Abstract: The present invention relates to a lithographic projection apparatus with a supporting structure to support and move an object, like a substrate. The supporting structure may be a robot having a robotic arm with a support frame for supporting, e.g. the substrate. The support frame includes a clamping structure having one or more clamps for holding the substrate during movement. The robot arm comprises one or more compliant parts. The clamp may be a Johnson-Raybeck effect type clamp with an oxidized upper surface. For better de-clamping, a RF AC decaying de-clamping voltage may be provided to the clamp. The apparatus may be cleaned with one single substrate only.

Abstract: The invention relates to a transfer apparatus for transferring an object (W). the transfer apparatus comprises a gripper (15) for at least one of gripping the object (W) at a first position and then releasing the object (W) at a second position proximate to a receiver (20) and releasing the object (W) at a first position after gripping the object at a second position proximate to the receiver (20). The transfer apparatus is further provided with a measurement device (22) arranged to measure the relative position of the gripper (15) with respect to the receiver (20) in at least one dimension. Further, a relative position error is defined with respect to a desired relative position based on the relative position measured. The relative position of the gripper (15) and the receiver (20) are adjusted for minimizing the relative position error in the second position.

Abstract: The present invention relates to a lithographic projection apparatus with a supporting structure to support and move an object, like a substrate. The supporting structure may be a robot having a robotic arm with a support frame for supporting, e.g. the substrate. The support frame includes a clamping structure having one or more clamps for holding the substrate during movement. The robot arm comprises one or more compliant parts. The clamp may be a Johnson-Raybeck effect type clamp with an oxidized upper surface. For better de-clamping, a RF AC decaying de-clamping voltage may be provided to the clamp. The apparatus may be cleaned with one single substrate only.