Patents by Inventor Thiloka Ariyasena

Thiloka Ariyasena has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ATOMIC LAYER DEPOSITION OF TRANSITION METAL THIN FILMS
    Publication number: 20140234550
    Abstract: An atomic layer deposition method for forming metal films on a substrate comprises a deposition cycle including: a) contacting a substrate with a vapor of a metal-containing compound described by formula 1 for a first predetermined pulse time to form a first modified surface: MLn ??(1) wherein: n is 1 to 8; M is a transition metal; L is a ligand; b) contacting the first modified surface with an acid for a second predetermined pulse time to form a second modified surface; and c) contacting the second modified surface with a reducing agent for a third predetermined pulse time to form a metal layer.
    Type: Application
    Filed: June 5, 2012
    Publication date: August 21, 2014
    Applicant: WAYNE STATE UNIVERSITY
    Inventors: Charles H. Winter, Thomas J. Knisley, Thiloka Ariyasena