Patents by Inventor Thierry Ligozat

Thierry Ligozat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11785354
    Abstract: A CMOS image sensor for a code reader in an optical code recognition system incorporates a digital processing circuit that applies a calculation process to the capture image data as said data acquired by the sequential readout circuit of the sensor, in order to calculate a macro-image from the capture image data, which corresponds to location information of code(s) in the capture image, and transmit this macro-image in the image frame following the capture image data, in the footer of the frame.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: October 10, 2023
    Assignee: TELEDYNE E2V SEMICONDUCTORS SAS
    Inventors: Bruno Diasparra, Thierry Ligozat, Romain Guiguet, Gareth Powell, Jérôme Vanrumbeke, Arnaud Foucher
  • Publication number: 20210392285
    Abstract: A CMOS image sensor for a code reader in an optical code recognition system incorporates a digital processing circuit that applies a calculation process to the capture image data as said data acquired by the sequential readout circuit of the sensor, in order to calculate a macro-image from the capture image data, which corresponds to location information of code(s) in the capture image, and transmit this macro-image in the image frame following the capture image data, in the footer of the frame.
    Type: Application
    Filed: October 28, 2019
    Publication date: December 16, 2021
    Inventors: Bruno DIASPARRA, Thierry LIGOZAT, Romain GUIGUET, Gareth POWELL, Jérôme VANRUMBEKE, Arnaud FOUCHER
  • Patent number: 10896303
    Abstract: The invention provides a method for acquiring an image of a target code, which allows the CMOS sensor, after the reader has been triggered to acquire a target code, to rapidly determine, and internally, a desirable exposure-time value Topt for the image capture of this code.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: January 19, 2021
    Assignee: TELEDYNE E2V SEMICONDUCTORS SAS
    Inventors: Thierry Ligozat, Bruno Diasparra, Stéphane Gesset, Gareth Powell
  • Publication number: 20200394373
    Abstract: The invention provides a method for acquiring an image of a target code, which allows the CMOS sensor, after the reader has been triggered to acquire a target code, to rapidly determine, and internally, a desirable exposure-time value Topt for the image capture of this code.
    Type: Application
    Filed: August 24, 2018
    Publication date: December 17, 2020
    Applicant: Teledyne e2v Semiconductors SAS
    Inventors: Thierry LIGOZAT, Bruno DIASPARRA, Stéphane GESSET, Gareth POWELL
  • Publication number: 20200313842
    Abstract: Method for synchronizing digital data sent in series by a transmitter having a clock frequency freq1 to a receiver having a clock frequency freq2, comprising the steps a) to d) iterated until a stoppage condition is met and a step e): a) sending a digital datum from the transmitter to the receiver; b) generating N channels, each ith channel containing the datum, and being time shifted with respect to the (i?1)th channel, with N?3 and 2<i<N; c) sampling the N channels at the frequency freq2; d) comparing the N channels in groups of (2m+1) successive channels, m?1 and such that (2m+1)?N, and selecting groups of (2m+1) channels in which the data of these channels are identical in each iteration; e) selecting a channel belonging to the selected groups, the data contained in this channel being considered to be synchronized and in phase with the receiver and defining a variable P equal to the value i of the selected channel.
