Abstract: A power electronics component, including a first substrate with an upper and lower metallization layer and a semiconductor assembly mounted on the first substrate which has a connection to a first region of the upper metallization layer of the first substrate facing the semiconductor assembly. The power electronics component further includes a first heat sink, a first side of which faces the first substrate and is thermally connected to the lower metallization layer of the first substrate, which faces away from the semiconductor assembly. The power electronics component includes an additional substrate having an upper and lower metallization layer, the additional substrate being attached to a second side of the first heat sink opposite the first side, and the second side of the first heat sink being connected to the upper metallization layer of the additional substrate facing -the first heat sink.

Abstract: A power electronics component includes an electrically insulating substrate including a top-side and bottom-side metallization layer. The top-side metallization layer is divided into at least three electrically isolated regions of a conductor structure. The component also includes a semiconductor assembly mounted on the substrate, including two semiconductor components connected in series, each including a first connection, thermally and electrically connected to a region of the conductor structure, and a second connection, electrically connected to a second connection surface of another semiconductor component and/or to one of the regions of the conductor structure. The component also includes a heat sink arranged on the substrate. A first side facing the substrate is thermally connected to the bottom-side metallization layer which faces away from the semiconductor assembly.

Abstract: A power electronics component, including a substrate, a semiconductor assembly arranged on the substrate, and at least two input power connections and at least two output power connections arranged on at least one side of the power electronics component. The power electronics component is configured such that the power electronics component can be joined with at least one other power electronics component of identical design in a stacking direction to form an assembly of power electronics components. The power electronics component is also configured such that the at least two input power connections can each be electrically connected to respective input power connections of the at least one other power electronics component via a first connection line, and the at least two output power connections can each be electrically connected to output power connections of the at least one other power electronics component via a second connection line.

Abstract: A method for manufacturing a cooling element (1) for an electrical or electronic component, in particular a semiconductor element, the manufactured cooling element (1) having a cooling fluid channel system through which a cooling fluid can be passed during operation, comprising providing at least a first metal layer (11) realizing at least one recess (21, 22) in the at least one first metal layer (11), and forming at least a partial section of the cooling fluid channel system by means of the at least one recess (21, 22), wherein at least a first part (21) of the at least one recess (21, 22) in the at least first metal layer (11) is realized by erosion, in particular spark erosion.

Abstract: A light emitting device includes a plurality of light emitting diode stacks and a cooler. The plurality of light emitting diode stacks are each mounted to and cooled by the cooler. A light emitting device includes a plurality of light emitting diode stacks, a cooler, and a power supply. The plurality of light emitting diode stacks are each mounted to and cooled by the cooler, the power supply is configured to power the plurality of light emitting diode stacks, and the power supply is mounted to the cooler on an opposite side of the cooler relative to the plurality of light emitting diode stacks.

Abstract: A light emitting device, including a plurality of emitter subassemblies and a lens array, each emitter subassembly including a plate-shaped light emitter having two sides and configured to emit light from an edge, and at least one plate-shaped submount attached to at least one side of the plate-shaped light emitter. Each of the plurality of emitter subassemblies are disposed parallel to one another and sintered to one another in such a manner as to form a light emitting diode stack. A predefined pitch pattern defines distances between adjacent emitter subassemblies. The lens array is mounted on the light emitting diode stack and includes a plurality of lenses combined as a single unitary body. Distances between the lenses correspond to the distances defined by the predefined pitch pattern such that each of the plurality of lenses is aligned with a corresponding one of the plate-shaped light emitters.

Abstract: A light emitting device includes a plurality of light emitting diode stacks and a cooler. The plurality of light emitting diode stacks are each mounted to and cooled by the cooler. A light emitting device includes a plurality of light emitting diode stacks, a cooler, and a power supply. The plurality of light emitting diode stacks are each mounted to and cooled by the cooler, the power supply is configured to power the plurality of light emitting diode stacks, and the power supply is mounted to the cooler on an opposite side of the cooler relative to the plurality of light emitting diode stacks.

Abstract: A light emitting device, including a plurality of emitter subassemblies and a lens array, each emitter subassembly including a plate-shaped light emitter having two sides and configured to emit light from an edge, and at least one plate-shaped submount attached to at least one side of the plate-shaped light emitter. Each of the plurality of emitter subassemblies are disposed parallel to one another and sintered to one another in such a manner as to form a light emitting diode stack. A predefined pitch pattern defines distances between adjacent emitter subassemblies. The lens array is mounted on the light emitting diode stack and includes a plurality of lenses combined as a single unitary body. Distances between the lenses correspond to the distances defined by the predefined pitch pattern such that each of the plurality of lenses is aligned with a corresponding one of the plate-shaped light emitters.

Abstract: Methods, devices, and systems for laser diode packaging platforms are provided. In one aspect, a laser diode assembly includes a heat sink and a plurality of laser diode units horizontally spaced apart from one another on the heat sink. Each laser diode unit includes: a first submount positioned on the heat sink and spaced apart from adjacent another first submount, a laser diode including an active layer between a first-type doped semiconductor layer and a second-type doped semiconductor layer, a bottom side of the laser diode being positioned on the first submount, and a second submount positioned on a top side of the laser diode and spaced apart from adjacent another second submount. The first submount, the laser diode, and the second submount in the laser diode unit are vertically positioned on the heat sink. The laser diodes of the plurality of laser diode units are electrically connected in series.

