Patents by Inventor Thng Chong Kim

Thng Chong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
    Patent number: 10199426
    Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: February 5, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Optoelectronic modules that have shielding to reduce light leakage or stray light
    Patent number: 10186540
    Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: January 22, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES
    Publication number: 20180102394
    Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
    Type: Application
    Filed: December 1, 2017
    Publication date: April 12, 2018
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
    Patent number: 9859327
    Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: January 2, 2018
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES
    Publication number: 20170084663
    Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
    Type: Application
    Filed: December 2, 2016
    Publication date: March 23, 2017
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
    Patent number: 9543354
    Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: January 10, 2017
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES
    Publication number: 20150325613
    Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
    Type: Application
    Filed: June 18, 2015
    Publication date: November 12, 2015
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
    Patent number: 9094593
    Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: July 28, 2015
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES
    Publication number: 20150036046
    Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
    Type: Application
    Filed: July 24, 2014
    Publication date: February 5, 2015
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES
    Publication number: 20150034975
    Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
    Type: Application
    Filed: July 24, 2014
    Publication date: February 5, 2015
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong