Abstract: In one embodiment, a method for cutting and taping a substrate includes providing a substrate having a first side, a second side opposite the first side, and a perimeter. A first flexible joint is created in the substrate by making a first cut through the first side to the second side making first and second sections. A first length of tape is located along at least a portion the first cut to secure the sections together. A second flexible joint is created in the substrate by making a second cut through the first side to the second side. A second length of tape may connect the additional sections created by the second cut.

Abstract: In one embodiment, a method for cutting and taping a substrate includes providing a substrate having a first side, a second side opposite the first side, and a perimeter. A first flexible joint is created in the substrate by making a first cut through the first side to the second side making first and second sections. A first length of tape is located along at least a portion the first cut to secure the sections together. A second flexible joint is created in the substrate by making a second cut through the first side to the second side. A second length of tape may connect the additional sections created by the second cut.

Abstract: Test architectures for multi-die chips are provided herein according to embodiments of the present disclosure. In certain aspects, an exemplary test architecture enables an external tester to perform various tests on a multi-die chip that includes multiple dies. In a first test mode, the test architecture enables the external tester to currently perform die-level tests on the multiple dies. In a second test mode, the test architecture enables the external tester to perform a chip-level test on the multi-die chip. The chip-level test may include die-to-die tests for testing interconnections between the multiple dies on the multi-die chip. The chip-level test may also include a boundary input/output (I/O) test for testing external connections between the multi-die chip and one or more devices external to the multi-die chip.

Abstract: In one embodiment, a method includes accessing, from a data store of the communication network, user information associated with a first user of the communication network, identifying one or more entities associated with the communication network that are relevant to the first user based on the user information, and retrieving, for each identified entity, one or more content frames associated with the entity. The method includes ranking the one or more content frames based on the user information. The method also includes sending, to a client device of the first user, one or more of the content frames for display to the first user in ranked order, wherein each content frame is selectable by the first user to display the selected content frame in association with a particular content item for a specified period of time.

Abstract: Two electromagnetic interference (EMI) controlling tape application methodologies for unshielded twisted pair (UTP) cable include Fixed Tape Control (FTC) and Oscillating Tape Control (OTC). In FTC, tape application angle and edge placement are controlled to maintain position of the tape edges over a base of nonconductive filler in the cable. In OTC, the tape application angle is continuously varied, resulting in crossing of the tape edges over all of the pairs of conductors with varying periodicity. In both implementations, the filler allows a cylindrical shape.

Abstract: A rotary motion switching apparatus is usable with a circuit interrupter and employs an attachment system in order to resist removal of the rotary motion switching apparatus from the circuit interrupter. The attachment system has three connectors that are engaged with an exterior surface of a housing of the circuit interrupter. The portions of the housing that are engaged by the three connectors are pre-existing portions of the exterior surface of the housing of the circuit interrupter.

Abstract: The present application provides processes for making pesticidal compounds and compounds useful both as pesticides and in the making of pesticidal compounds.

Abstract: A rotary motion switching apparatus is usable with a circuit interrupter that is situated in a NEMA box or other box and employs an attachment system. An access port that is formed in a wall of the NEMA box or other box permits a shaft having a handle at an end thereof to be connected with the rotary motion switching apparatus. The rotary motion switching apparatus includes a universal joint on a rotational component that enables operation of the handle and shaft without binding on the wall of the NEMA or other box even if the access port in the box is offset from an axis of rotation of the rotational component.

Abstract: A rotary motion switching apparatus is usable with a circuit interrupter and employs an attachment system having a pair of connectors that are received in a pair of openings formed in a housing of a circuit interrupter and that are affixed to the housing within the openings in order to resist removal of the rotary motion switching apparatus from the circuit interrupter. The openings are pre-existing in the housing of the circuit interrupter and are provided to enable access by tools with terminals of the circuit interrupter to which load wires and the like are connectable. The connectors thus secure the rotary motion switching apparatus to the circuit interrupter by using openings that are already formed in the circuit interrupter and thus the rotary motion switching apparatus is usable without requiring a modification to the housing or to the molds that are employed to form the housing.

