Patents by Inventor Thimo Schindelar

Thimo Schindelar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer and integrated circuit chip having a crack stop structure
    Patent number: 8970008
    Abstract: A wafer has a number of IC areas and a kerf area arranged between the IC areas. The kerf area has a dicing area, a crack stop structure arranged between an IC area and a dicing area, and a trench arranged between the crack stop structure and the dicing area. The crack stop structure includes an extended layer extending beyond the crack stop structure towards the dicing area.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: March 3, 2015
    Assignee: Infineon Technologies AG
    Inventors: Achim Gratz, Thimo Schindelar
  • Wafer, Integrated Circuit Chip and Method for Manufacturing an Integrated Circuit Chip
    Publication number: 20140264767
    Abstract: A wafer has a number of IC areas and a kerf area arranged between the IC areas. The kerf area has a dicing area, a crack stop structure arranged between an IC area and a dicing area, and a trench arranged between the crack stop structure and the dicing area. The crack stop structure includes an extended layer extending beyond the crack stop structure towards the dicing area.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Inventors: Achim Gratz, Thimo Schindelar