Abstract: A polishing pad or other shaped article for the electrochemical mechanical polishing (ECMP) of a workpiece. The article includes an electrically-conductive compound which is formed into a layer. The compound is formulated as an admixture which includes a polymeric component forming a continuous phase in the layer, and an electrically-conductive filler component forming a discrete phase within the continuous phase. With the workpiece and the layer being electrically connected and with an electrical bias being applied between the workpiece and the layer, the bias being capable of activating an electrochemical reaction, the compound exhibits an overpotential for the activation of the reaction greater than the bias.

Abstract: An enclosure for housing circuitry of an electronic device including at least one enclosure part, and a shielding layer on the part. The enclosure part has an exterior surface and an opposing interior surface defining a wall therebetween, and is formed of a plastic material which is generally transparent. The shielding layer is provided to cover at least a portion of the interior surface of the enclosure part. The layer is formulated to provide EMI shielding for the circuitry housed within the enclosure, and as coated or otherwise applied to the interior surface is visually perceptible through the exterior surface of the enclosure part for enhancing the cosmetic appearance of the enclosure.

Abstract: A polishing pad or other shaped article for the electrochemical mechanical polishing (ECMP) of a workpiece. The article includes an electrically-conductive compound which is formed into a layer. The compound is formulated as an admixture which includes a polymeric component forming a continuous phase in the layer, and an electrically-conductive filler component forming a discrete phase within the continuous phase. With the workpiece and the layer being electrically connected and with an electrical bias being applied between the workpiece and the layer, the bias being capable of activating an electrochemical reaction, the compound exhibits an overpotential for the activation of the reaction greater than the bias.

Abstract: An enclosure for housing circuitry of an electronic device including at least one enclosure part, and a shielding layer on the part. The enclosure part has an exterior surface and an opposing interior surface defining a wall therebetween, and is formed of a plastic material which is generally transparent. The shielding layer is provided to cover at least a portion of the interior surface of the enclosure part. The layer is formulated to provide EMI shielding for the circuitry housed within the enclosure, and as coated or otherwise applied to the interior surface is visually perceptible through the exterior surface of the enclosure part for enhancing the cosmetic appearance of the enclosure.