Abstract: A system and method for enhancing image quality. The system and method acquire a machine learning model trained for correlating one or more training images and one or more training design images. The system and method receive one or more sample specimen images corresponding to one or more features of a sample specimen. The system and method enhance the one or more sample specimen images by generating one or more enhanced images with the machine learning model based on at least the one or more sample specimen images.

Abstract: Methods and systems for creating a sample of defects for a specimen are provided. One method includes detecting defects on a specimen based on output generated by a detector of an output acquisition subsystem. For the defects detected in an array region on the specimen, where the array region includes multiple array cell types, the method includes stacking information for the defects based on the multiple array cell types. The stacking includes overlaying design information for only a first of the multiple array cell types with the information for only the defects detected in the first of the multiple array cell types. In addition, the method includes selecting a portion of the detected defects based on results of the stacking thereby creating a sample of the detected defects.

Abstract: Methods and systems for creating a sample of defects for a specimen are provided. One method includes detecting defects on a specimen based on output generated by a detector of an output acquisition subsystem. For the defects detected in an array region on the specimen, where the array region includes multiple array cell types, the method includes stacking information for the defects based on the multiple array cell types. The stacking includes overlaying design information for only a first of the multiple array cell types with the information for only the defects detected in the first of the multiple array cell types. In addition, the method includes selecting a portion of the detected defects based on results of the stacking thereby creating a sample of the detected defects.

Abstract: Systems and methods are disclosed for storing dynamic layer content in a design file. A design file is received having design data corresponding to a plurality of process layers. A geometric operation formula is also received. A processor generates a polygon having dynamic layer content that is formed by applying the geometric operation formula on two or more of the plurality of process layers. The updated design file is stored, the design file now having a polygon having dynamic layer content.

Abstract: A method for automatically classifying one or more defects based on electrical design properties includes receiving one or more images of a selected region of a sample, receiving one or more sets of design data associated with the selected region of the sample, locating one or more defects in the one or more images of the selected region of the sample by comparing the one or more images of the selected region of the sample to the one or more sets of design data, retrieving one or more patterns of interest from the one or more sets of design data corresponding to the one or more defects, and classifying the one or more defects in the one or more images of the selected region of the sample based on one or more annotated electrical design properties included in the one or more patterns of interest.

Abstract: Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.

Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. In general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output. In addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.

Abstract: Methods and systems for dynamic design attributes for wafer inspection are provided. One method includes, at run time of a wafer inspection recipe, prompting a user of a wafer inspection tool on which the wafer inspection recipe is performed for information for a design based binning (DBB) process. The information includes one or more formulae for calculating design attributes from a design for a wafer. The design attributes are used to bin the defects in the DBB process. The method also includes performing inspection of a wafer according to an updated wafer inspection recipe. Performing the inspection includes binning defects detected on the wafer according to the DBB process in the updated wafer inspection recipe.

Abstract: A method for automatically classifying one or more defects based on electrical design properties includes receiving one or more images of a selected region of a sample, receiving one or more sets of design data associated with the selected region of the sample, locating one or more defects in the one or more images of the selected region of the sample by comparing the one or more images of the selected region of the sample to the one or more sets of design data, retrieving one or more patterns of interest from the one or more sets of design data corresponding to the one or more defects, and classifying the one or more defects in the one or more images of the selected region of the sample based on one or more annotated electrical design properties included in the one or more patterns of interest.

Abstract: Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.

Abstract: Systems and methods are disclosed for storing dynamic layer content in a design file. A design file is received having design data corresponding to a plurality of process layers. A geometric operation formula is also received. A processor generates a polygon having dynamic layer content that is formed by applying the geometric operation formula on two or more of the plurality of process layers. The updated design file is stored, the design file now having a polygon having dynamic layer content.

Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. In general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output. In addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.

Abstract: Methods and systems for dynamic design attributes for wafer inspection are provided. One method includes, at run time of a wafer inspection recipe, prompting a user of a wafer inspection tool on which the wafer inspection recipe is performed for information for a design based binning (DBB) process. The information includes one or more formulae for calculating design attributes from a design for a wafer. The design attributes are used to bin the defects in the DBB process. The method also includes performing inspection of a wafer according to an updated wafer inspection recipe. Performing the inspection includes binning defects detected on the wafer according to the DBB process in the updated wafer inspection recipe.