Patents by Inventor Thines Kumar PERUMAL

Thines Kumar PERUMAL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240139993
    Abstract: The present invention relates to a feedstock composition comprising inorganic particles having a multi-modal particle size distribution and comprising a collection of irregular fine particles having a fine particle size distribution and an average fine particle diameter, and a collection of irregular coarse particles having a coarse particle size distribution and an average coarse particle diameter that is in a range from 4 to 7 times the average fine particle diameter. The feedstock composition further comprising a binder composition that is adapted to solidify to form a body comprising the inorganic particles and solidified binder composition. Additionally, the present composition provides a method of forming a shaped body that comprises inorganic particles dispersed in binder composition as well as a method of forming a low porosity inorganic sintered body.
    Type: Application
    Filed: October 23, 2023
    Publication date: May 2, 2024
    Inventors: Thines Kumar Perumal, Subhash Guddati, Christopher James Yannetta, Montray Leavy, Troy Scoggins, Aravind Vasanthakumar
  • Publication number: 20240123500
    Abstract: Described are porous sintered bodies and methods of making porous sintered bodies by additive manufacturing methods.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 18, 2024
    Inventors: Thines Kumar Perumal, Subhash Guddati, Virendra Warke, Devon Nichole Dion, Montray Leavy
  • Patent number: 11911822
    Abstract: Three-dimensional multi-layer composite structures prepared by additive manufacturing techniques, as well as methods of preparing the structures by additive manufacturing techniques, wherein a multi-layer structure has layers of at least two different thicknesses and a precision thickness are disclosed herein. In some embodiments, a method includes forming a coarse feedstock layer having a coarse feedstock layer thickness, solidifying a portion of the coarse feedstock layer to form a solidified coarse feedstock layer having a solidified coarse feedstock layer thickness, before or after forming the solidified coarse feedstock layer, forming at least one fine feedstock layer having a fine feedstock layer thickness that is less than the coarse feedstock layer thickness, and solidifying a portion of the at least one fine feedstock layer to form the at least one solidified fine feedstock layer having a solidified fine feedstock layer thickness that is less than the solidified coarse feedstock layer thickness.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: February 27, 2024
    Assignee: ENTEGRIS, INC.
    Inventors: Thines Kumar Perumal, Subhash Guddati, Montray Leavy, Virendra Warke, Devon N. Dion
  • Publication number: 20230416154
    Abstract: A method for producing an article and a system associated with the method are provided. The method includes providing a green part, cooling the green part to a temperature below the freezing point of the ink to form a hardened mass and loosely-attached powder particles, and removing the loosely-attached powder particles. The green part includes powder particles, an ink, and optionally a binder. The loosely-attached powder particles removed from the green part may be recycled and reused.
    Type: Application
    Filed: June 27, 2023
    Publication date: December 28, 2023
    Inventors: Thines Kumar Perumal, Subhash Guddati, Aravind Vasanthakumar, Montray Leavy, Rocky Dean Gipson, Edward A. Sturm
  • Publication number: 20230390808
    Abstract: A device for cleaning substrates. The device comprises a polymeric pad, a frame body, and a coupling member. The polymeric pad has a top surface and a bottom surface. At least a portion of the frame body extends between the top surface and the bottom surface of the polymeric paid. A coupling member extends upwards from at least a portion of the frame body.
    Type: Application
    Filed: June 2, 2023
    Publication date: December 7, 2023
    Inventors: Subhash Guddati, Hyungjun Kim, Aravind Vasanthakumar, Thines Kumar Perumal, Montray Leavy
  • Publication number: 20230386868
    Abstract: A cleaning brush for a semiconductor fabrication process is provided. The cleaning brush includes a core and a brush member. The core includes a circumferential portion and a closed end portion. The circumferential portion surrounds a rotation axis of the cleaning brush and defines an inlet opening for receiving a fluid. The closed end portion is connected to an end of the circumferential portion that is opposite to the inlet opening along the rotation axis. At least one elongated conduit is defined within the core and fluidly communicated with the inlet opening, and the circumferential portion includes a plurality of outlet channels passing therethrough to fluidly communicate with the elongated conduit, the outlet channels being tilted outwardly toward the closed end portion. The brush member is connected to an outer surface of the circumferential portion and covers all of the outlet channels.
