Abstract: The present disclosure relates to a modified epoxy resin having the formula (I): wherein R is R1, R2 or a combination of R1 and R2; R1 and R2 are independently alkylene group having 1 to 32 C atoms, branched alkylene group having 1 to 32 C atoms, cyclo-aliphatic group, substituted cycloaliphatic group, aromatic group, substituted aromatic group, biarylene or alkyl substituted biaryl group, cycloaliphatic-aromatic group or arylene-Z-arylene group; X and Y are independently O, —C(O)O—, or an amine group; Z is dicyclopentadiene; R3 and R4 are independently either H, alkyl group, branched alkyl group, alkoxy group, or substituted biaryl group; R4 and R3 optionally forming a fused aromatic ring or a fused hetero aromatic ring; n is 0 to 1 wherein concentration of n=0 monomer is greater than 75%; and N is 1-20.

Abstract: A glycidyl amine epoxy resin(s) and a process for production of glycidyl amine epoxy resin(s) are disclosed. The glycidyl amine epoxy resin(s) is/are free from Bisphenol A (BPA) and Bisphenol F (BPF) and are based on AMES negative amine precursors.

Abstract: The present disclosure relates to a modified epoxy resin having the formula (I): wherein R is R1, R2 or a combination of R1 and R2; R1 and R2 are independently alkyl group having 1 to 32 C atoms, branched alkyl group having 1 to 32 C atoms, Cyclo-aliphatic group, substituted cycloaliphatic group, aromatic group, substituted aromatic group, biaryl or alkyl substituted biaryl group, methyl bridged aromatic group, cycloaliphatic-aromatic group or Ar—Z—Ar group; X and Y are independently O, —C(O)O—, or an amine group. Z is dicyclopentadiene; R3 and R4 are independently either H, alkyl group, branched alkyl group, alkoxy group, substituted biaryl group or methyl bridged aromatic group; R4 and R3 optionally forming a fused aromatic ring or a fused hetero aromatic ring; n is 0 to 1 with n=0>75%; and N is 1-20.

Abstract: A glycidyl amine epoxy resin(s) and a process for production of glycidyl amine epoxy resin(s) are disclosed. The glycidyl amine epoxy resin(s) is/are free from Bisphenol A (BPA) and Bisphenol F (BPF) and are based on AMES negative amine precursors.

Abstract: The invention relates to an improved manufacturing process for the preparation of high 2,4?-dihydroxydiphenylmethane, by a process involving reaction of phenol and formaldehyde, in the presence of an inorganic polyprotic acid. According to this process, the reaction conditions are selected to favour a high yield of dihydroxydiphenylmethane, with a relatively high concentration of the 2,4?-isomer, by using a relatively low molar excess of phenol than conventional methods.

Abstract: The invention relates to an improved manufacturing process for the preparation of high 2, 4?-dihydroxydiphenylmethane, by a process involving reaction of phenol and formaldehyde, in the presence of an inorganic polyprotic acid. According to this process, the reaction conditions are selected to favour a high yield of dihydroxydiphenylmethane, with a relatively high concentration of the 2,4?-isomer, by using a relatively low molar excess of phenol than conventional methods.