Patents by Inventor Thom Augustin

Thom Augustin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080101037
    Abstract: Attachment mechanisms are surface-mounted to a PC board. An object is secured relative to said PC board by a retention device attached to the attachment mechanisms.
    Type: Application
    Filed: October 31, 2006
    Publication date: May 1, 2008
    Inventors: Thom Augustin, Lidia Warnes, Gary King Chan, Ricardo Ernesto Espinoza-Ibarra
  • Patent number: 7222043
    Abstract: An apparatus in one example comprises one or more control components that regulate one or more thermal test components to adjust one or more emulated operational characteristics for one or more electronic devices. The thermal test components are coupled with one or more rack-mount frames. The thermal test components create the emulated operational characteristics for the one or more electronic devices to generate one or more emulated environmental effects. The one or more control components obtain one or more measurements of one or more of the one or more emulated operational characteristics and the one or more emulated environmental effects. The one or more control components make a prediction of one or more of one or more actual operational characteristics and one or more actual environmental effects of the one or more electronic devices through employment of one or more of the one or more measurements.
    Type: Grant
    Filed: December 17, 2003
    Date of Patent: May 22, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Thom Augustin, Christopher Gregory Malone, Glenn Cochran Simon
  • Patent number: 7184925
    Abstract: An apparatus in one example comprises one or more control components that emulate one or more operational characteristics of one or more electronic devices through employment of one or more thermal components coupled with a frame.
    Type: Grant
    Filed: December 17, 2003
    Date of Patent: February 27, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Thom Augustin, Christopher Gregory Malone, Glenn Cochran Simon
  • Publication number: 20050133205
    Abstract: An apparatus in one example comprises one or more control components that emulate one or more operational characteristics of one or more electronic devices through employment of one or more thermal components coupled with a frame.
    Type: Application
    Filed: December 17, 2003
    Publication date: June 23, 2005
    Inventors: Thom Augustin, Christopher Malon, Glenn Simon
  • Publication number: 20050137824
    Abstract: An apparatus in one example comprises one or more control components that regulate one or more thermal test components to adjust one or more emulated operational characteristics for one or more electronic devices. The thermal test components are coupled with one or more rack-mount frames. The thermal test components create the emulated operational characteristics for the one or more electronic devices to generate one or more emulated environmental effects. The one or more control components obtain one or more measurements of one or more of the one or more emulated operational characteristics and the one or more emulated environmental effects. The one or more control components make a prediction of one or more of one or more actual operational characteristics and one or more actual environmental effects of the one or more electronic devices through employment of one or more of the one or more measurements.
    Type: Application
    Filed: December 17, 2003
    Publication date: June 23, 2005
    Inventors: Thom Augustin, Christopher Malone, Glenn Simon
  • Patent number: 6909606
    Abstract: An electronic device cooling system includes a heat exchange unit; at least one cooling interface disposed at a heat-transfer interface of an electronic device, where the cooling interface is thermally coupled to the heat exchange unit; and a heat exhaust that is thermally coupled to the heat exchange unit. The heat exhaust exhausts heat from the heat exchange unit to a remote location from the electronic device.
    Type: Grant
    Filed: August 8, 2003
    Date of Patent: June 21, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stephan K. Barsun, Thom Augustin
  • Publication number: 20050030716
    Abstract: An electronic device cooling system includes a heat exchange unit; at least one cooling interface disposed at a heat-transfer interface of an electronic device, where the cooling interface is thermally coupled to the heat exchange unit; and a heat exhaust that is thermally coupled to the heat exchange unit. The heat exhaust exhausts heat from the heat exchange unit to a remote location from the electronic device.
    Type: Application
    Filed: August 8, 2003
    Publication date: February 10, 2005
    Inventors: Stephan Barsun, Thom Augustin