich Gauldin, Dwarakanath Geerpuram, Ken Mackenzie, Thierry Lazerand, David Pays-Volard, Linnell Martinez, Russell Westerman, Gordon M. Grivna, Jason Doub
  • Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
    Publication number: 20140242780
    Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising: providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate on a carrier support to form a work piece; providing an intermediate ring interposed between the substrate and the frame; loading the work piece onto the work piece support; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
    Type: Application
    Filed: March 7, 2014
    Publication date: August 28, 2014
    Applicant: Plasma-Therm LLC
    Inventors: Rich Gauldin, Dwarakanath Geerpuram, Ken Mackenzie, Thierry Lazerand, Davis Pays-Volard, Linnell Martinez, Russell Westerman, Gordon M. Grivna, Jason Doub
  • Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
    Publication number: 20130344683
    Abstract: The present invention provides a method for plasma processing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing at least two cutting regions on the substrate, the cutting regions being positioned between all adjacent device structures on the substrate; generating a plasma using the plasma source; and processing the work piece using the generated plasma.
    Type: Application
    Filed: August 29, 2013
    Publication date: December 26, 2013
    Applicant: Plasma-Therm LLC
    Inventors: Thierry Lazerand, David Pays-Volard, Linnell Martinez, Chris Johnson, Russell Westerman