Abstract: A one finger golf glove is formed as a unitary pattern from a single sheet of material, the unitary pattern including a palm portion arranged at the palm of the golfer's hand and a finger portion arranged at the middle finger and ring finger of the golfer's hand. The glove includes a finger sleeve arranged to receive only the middle finger of the golfer's hand. A strap extends from the palm portion and is sized to extend across the back of the golfer's hand, through a slot in the glove and around the golfer's wrist.

Abstract: Two electromagnetic interference (EMI) controlling tape application methodologies for unshielded twisted pair (UTP) cable include Fixed Tape Control (FTC) and Oscillating Tape Control (OTC). In FTC, tape application angle and edge placement are controlled to maintain position of the tape edges over a base of nonconductive filler in the cable. In OTC, the tape application angle is continuously varied, resulting in crossing of the tape edges over all of the pairs of conductors with varying periodicity. In both implementations, the filler allows a cylindrical shape.

Abstract: A system is described to facilitate the characterization of particles within a fluid contained in a vessel using an illumination system that directs source light through each vessel. One or more optical elements may be implemented to refract the source light and to illuminate the entire volume of the vessel. As the refracted source light passes through the vessel and interacts with particles suspended in the fluid, scattered light is produced and directed to an imager, while the refracted source light is diverted away from the imager to prevent the source light from drowning out the scattered light. The system can therefore advantageously utilize an imager with a large depth of field to accurately image the entire volume of fluid at the same time, facilitating the determination of the number and size of particles suspended in the fluid.

Abstract: Test architectures for multi-die chips are provided herein according to embodiments of the present disclosure. In certain aspects, an exemplary test architecture enables an external tester to perform various tests on a multi-die chip that includes multiple dies. In a first test mode, the test architecture enables the external tester to currently perform die-level tests on the multiple dies. In a second test mode, the test architecture enables the external tester to perform a chip-level test on the multi-die chip. The chip-level test may include die-to-die tests for testing interconnections between the multiple dies on the multi-die chip. The chip-level test may also include a boundary input/output (I/O) test for testing external connections between the multi-die chip and one or more devices external to the multi-die chip.

Abstract: An electrical receptacle assembly is for a power inlet apparatus of an electrical system. The power inlet apparatus includes a housing. The electrical system has a power source and a transfer switch. The electrical receptacle assembly includes an electrical receptacle structured to be mechanically coupled to the housing and electrically connected with the power source and the transfer switch, and an indication assembly mechanically coupled to and electrically connected with the electrical receptacle. The indication assembly has a status indicator adapted to provide an indication of circuit status within the electrical system.

Abstract: An electrical receptacle assembly is for a power inlet apparatus of an electrical system. The power inlet apparatus includes a housing. The electrical system has a power source and a transfer switch. The electrical receptacle assembly includes an electrical receptacle structured to be mechanically coupled to the housing and electrically connected with the power source and the transfer switch, and an indication assembly mechanically coupled to and electrically connected with the electrical receptacle. The indication assembly has a status indicator adapted to provide an indication of circuit status within the electrical system.

Abstract: Circuits and methods for loopback testing are provided. A die incorporates a receiver (RX) to each transmitter (TX) as well as a TX to each RX. This architecture is applied to each bit so, e.g., a die that transmits or receives 32 data bits during operation would have 32 transceivers (one for each bit). Focusing on one of the transceivers, a loopback architecture includes a TX data path and an RX data path that are coupled to each other through an external contact, such as a via at the transceiver. The die further includes a transmit clock tree feeding the TX data path and a receive clock tree feeding the RX data path. The transmit clock tree feeds the receive clock tree through a conductive clock node that is exposed on a surface of the die. Some systems further include a variable delay in the clock path.

Abstract: The present application provides processes for making pesticidal compounds and compounds useful both as pesticides and in the making of pesticidal compounds.

Abstract: Two electromagnetic interference (EMI) controlling tape application methodologies for unshielded twisted pair (UTP) cable include Fixed Tape Control (FTC) and Oscillating Tape Control (OTC). In FTC, tape application angle and edge placement are controlled to maintain position of the tape edges over a base of nonconductive filler in the cable. In OTC, the tape application angle is continuously varied, resulting in crossing of the tape edges over all of the pairs of conductors with varying periodicity. In both implementations, the filler allows a cylindrical shape.