Abstract: The present disclosure relates to a technology of manufacturing electronic components, especially semiconductor components with an irregular shape. The present disclosure provides an improved alignment method and system which may be used in cases, where features on a top surface of the semiconductor component or device are not sufficient due to process limitations and where a bottom surface might also not show any alignment correlation with the top surface.

Abstract: A semiconductor device is provided that includes a frontside and a backside, four sidewalls, a first solder/glue connection on the frontside and a second solder/glue connection on the backside. The semiconductor device is either connected as a chip scale package to a printed circuit board or inside a semiconductor package via one of the four sidewalls, so that the first solder/glue connection and the second solder/glue connection are visible for a visual solder/glue inspection.

Abstract: A semiconductor device is provided that includes a substrate, a pocket within the substrate, a solderable/glueable re-distribution layer arranged in the pocket and a die. The die is arranged downwards, so that a base contact and an emitter contact of the die face the bottom of the device, and a collector contact of the die faces the top of the device. The solderable/glueable re-distribution layer includes a first and second re-distribution layer part and the first re-distribution layer part and the second re-distribution layer part are isolated from each other by an isolating material. The emitter contact is connected to the first re-distribution layer part and the base contact is connected to the second re-distribution layer part. The emitter contacts via the first re-distribution layer part, the base contacts via the second re-distribution layer part, and the collector contact are fan out to the top surface of the semiconductor device.

Abstract: A positioning system and method for positioning a semiconductor device are disclosed. In an embodiment, a positioning system for positioning a semiconductor device includes a long-stroke stage configured to be movable with respect to a supporting structure within a plane and a short-stroke stage attached to the long-stroke stage and configured to carry a semiconductor device and to be rotatable within the plane. The long-stroke stage acts as a balance mass between the short-stroke stage and the supporting structure.

Abstract: A positioning system and method for positioning a semiconductor device are disclosed. In an embodiment, a positioning system for positioning a semiconductor device includes a long-stroke stage configured to be movable with respect to a supporting structure within a plane and a short-stroke stage attached to the long-stroke stage and configured to carry a semiconductor device and to be rotatable within the plane. The long-stroke stage acts as a balance mass between the short-stroke stage and the supporting structure.