Patents by Inventor Thinh Van Pham

Thinh Van Pham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a semiconductor package with conductive interconnect frame and structure
    Patent number: 9917039
    Abstract: A method of forming a packaged semiconductor device includes providing a conductive frame structure. The conductive frame structure includes a first frame having leadfingers configured for directly attaching to a semiconductor device, such as an integrated power semiconductor device that includes both power devices and logic type devices. The leadfingers are further configured to provide high current capacity and a high thermal dissipation capacity for the power device portion of the semiconductor device. In one embodiment, the conductive frame structure further includes a second frame joined to the first frame. The second frame includes a plurality of leads configured to electrically connect to low power device portions of the semiconductor device. A package body is formed to encapsulate the semiconductor device and at least portions of the leadfingers and leads.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: March 13, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Marc Alan Mangrum, Thinh Van Pham
  • METHOD OF FORMING A SEMICONDUCTOR PACKAGE WITH CONDUCTIVE INTERCONNECT FRAME AND STRUCTURE
    Publication number: 20170309554
    Abstract: A method of forming a packaged semiconductor device includes providing a conductive frame structure. The conductive frame structure includes a first frame having leadfingers configured for directly attaching to a semiconductor device, such as an integrated power semiconductor device that includes both power devices and logic type devices. The leadfingers are further configured to provide high current capacity and a high thermal dissipation capacity for the power device portion of the semiconductor device. In one embodiment, the conductive frame structure further includes a second frame joined to the first frame. The second frame includes a plurality of leads configured to electrically connect to low power device portions of the semiconductor device. A package body is formed to encapsulate the semiconductor device and at least portions of the leadfingers and leads.
    Type: Application
    Filed: April 20, 2016
    Publication date: October 26, 2017
    Applicant: Amkor Technology, Inc.
    Inventors: Marc Alan Mangrum, Thinh Van Pham