Abstract: The invention relates to a multilayer adhesive strip comprising a carrier layer and at least one adhesive layer arranged on the carrier layer, wherein the carrier layer comprises a syntactically foamed plastic; the adhesive layer comprises a syntactically foamed adhesive compound; the adhesive compound comprises one or more polymers selected from the group consisting of poly(meth)acrylates and synthetic rubbers; and the syntactically foamed plastic and the syntactically foamed adhesive compounds comprise a plurality of expanded microballoons.

Abstract: The invention relates to a pressure-sensitive adhesive comprising a) at least 38 wt % and at most 58 wt % of an elastomer component, where i) the elastomer component comprises at least 60 wt %, based on the elastomer component, of hydrogenated polyvinylaromatic-polydiene block copolymer having a polyvinylaromatic fraction of at least 18 wt % and a peak molecular weight of 80 000 to 500 000 g/mol, determined by GPC (Test I); ii) the polydiene blocks are substantially fully hydrogenated; and iii) the hydrogenated polyvinylaromatic-polydiene block copolymer has an ABA construction, (AB)nZ construction with n=2 or radial (AB)n construction or radial (AB)n-Z construction with n?3, where A=polyvinylaromatic and B=ethylene and butylene or ethylene and propylene, and Z=derivative of a coupling substance, and where the ethylene fraction in the B blocks is at least 50 wt %; b) a tackifier resin component, c) a plasticizer component, and d) optionally further adjuvants, where the fraction of the elastomer component is b

Abstract: The invention relates to polyvinal aromate-polydiene-block copolymer-based adhesive compounds that contain at least one type of a cationically curable reactive resin and that result, when cured, in improved thermal shear strength. The invention further relates to adhesive strips that contain at least one layer of such an adhesive compound, and a method of production.

Abstract: A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23° C. and greater than 23° C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

Abstract: Self-adhesive product redetachable by extensive stretching comprises a pressure-sensitive adhesive comprising: a) an elastomer component, where i. the elastomer component comprises a hydrogenated polyvinylaromatic-polydiene block copolymer described herein, ii. the polydiene blocks are substantially fully hydrogenated, iii. the hydrogenated polyvinylaromatic-polydiene block copolymer has a construction described herein, and iv. the elastomer component comprises a hydrogenated diblock copolymer having a construction described herein, b) a tackifying resin component, c) optionally a plasticizer, d) optionally further adjuvants, and also at least one ply of a temporary carrier material.

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C?C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R?, wherein R and R? each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

Abstract: Adhesive tapes suitable for bonding to clearcoat materials and exhibiting a good shear strength and a bond strength compatible with requirements. Methods apply the adhesive tapes onto clearcoat materials. The adhesive tapes comprise a carrier layer and a layer of pressure-sensitive adhesive, arranged on the outside in the structure of the adhesive tape. The layer of pressure-sensitive adhesive comprises: at least one polymer selected from poly(meth)acrylates and polydiene block copolymers, or at least one blend of at least one poly(meth)acrylate and at least one polydiene block copolymer; and a tackifier resin component comprising at least one terpene phenolic resin, wherein the terpene phenolic resin has a softening temperature as determined by the ring-and-ball method according to ASTM E28, of not more than 140° C.

Abstract: The invention relates to a polymer obtainable by the radical polymerization of at least one monomer, namely one or more (meth)acrylate monomers and optionally, in addition, vinylic comonomers, wherein the polymer has a molar mass MW of at least 5,000 g/mol and at most 200,000 g/mol and at least one of the monomers is functionalized with at least one epoxy group, wherein the proportion of the epoxide-functionalized monomer(s) (a) is more than 30 wt %.

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C?C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R?, wherein R and R? each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

Abstract: An adhesive that comprises: (a) 35 to 55 wt. % of an elastomer component; (b) 20 to 45 wt. % of an adhesive resin component; and (c) 15 to 40 wt. % of a plasticizing component, wherein (c1) 8 to 35 wt. % of (c) is made of one or more plasticizing oils, and (c2) optionally up to 32 wt. % of (c) is made of one or more plasticizers that differ from plasticizing oils.

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C?C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R?, wherein R and R? each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

Abstract: The present invention relates to a foamed pressure-sensitive adhesive compound on the basis of aromatic polyvinyl-polydiene block copolymers, in particular for double-sided self-adhesive strips, containing a) 39.8 wt. % to 51.8 wt. % of an elastomer component, b) 35.0 wt. % to 58.0 wt % of an adhesive resin component, c) 2.0 wt. % to 15.0 wt. % of a plasticizer component, d) 0.0 wt. % to 18.0 wt. % of further additives and e) microballoons, the microballoons being at least partly expanded.

Abstract: The invention relates to a foamed adhesive mass layer comprising a) 41.7 to 62.0 wt. % of an elastomer component, b) 37.7 to 58.0 wt. % of an adhesive resin component, c) 0 to 15 wt. % of a soft resin component, d) 0 to 18 wt. % further additives, and e) microballoons with a proportion of preferably 0.3 to 2.5 wt. %, preferably 0.5 to 2.0 wt. % and particularly preferably 0.7 to 1.7 wt. %, wherein the microballoons are at least partially expanded, wherein the elastomer component (a) consists of up to at least 90 wt. % polyvinyl aromatic compound polydine block copolymer, wherein the adhesive resin component (b) contains up to 4 to 100 wt. % of at least one type K1 if a rosin oligomer with a softening temperature (Ring & Ball, Test VI) of at least 90° C., and wherein the density (Text IX) of the foamed adhesive mass layer is at least 600 kg/m3 and max. 920 kg/m3.

Abstract: Single- or double-sided adhesive tapes and methods at least partly encapsulate an (opto)electronic structure. The tapes and method include a carrier and at least one layer of a curable adhesive composition having the following components: (A) 20% to 99.9% by weight (based on the entirety of the curable adhesive composition) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass of at least 5000 g/mol, based on more than 30% to 100% by weight, (based on the entirety of the parent monomers of the epoxy-functionalized (co)polymer) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group; and (B) 0.1% to 5% by weight (based on the entirety of the curable adhesive composition) of at least one curing agent configured to induce curing of the (co)polymer (A) with reaction of its epoxy groups by thermal means and/or by supply of UV radiation.

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C?C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R?, wherein R and R? each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

Abstract: A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23° C. and greater than 23° C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

Abstract: Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

Abstract: The invention relates to an adhesive film strip comprising at least two, particularly three, layers, which adhesive film strip can be detached without residues and nondestructively by expansive stretching substantially in the adhesion plane, with a carrier on which a first external adhesive compound layer is present on at least one side, wherein • the adhesive compound layer consists of adhesive compound formed on the basis of vinyl aromatic block copolymers and adhesive resins, wherein at least 75% of the resin (relative to the overall resin content) is selected with a DACP (diacetone alcohol cloud point) of greater than ?20° C., preferably greater than 0° C., and • the carrier has at least one layer consisting of a polyurethane with an elongation at break of at least 100% and a restoring power of more than 50%. A nonpolar hydrocarbon resin or a polyterpene resin is particularly used as the tackifier for the adhesive compound(s).

Abstract: The invention relates to a polymer obtainable by the radical polymerization of at least one monomer, namely one or more (meth)acrylate monomers and optionally, in addition, vinylic comonomers, wherein the polymer has a molar mass MW of at least 5,000 g/mol and at most 200,000 g/mol and at least one of the monomers is functionalized with at least one epoxy group, wherein the proportion of the epoxide-functionalized monomer(s) (a) is more than 30 wt %.

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C?C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R?, wherein R and R? each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.