    Type: Application
    Filed: May 31, 2023
    Publication date: November 30, 2023
    Inventors: Aravind Vasanthakumar, Thines Kumar Perumal, Subhash Guddati, Montray Leavy
  • Publication number: 20230324933
    Abstract: A high pressure fluid storage device with a pressure sensing and regulating system configured for delivery of vaporized solid and liquid precursor materials at a regulated pressure range. At least some components of the pressure regulating system is contained internally within the storage device.
    Type: Application
    Filed: April 10, 2023
    Publication date: October 12, 2023
    Inventors: Thines Kumar Perumal, Aravind Vasanthakumar, Subhash Guddati, Montray Leavy, Sanado Barolli, Edward E. Jones
  • Publication number: 20230234878
    Abstract: Described is automated glass manufacturing equipment, and in particular to devices known as “takeout holders,” as well as systems that use the takeout holders and methods of making and using the takeout holders.
    Type: Application
    Filed: January 20, 2023
    Publication date: July 27, 2023
    Inventors: Manuel Frank Gonzales, Kellen Myers, LaVon Hayes, Subhash Guddati, Thines Kumar Perumal, Aravind Vasanthakumar, Montray Leavy
  • Publication number: 20230079446
    Abstract: Described are composite adsorption media that contain two or more different types of adsorbent material in binder, that may preferably be prepared by additive manufacturing techniques, as well as methods of preparing the structures by additive manufacturing methods.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 16, 2023
    Inventors: Rocky Dean Gipson, Ed A. Sturm, Subhash Guddati, Thines Kumar Perumal, Montray Leavy
  • Publication number: 20220234105
    Abstract: Described are three-dimensional structures that contain metal-organic-framework adsorbent material and that are prepared by additive manufacturing techniques, as well as methods of preparing the structures by additive manufacturing methods.
    Type: Application
    Filed: January 25, 2022
    Publication date: July 28, 2022
    Inventors: Edward A. Sturm, Oleg Byl, Montray Leavy, Subhash Guddati, Thines Kumar Perumal
  • Publication number: 20220208592
    Abstract: Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, and electrostatic chuck base components prepared by an additive manufacturing technique.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 30, 2022
    Inventors: Chandra VENKATRAMAN, Scott SIRIGNANO, Yan LIU, Subhash GUDDATI, Thines Kumar PERUMAL, Montray LEAVY, Jakub RYBCZYNSKI, Carlo WALDFRIED
  • Publication number: 20220184703
    Abstract: Described are three-dimensional multi-layer composite structures prepared by additive manufacturing techniques, as well as methods of preparing the structures by additive manufacturing techniques, wherein a multi-layer structure has layers of at least two different thicknesses and a precision thickness.
    Type: Application
    Filed: December 3, 2021
    Publication date: June 16, 2022
    Inventors: Thines Kumar PERUMAL, Subhash GUDDATI, Montray LEAVY, Virendra WARKE, Devon N. DION
  • Patent number: D1022364
    Type: Grant
    Filed: June 3, 2022
    Date of Patent: April 9, 2024
    Assignee: ENTEGRIS, INC.
    Inventors: Subhash Guddati, Hyungjun Kim, Aravind Vasanthakumar, Thines Kumar Perumal, Montray Leavy
  • Patent number: D1022365
    Type: Grant
    Filed: June 3, 2022
    Date of Patent: April 9, 2024
    Assignee: ENTEGRIS, INC.
    Inventors: Subhash Guddati, Hyungjun Kim, Aravind Vasanthakumar, Thines Kumar Perumal, Montray Leavy
  • Patent number: D1027345
    Type: Grant
    Filed: June 3, 2022
    Date of Patent: May 14, 2024
    Assignee: ENTEGRIS, INC.
    Inventors: Subhash Guddati, Hyungjun Kim, Aravind Vasanthakumar, Thines Kumar Perumal, Montray Leavy