    Type: Application
    Filed: March 27, 2020
    Publication date: October 1, 2020
    Inventors: Quentin BERAUD-SUDREAU, Thierry LIGOZAT
  • Patent number: 10665624
    Abstract: The invention provides a linear sensor including a row 100 of N regularly spaced pixels that are formed in a semiconductor substrate, and a circuit for reading out the N pixels, which delivers an output signal for each of the N pixels of the row, characterized in that the N pixels comprise image-capturing pixels that have a useful photosensitive area in the shape of a rectangle R that is higher than it is wide, where the width is in the direction of the row and the height is in the perpendicular direction, and at least two spaced-apart pairs of alignment-detecting pixels PPL, PPR, wherein the detecting pixels of each pair are pixels P1, P2 that are adjacent in the row 100 of pixels and the useful photosensitive area DT1, DT2 of the detecting pixels has a width that varies monotonically in the height direction, but in opposite directions for the two detecting pixels of a given pair.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: May 26, 2020
    Assignee: TELEDYNE E2V SEMICONDUCTORS SAS
    Inventors: Thierry Ligozat, Bruno Gili, Romain Guiguet, Franck Tellier, Norman Mangeret
  • Publication number: 20190165015
    Abstract: The invention provides a linear sensor including a row 100 of N regularly spaced pixels that are formed in a semiconductor substrate, and a circuit for reading out the N pixels, which delivers an output signal for each of the N pixels of the row, characterized in that the N pixels comprise image-capturing pixels that have a useful photosensitive area in the shape of a rectangle R that is higher than it is wide, where the width is in the direction of the row and the height is in the perpendicular direction, and at least two spaced-apart pairs of alignment-detecting pixels PPL, PPR, wherein the detecting pixels of each pair are pixels P1, P2 that are adjacent in the row 100of pixels and the useful photosensitive area DT1, DT2 of the detecting pixels has a width that varies monotonically in the height direction, but in opposite directions for the two detecting pixels of a given pair.
    Type: Application
    Filed: June 20, 2017
    Publication date: May 30, 2019
    Inventors: Thierry LIGOZAT, Bruno GILI, Romain GUIGUET, Franck TELLIER, Norman MANGERET
  • Patent number: 10128298
    Abstract: The invention relates to color-image sensors. To benefit both from a good luminance resolution and a color accuracy that is not excessively degraded by the sensitivity of silicon to near-infrared radiation, the invention proposes to produce a mosaic of pixels comprising colored pixels (R), (G), (B), coated with color filters, which are distributed in the matrix, with white pixels (T) not coated with color filters and which are distributed in the matrix. The colored pixels include photodiodes constructed differently from the photodiodes of the white pixels, the different construction being such that the photodiodes of the colored pixels have a lower sensitivity to infrared radiation than the photodiodes of the white pixels.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: November 13, 2018
    Assignee: TELEDYNE E2V SEMICONDUCTORS SAS
    Inventors: Pierre Fereyre, Frédéric Mayer, Pascal Douine, Thierry Ligozat, Vincent Prevost, Bruno Diasparra
  • Publication number: 20180006078
    Abstract: The invention relates to colour-image sensors. To benefit both from a good luminance resolution and a colour accuracy that is not excessively degraded by the sensitivity of silicon to near-infrared radiation, the invention proposes to produce a mosaic of pixels comprising coloured pixels (R), (G), (B), coated with colour filters, which are distributed in the matrix, with white pixels (T) not coated with colour filters and which are distributed in the matrix. The coloured pixels include photodiodes constructed differently from the photodiodes of the white pixels, the different construction being such that the photodiodes of the coloured pixels have a lower sensitivity to infrared radiation than the photodiodes of the white pixels.
