Abstract: An optical apparatus for a lithography system comprises at least one optical element comprising an optical surface. The optical apparatus also comprises one or more actuators for deforming the optical surface. A strain gauge device is provided for determining the deformation of the optical surface. The strain gauge device comprises at least one optical fiber that maintains polarization.

Abstract: A component for a projection exposure apparatus for semiconductor lithography, comprises an optical element and an actuator, which are force-fittingly connected to each other. The actuator at least locally deforms the optical element. The actuator can be configured to minimize the loss in rigidity at the peripheries delimiting the actuator on the imaging quality. A method for designing a component of projection exposure apparatus is provided.

Abstract: A projection exposure apparatus comprises a projection objective, and the projection objective comprises an optical device, wherein the optical device comprises an optical element having an optically effective surface and an electrostrictive actuator. The electrostrictive actuator is deformable by a control voltage being applied. The electrostrictive actuator is functionally connected to the optical element to influence the surface shape of the optically effective surface. A control device supplies the electrostrictive actuator with the control voltage. A measuring device is configured, at least at times while the electrostrictive actuator influences the optically effective surface of the optical element, to measure directly and/or to determine indirectly the temperature and/or a temperature change of the electrostrictive actuator and/or the surroundings thereof to take account of a temperature-dependent influence during driving of the electrostrictive actuator by the control device.

Abstract: A mirror arrangement (30) includes: a substrate (31), which has a front side (31a) having a mirror face (32a) for reflecting radiation (5), and a rear side (31b) facing away from the front side (31a), as well as at least one actuator (27) arranged to generate deformations of the mirror face (32a). The at least one actuator (27) is secured on the rear side (31b) of the substrate (31), and the mirror arrangement (30) has a hydrogen barrier (38) which is configured to protect a hydrogen-sensitive material (M) on the rear side (31b) of the substrate (31), in particular on the at least one actuator (27), from the attack by hydrogen (37) from the surroundings (36) of the mirror arrangement (30). An associated optical arrangement, in particular an EUV lithography apparatus (1), incorporating such a mirror arrangement (30) is also disclosed.

Abstract: A mirror arrangement (30) includes: a substrate (31) with a front side (31a) having a mirror face (32a) reflecting radiation (5), and a rear side (31b) facing away from the front side and on which at least one actuator (27) generating deformations of the mirror face is arranged. A water vapor (36)-sorbing material (33, 42) is formed on the rear side (31b) and forms an adhesive layer (33) for securing the actuator. The layer extends into interspaces (35) between the actuators (27). A surface (33a, 42a) of the water vapor-sorbing material is covered at least partly by a coating (37) which forms a water vapor diffusion barrier.

Abstract: A module for a projection exposure apparatus for semiconductor lithography includes at least one optical element arranged in a holder. At least one spacer is arranged between the holder and a further holder or a main body. The spacer is designed to semi-actively vary its extent. A method for positioning at least one holder in a projection exposure apparatus for semiconductor lithography includes using a semi-active spacer is to position the holder.