Abstract: Methods of uniformly delayering an IC chip are disclosed. One embodiment includes: performing an ash on the wafer including an Al layer thereof and etching the Al layer; polishing an edge of the wafer using a slurry including an approximately 30 ?m polishing particles; removing the aluminum layer and at least one metal layer by polishing using a slurry including approximately 9 ?m diamond polishing particles and a non-abrasive backside of a polishing sheet; removing any remaining metal layers to a first metal layer by polishing using a slurry including approximately 3 ?m diamond polishing particles and the non-abrasive backside of a polishing sheet; removing any scratches by polishing using a slurry including approximately 1 ?m diamond polishing particles and the non-abrasive backside of a polishing sheet; and removing the first metal layer to a polyconductor layer by polishing using a colloidal slurry including approximately 0.25 ?m diamond polishing particles.

Abstract: Methods of uniformly delayering an IC chip are disclosed. One embodiment includes: performing an ash on the wafer including an Al layer thereof and etching the Al layer; polishing an edge of the wafer using a slurry including an approximately 30 ?m polishing particles; removing the aluminum layer and at least one metal layer by polishing using a slurry including approximately 9 ?m diamond polishing particles and a non-abrasive backside of a polishing sheet; removing any remaining metal layers to a first metal layer by polishing using a slurry including approximately 3 ?m diamond polishing particles and the non-abrasive backside of a polishing sheet; removing any scratches by polishing using a slurry including approximately 1 ?m diamond polishing particles and the non-abrasive backside of a polishing sheet; and removing the first metal layer to a polyconductor layer by polishing using a colloidal slurry including approximately 0.25 ?m diamond polishing particles.

Abstract: A method for preparing a transmission electron microscopy (TEM) sample for electron holography includes forming a sacrificial material over an area of interest on the sample, and polishing the sample to a desired thickness, wherein the area of interest is protected from rounding during the polishing. The sacrificial material is removed from the sample following the polishing.

Abstract: A microprocessor based engine control system for controlling heavy engine loads responds to a heavy load control signal (38), and manifold pressure (62), throttle blade position (34) and engine speed (74) signals from various sensors. All of this information is combined with engine control data from a Personality Programmable Read Only Memory (44) in a microprocessor (26) to generate an actuation signal to a delay means (132). The delay operates to hold the heavy load disconnected for a period of time to allow the engine to operate to increase its engine speed. After the delay or in those instances that the speed is great enough, the actuation signal operates a clutch (54) to connect the heavy load to the engine.