    Type: Application
    Filed: December 16, 2015
    Publication date: January 4, 2018
    Inventors: Pierre FEREYRE, Frédéric MAYER, Pascal DOUINE, Thierry LIGOZAT, Vincent PREVOST, Bruno DIASPARRA
  • Patent number: 9571761
    Abstract: The invention relates to image sensors, and more particularly to matrix sensors having active pixels in CMOS technology. According to the invention, a method for imaging a scene with a very short integration time, by using a standard image sensor comprising a matrix of pixels, comprising photodiodes, and charge storage nodes, is provided. Two images of the same scene are produced under identical light conditions, one of the images corresponding to integration of charges during a first time interval with a duration Tint and the other image corresponding to a second time interval with a duration T?int longer than Tint, and a difference between these two images is established, representing an image integrated during a time interval T?int?Tint. The light may be provided by a light pulse (IMP). This method may be used for observing points in a scene that lie at a well-determined distance, the brevity of the integration time allowing good precision of the observation distance.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: February 14, 2017
    Assignee: E2V SEMICONDUCTORS
    Inventors: Thierry Ligozat, Bruno Diasparra
  • Patent number: 9531974
    Abstract: The invention relates to image sensors of scanner type observing one image line at a time. According to the invention, only two lines of pixels are used, operating in TDI mode (summation of the charge of two pixels seeing the same image point successively) but using active pixels with a charge-voltage conversion within the pixel. The pixels of like rank of the two lines each use a photodiode and a charge storage node with a transfer gate adjacent to the photodiode and to the storage node for transferring the charge accumulated in the photodiode to the charge storage node. The storage node is shared between the two pixels of like rank, and the charge of the two photodiodes is transferred successively into this node before the reading of the potential taken by the node. The time interval which separates the two charge transfers corresponds substantially to the time which separates the transit of an image line past the first line of pixels and then past the second.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: December 27, 2016
    Assignee: E2V SEMICONDUCTORS
    Inventors: Marie Guillon, Thierry Ligozat
  • Publication number: 20160126265
    Abstract: The invention relates to an image sensor specially adapted to vision in low-light conditions (notably night vision).The sensor is formed on an integrated circuit chip starting from a silicon substrate. It comprises: a matrix of rows and columns of active pixels each comprising at least one photodiode and transistors, control circuits for the matrix, external to the matrix, and signal read circuits, external to the matrix. The photodiodes of the sensor are formed within an active layer of single-crystal silicon whose resistivity is at least 500 ohms·cm if this active layer is an epitaxial layer grown on the silicon substrate and at least 2000 ohms·cm if this active layer consists of the upper part of the silicon substrate.
    Type: Application
    Filed: October 16, 2013
    Publication date: May 5, 2016
    Inventors: Thierry LIGOZAT, Pierre FEREYRE, Frederic MAYER
  • Publication number: 20150304577
    Abstract: The invention relates to image sensors, and more particularly to matrix sensors having active pixels in CMOS technology. According to the invention, a method for imaging a scene with a very short integration time, by using a standard image sensor comprising a matrix of pixels, comprising photodiodes, and charge storage nodes, is provided. Two images of the same scene are produced under identical light conditions, one of the images corresponding to integration of charges during a first time interval with a duration Tint and the other image corresponding to a second time interval with a duration T?int longer than Tint, and a difference between these two images is established, representing an image integrated during a time interval T?int?Tint. The light may be provided by a light pulse (IMP). This method may be used for observing points in a scene that lie at a well-determined distance, the brevity of the integration time allowing good precision of the observation distance.
    Type: Application
    Filed: November 6, 2013
    Publication date: October 22, 2015
    Inventors: Thierry LIGOZAT, Bruno DIASPARRA
  • Patent number: 8686341
    Abstract: An image sensor for gathering images at one and the same time at low illumination level and at high illumination level is described. The sensor operates with a double integration time at each frame. Two successive charge transfers from a photodiode to a storage node are performed, the first after a first duration, the second after a second duration different from the first. The potential of the storage node after the first transfer of charge is sampled in a first capacitor of the reading circuit. The potential after a reinitialization of the storage node is sampled in a second capacitor. A level of potential taken after the second transfer is conditionally resampled in the first capacitor. The condition of the resampling is a condition of signal level after the first transfer. This level is applied to the differential amplifier of a ramp-type converter for a short duration of ramp.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: April 1, 2014
    Assignee: E2V Semiconductors
    Inventors: Andy Noiret, Thierry Ligozat
  • Publication number: 20130314572
    Abstract: The invention relates to image sensors of scanner type observing one image line at a time. According to the invention, only two lines of pixels are used, operating in TDI mode (summation of the charge of two pixels seeing the same image point successively) but using active pixels with a charge-voltage conversion within the pixel. The pixels of like rank of the two lines each use a photodiode and a charge storage node with a transfer gate adjacent to the photodiode and to the storage node for transferring the charge accumulated in the photodiode to the charge storage node. The storage node is shared between the two pixels of like rank, and the charge of the two photodiodes is transferred successively into this node before the reading of the potential taken by the node. The time interval which separates the two charge transfers corresponds substantially to the time which separates the transit of an image line past the first line of pixels and then past the second.
