Abstract: An adhesive that comprises: (a) 35 to 55 wt. % of an elastomer component; (b) 20 to 45 wt. % of an adhesive resin component; and (c) 15 to 40 wt. % of a plasticizing component, wherein (c1) 8 to 35 wt. % of (c) is made of one or more plasticizing oils, and (c2) optionally up to 32 wt. % of (c) is made of one or more plasticizers that differ from plasticizing oils.

Abstract: A dry adhesive article comprising: (i) a substrate comprising a primary surface and (ii) a layer of nanofibers disposed on the primary surface of the substrate in a random orientation, the layer comprising a polyacrylate block copolymer; wherein, the layer of nanofibers exhibit pressure-sensitive adhesion.

Abstract: A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23° C. and greater than 23° C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C?C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R?, wherein R and R? each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

Abstract: The invention relates to a polymer obtainable by the radical polymerization of at least one monomer, namely one or more (meth)acrylate monomers and optionally, in addition, vinylic comonomers, wherein the polymer has a molar mass MW of at least 5,000 g/mol and at most 200,000 g/mol and at least one of the monomers is functionalized with at least one epoxy group, wherein the proportion of the epoxide-functionalized monomer(s) (a) is more than 30 wt %.

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C?C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R?, wherein R and R? each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

Abstract: An adhesive that comprises: (a) 35 to 55 wt. % of an elastomer component; (b) 20 to 45 wt. % of an adhesive resin component; and (c) 15 to 40 wt. % of a plasticizing component, wherein (c1) 8 to 35 wt. % of (c) is made of one or more plasticizing oils, and (c2) optionally up to 32 wt. % of (c) is made of one or more plasticizers that differ from plasticizing oils.

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C?C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R?, wherein R and R? each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

Abstract: Single- or double-sided adhesive tapes and methods at least partly encapsulate an (opto)electronic structure. The tapes and method include a carrier and at least one layer of a curable adhesive composition having the following components: (A) 20% to 99.9% by weight (based on the entirety of the curable adhesive composition) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass of at least 5000 g/mol, based on more than 30% to 100% by weight, (based on the entirety of the parent monomers of the epoxy-functionalized (co)polymer) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group; and (B) 0.1% to 5% by weight (based on the entirety of the curable adhesive composition) of at least one curing agent configured to induce curing of the (co)polymer (A) with reaction of its epoxy groups by thermal means and/or by supply of UV radiation.

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C?C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R?, wherein R and R? each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

Abstract: Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

Abstract: The invention relates to an adhesive film strip comprising at least two, particularly three, layers, which adhesive film strip can be detached without residues and nondestructively by expansive stretching substantially in the adhesion plane, with a carrier on which a first external adhesive compound layer is present on at least one side, wherein • the adhesive compound layer consists of adhesive compound formed on the basis of vinyl aromatic block copolymers and adhesive resins, wherein at least 75% of the resin (relative to the overall resin content) is selected with a DACP (diacetone alcohol cloud point) of greater than ?20° C., preferably greater than 0° C., and • the carrier has at least one layer consisting of a polyurethane with an elongation at break of at least 100% and a restoring power of more than 50%. A nonpolar hydrocarbon resin or a polyterpene resin is particularly used as the tackifier for the adhesive compound(s).

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C?C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R?, wherein R and R? each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

Abstract: The invention relates to a thermally curable adhesive compound consisting of the following components: (A) 4.9 to 34.9 wt % (relative to the total amount of the curable adhesive compound) of an epoxide-functionalized (co)polymer having a weight-average molar mass in the range of 5,000 g/mol to 200,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one thermally activatable curing agent for a cationic curing of epoxides, (C) 65 to 95 wt % (relative to the total amount of the curable adhesive compound) of at least one type of matrix polymer as a film-forming agent, (D) optionally 0 to 30 wt % of additional components.

Abstract: The invention relates to a block copolymer-containing pressure-sensitive adhesive comprising e) 52% by weight to 65% by weight, preferably 55% by weight to 62% by weight, of an elastomer component, f) 30% by weight to 45% by weight, preferably 35% by weight to 42% by weight, of at least one bonding resin, g) 0% by weight to 15% by weight, preferably to 10% by weight, of at least one softening resin and h) 0% by weight to 18% by weight, preferably to 10% by weight, of further additives, where the elastomer component (a) consists to an extent of at least 90% by weight of polyvinylaromatic-polybutadiene block copolymers, where the polyvinylaromatic-polybutadiene block copolymers include at least one type of diblock copolymer (a1) and at least one type of tri- or multiblock copolymer (a2), the at least one diblock copolymer (a1) has a vinylaromatic content of 15% by weight to 45% by weight, within the elastomer component (a) the proportion of tri- or multiblock copolymer (a2) is between 25% by weight and 50% by w

Abstract: An adhesive mass consisting of (a) at least one elastomer component, of a polybutadiene-polyvinyl aromatic block copolymer type, having a proportion with respect to the total adhesive mass of 42 to 55 wt. % and having a diblock proportion with respect to the total block copolymer content of 32 to 55 wt. %, (b) at least one adhesive resin, which is a hydrocarbon resin having a DACP value of at least +50° C. and at most +85° c, (c) optionally at least one soft resin having a proportion of 0 to 15 wt. % with respect to the total adhesive mass, and (d) optionally further additives, which adhesive mass is particularly suitable for adhering on rough substrates such as plaster or woodchip wallpaper.

Abstract: A single- or double-sidedly bonding adhesive-sheet strip having a self-adhesive composition comprising a) at least one elastomer, at least one type of polybutadiene block copolymer being used as an elastomer, b) at least one partially hydrogenated hydrocarbon resin having a softening temperature of at least 90° C., c) at least one additional hydrocarbon resin, a terpene phenol resin and/or a colophonium resin having a softening temperature of at least 90° C., d) an optional soft resin, and e) additional additives as applicable.

Abstract: Reactive adhesive film, comprising (a) a polymeric film-forming matrix, (b) at least one reactive monomer or reactive resin, and (c) a reagent selected from the group consisting of a radical initiator and an activator, and a reactive 2-component adhesive film system for bonding various materials, such as metal, wood, glass and/or plastic.

Abstract: Reactive adhesive film, comprising (a) a polymeric film-forming matrix, (b) at least one reactive monomer or reactive resin, and (c) a reagent selected from the group consisting of a radical initiator and an activator, and a reactive 2-component adhesive film system for bonding various materials, such as metal, wood, glass and/or plastic.

Abstract: Release liners and methods protect one or more adhesives, wherein the release liners and/or methods comprise at least one abhesive release layer and at least one layer of a getter material capable of sorbing at least one permeable substance, wherein the getter material is at least one substance selected from the group consisting of lithium, beryllium, boron, sodium, magnesium, potassium, calcium, manganese, iron, nickel, zinc, gallium, germanium, cadmium, indium, caesium, barium, boron oxide, calcium oxide, chromium oxide, manganese oxide, iron oxide, copper oxide, silver oxide, indium oxide, barium oxide, lead oxide and mixtures of two or more of the above substances.