Abstract: Methods, devices, and systems for laser diode packaging platforms are provided. In one aspect, a laser diode assembly includes a heat sink and a plurality of laser diode units horizontally spaced apart from one another on the heat sink. Each laser diode unit includes: a first submount positioned on the heat sink and spaced apart from adjacent another first submount, a laser diode including an active layer between a first-type doped semiconductor layer and a second-type doped semiconductor layer, a bottom side of the laser diode being positioned on the first submount, and a second submount positioned on a top side of the laser diode and spaced apart from adjacent another second submount. The first submount, the laser diode, and the second submount in the laser diode unit are vertically positioned on the heat sink. The laser diodes of the plurality of laser diode units are electrically connected in series.

Abstract: A method for manufacturing a cooling element (1) for an electrical or electronic component, in particular a semiconductor element, the manufactured cooling element (1) having a cooling fluid channel system through which a cooling fluid can be passed during operation, comprising providing at least a first metal layer (11) realizing at least one recess (21, 22) in the at least one first metal layer (11), and forming at least a partial section of the cooling fluid channel system by means of the at least one recess (21, 22), wherein at least a first part (21) of the at least one recess (21, 22) in the at least first metal layer (11) is realized by erosion, in particular spark erosion.

Abstract: A laser diode bar: includes a semiconductor substrate comprising a first semiconductor layer of a first conductivity type; a first laser diode stack on an upper side of the semiconductor layer; a second laser diode stack on the upper side of the semiconductor layer, the second laser diode stack being electrically connected in series with the first laser diode stack, in which an electrical conductivity of the first semiconductor layer of the first conductivity type is higher than an electrical conductivity of each semiconductor layer of the first and second laser diode stacks; and a first electrode layer on the first laser diode stack, in which the first electrode layer electrically connects the first laser diode stack to a portion of the first semiconductor layer of the first conductivity type that is between the first laser diode stack and the second laser diode stack.

Abstract: A laser diode device includes: a first heat sink including a first mounting layer, in which the first mounting layer includes at least two mounting pads electrically isolated from one another; a second heat sink including a second mounting layer, in which the second mounting layer includes at least two mounting pads electrically isolated from one another; and a laser diode bar between the first heat sink and the second heat sink, in which a bottom electrical contact of the laser diode bar is mounted to the first mounting layer, and a top electrical contact of the laser diode bar is mounted to the second mounting layer.

Abstract: A laser diode heat sink including: a main body portion formed of metal; an electrically insulating layer on a principal surface of the main body portion, in which an interface between the main body portion and the electrically insulating layer includes multiple interlocking structures; and a metal mounting layer for mounting a laser diode on the electrically insulating layer.

Abstract: A laser diode device includes: a first heat sink including a first mounting layer, in which the first mounting layer includes at least two mounting pads electrically isolated from one another; a second heat sink including a second mounting layer, in which the second mounting layer includes at least two mounting pads electrically isolated from one another; and a laser diode bar between the first heat sink and the second heat sink, in which a bottom electrical contact of the laser diode bar is mounted to the first mounting layer, and a top electrical contact of the laser diode bar is mounted to the second mounting layer.

Abstract: A laser diode bar: includes a semiconductor substrate comprising a first semiconductor layer of a first conductivity type; a first laser diode stack on an upper side of the semiconductor layer; a second laser diode stack on the upper side of the semiconductor layer, the second laser diode stack being electrically connected in series with the first laser diode stack, in which an electrical conductivity of the first semiconductor layer of the first conductivity type is higher than an electrical conductivity of each semiconductor layer of the first and second laser diode stacks; and a first electrode layer on the first laser diode stack, in which the first electrode layer electrically connects the first laser diode stack to a portion of the first semiconductor layer of the first conductivity type that is between the first laser diode stack and the second laser diode stack.

Abstract: A device for wavelength coupling of laser beams (2a, . . . 2n) with different wavelengths (?1, . . . ?n), comprising: at least one laser source for generating a plurality of laser beams (2a, . . . , 2n), and an overlapping device for spatial overlapping of the plurality of laser beams (2a, . . . , 2n) for forming an overlapped laser beam with a plurality of wavelengths (?1 . . . ?n). The device has a feedback device arranged between the laser source and the overlapping device for feeding a radiation proportion of the laser beams (2a, . . . , 2n) to be overlapped back to the laser source, the feedback device comprising a partially reflecting angle-dispersive optical element, in particular a partially reflecting diffraction grating. The overlapping device may, for example, be configured as a transmitting or reflecting diffraction grating whose optical properties are adapted to the optical properties of the partially reflecting diffraction grating to overlap the laser beams (2a, . . .

Abstract: A laser module has a unitary base including stepped platforms with an offset relative to an adjacent platform, each stepped platform accommodating a laser source with at least a first and a second plurality of stepped platforms, each platform accommodating a cooling channel inside at a predetermined depth below the top surface of the platform to conduct a flow of cooling fluid provided on an inlet, the cooling channel running under a platform having microchannels, the cooling channels being connected to a fluid inlet with an inlet manifold that provides cooling fluid at the inlet and an outlet manifold to dispose the cooling fluid with waste heat at an outlet, the laser module producing in one embodiment no less than 100 Watt of optical power.

Abstract: A laser disk module includes a lasing element including an active gain medium, the lasing element including opposite top and bottom end surfaces, and a heat transfer element adjacent the bottom end surface, the heat transfer element including a ceramic material that defines a plurality of cooling structures. The heat transfer element is configured to transfer heat generated in the lasing element to a coolant in contact with the heat transfer element in the plurality of cooling structures during operation of the laser disk module.

Abstract: A laser disk module includes a lasing element including an active gain medium, the lasing element including opposite top and bottom end surfaces, and a heat transfer element adjacent the bottom end surface, the heat transfer element including a ceramic material that defines a plurality of cooling structures. The heat transfer element is configured to transfer heat generated in the lasing element to a coolant in contact with the heat transfer element in the plurality of cooling structures during operation of the laser disk module.