Patents by Inventor Thilo Stache

Thilo Stache has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Treatment of a substrate with a liquid medium
    Patent number: 8759230
    Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: June 24, 2014
    Assignee: Infineon Technologies AG
    Inventors: Stephan Bradl, Michael Melzl, Josef Schwaiger, Thilo Stache
  • Method for machining a workpiece on a workpiece support
    Patent number: 8357588
    Abstract: A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.
    Type: Grant
    Filed: February 22, 2011
    Date of Patent: January 22, 2013
    Assignee: Infineon Technologies AG
    Inventors: Stephen Bradl, Walther Grommes, Werner Kröninger, Michael Melzl, Josef Schwaiger, Thilo Stache
  • METHOD FOR MACHINING A WORKPIECE ON A WORKPIECE SUPPORT
    Publication number: 20110232074
    Abstract: A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.
    Type: Application
    Filed: February 22, 2011
    Publication date: September 29, 2011
    Inventors: Stephen Bradl, Walther Grommes, Werner Kröninger, Michael Melzl, Josef Schwaiger, Thilo Stache
  • Method for machining a workpiece on a workpiece support
    Patent number: 7892947
    Abstract: A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.
    Type: Grant
    Filed: October 13, 2006
    Date of Patent: February 22, 2011
    Assignee: Infineon Technologies AG
    Inventors: Stephen Bradl, Walther Grommes, Werner Kröninger, Michael Melzl, Josef Schwaiger, Thilo Stache
  • Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium
    Patent number: 7566378
    Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: July 28, 2009
    Assignee: Infineon Technologies AG
    Inventors: Stephan Bradl, Michael Melzl, Josef Schwaiger, Thilo Stache
  • Treatment of a Substrate with a Liquid Medium
    Publication number: 20090093127
    Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.
    Type: Application
    Filed: December 9, 2008
    Publication date: April 9, 2009
    Inventors: Stephan Bradl, Michael Melzl, Josef Schwaiger, Thilo Stache
  • Method for machining a workpiece on a workpiece support
    Publication number: 20070117351
    Abstract: A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.
    Type: Application
    Filed: October 13, 2006
    Publication date: May 24, 2007
    Inventors: Stephan Bradl, Walther Grommes, Werner Kroninger, Michael Melzl, Josef Schwaiger, Thilo Stache
  • Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium
    Publication number: 20060276010
    Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.
    Type: Application
    Filed: May 23, 2006
    Publication date: December 7, 2006
    Inventors: Stephan Bradl, Michael Melzl, Josef Schwaiger, Thilo Stache