    Type: Application
    Filed: February 10, 2012
    Publication date: November 28, 2013
    Applicant: E2V Semiconductors
    Inventors: Marie Guillon, Thierry Ligozat
  • Publication number: 20120241594
    Abstract: An image sensor for gathering images at one and the same time at low illumination level and at high illumination level is described. The sensor operates with a double integration time at each frame. Two successive charge transfers from a photodiode to a storage node are performed, the first after a first duration, the second after a second duration different from the first. The potential of the storage node after the first transfer of charge is sampled in a first capacitor of the reading circuit. The potential after a reinitialization of the storage node is sampled in a second capacitor. A level of potential taken after the second transfer is conditionally resampled in the first capacitor. The condition of the resampling is a condition of signal level after the first transfer. This level is applied to the differential amplifier of a ramp-type converter for a short duration of ramp.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 27, 2012
    Applicant: E2V SEMICONDUCTORS
    Inventors: Andy NOIRET, Thierry LIGOZAT
  • Patent number: 8115842
    Abstract: The invention relates to matrix-array image sensors with MOS-technology active pixels, comprising a matrix-array of pixels arranged in rows and columns. To read the signal from a pixel, the reset potential present on a column conductor is sampled in two capacitors.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: February 14, 2012
    Assignee: E2V Semiconductors
    Inventors: Nicolas Lebouleux, Thierry Ligozat
  • Patent number: 7916200
    Abstract: The invention relates to image sensors using a chip with cut corners. The sensor comprises a chip with cut corners comprising a matrix (10) of horizontal lines and vertical columns of photosensitive members, the matrix having a generally rectangular shape of horizontal width W and having four bevels, the sensor comprising as many current or voltage read blocks as there are matrix columns, in order to read the image signals detected by the photosensitive members, characterized in that the current or voltage read blocks are placed in a row (30, 30?) along a horizontal edge of the matrix of width W? and are all housed within a vertical strip, the width W1 of which is substantially less than the maximum width W of the matrix. There are two superposed rows of current read blocks with blocks distributed at the same pitch as the pixel columns, or there is a single row with read blocks distributed with a pitch less than that of the pixel columns.
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: March 29, 2011
    Assignee: E2V Semiconductors
    Inventors: Thierry Ligozat, Grégoire Chenebaux
  • Publication number: 20100231772
    Abstract: The invention relates to matrix-array image sensors with MOS-technology active pixels, comprising a matrix-array of pixels arranged in rows and columns. To read the signal from a pixel, the reset potential present on a column conductor is sampled in two capacitors.
    Type: Application
    Filed: March 12, 2010
    Publication date: September 16, 2010
    Applicant: E2V SEMICONDUCTORS
    Inventors: Nicolas LEBOULEUX, Thierry LIGOZAT
  • Publication number: 20100141820
    Abstract: The invention relates to matrix image sensors. It applies most particularly to intraoral dental radiology sensors. The invention provides a sensor architecture comprising a column decoder controlling select conductors of a column, and a row decoder controlling select conductors of a row. The pixels of a column are connected to a signal conductor that extends along the column and goes toward an analog multiplexer extending within the pixel matrix between two rows of pixels of the matrix. The multiplexer is controlled via the column select conductors coming from the decoder and it transmits the signal from a signal conductor of a selected column to an output conductor extending parallel to the rows. A signal sampling circuit common to all the columns is connected at the end of the output conductor of the multiplexer. An increase in matrix area is achieved by in practice losing only a single image row.
    Type: Application
    Filed: April 29, 2009
    Publication date: June 10, 2010
    Applicant: E2V Semiconductors
    Inventors: Gregoire Chenebaux, Thierry Ligozat