Patents by Inventor Thomas A. Degenkolb
Thomas A. Degenkolb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9621874Abstract: A multiple imager camera includes a block, an imager, and an alignment apparatus. The block is configured to direct an image to a plurality of imagers located proximate to a plurality of apertures defined by the block. The imager of the plurality of imagers is configured to receive the image through an aperture of the plurality of apertures. The alignment apparatus is interposed between the block and the imager. The alignment apparatus is configured to allow for six degrees of freedom to align the imager with the image. The six degrees of freedom include adjustment along a x-axis, a y-axis, and a z-axis of the aperture, and adjustment about a pitch-axis, a yaw-axis, and a roll-axis of the aperture. The alignment apparatus is further configured to fixedly couple the imager to the block after the imager is aligned with the image.Type: GrantFiled: August 29, 2014Date of Patent: April 11, 2017Assignee: Delphi Technologies, Inc.Inventors: Daniel Leong Woon Loong, Kok Wee Yeo, Yew Kwang Low, Ronald M. Taylor, Thomas A. Degenkolb, Ward K. Everly, Morgan D. Murphy
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Patent number: 9506803Abstract: An optical sensor system adapted to operate through a window of a vehicle includes a lens, a plurality of optoelectronic devices, and an optical device. The lens is configured to direct light from a field-of-view toward a focal plane. The plurality of optoelectronic devices are arranged proximate to the focal plane. The plurality of optoelectronic devices includes a first optoelectronic device operable to detect an image from a first portion of the field-of-view, and a second optoelectronic device operable to detect light from a second portion of the field-of-view distinct from the first portion. The optical device is configured to direct light from outside the field-of-view toward the second portion.Type: GrantFiled: September 17, 2014Date of Patent: November 29, 2016Assignee: Delphi Technologies, Inc.Inventors: Yew Kwang Low, Kok Wee Yeo, Thomas A. Degenkolb, Ronald M. Taylor, Ward K. Everly, Morgan D. Murphy
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Publication number: 20160076934Abstract: An optical sensor system adapted to operate through a window of a vehicle includes a lens, a plurality of optoelectronic devices, and an optical device. The lens is configured to direct light from a field-of-view toward a focal plane. The plurality of optoelectronic devices are arranged proximate to the focal plane. The plurality of optoelectronic devices includes a first optoelectronic device operable to detect an image from a first portion of the field-of-view, and a second optoelectronic device operable to detect light from a second portion of the field-of-view distinct from the first portion. The optical device is configured to direct light from outside the field-of-view toward the second portion.Type: ApplicationFiled: September 17, 2014Publication date: March 17, 2016Inventors: YEW KWANG LOW, KOK WEE YEO, THOMAS A. DEGENKOLB, RONALD M. TAYLOR, WARD K. EVERLY, MORGAN D. MURPHY
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Publication number: 20160065940Abstract: A multiple imager camera includes a block, an imager, and an alignment apparatus. The block is configured to direct an image to a plurality of imagers located proximate to a plurality of apertures defined by the block. The imager of the plurality of imagers is configured to receive the image through an aperture of the plurality of apertures. The alignment apparatus is interposed between the block and the imager. The alignment apparatus is configured to allow for six degrees of freedom to align the imager with the image. The six degrees of freedom include adjustment along a x-axis, a y-axis, and a z-axis of the aperture, and adjustment about a pitch-axis, a yaw-axis, and a roll-axis of the aperture. The alignment apparatus is further configured to fixedly couple the imager to the block after the imager is aligned with the image.Type: ApplicationFiled: August 29, 2014Publication date: March 3, 2016Inventors: DANIEL LEONG WOON LOONG, KOK WEE YEO, YEW KWANG LOW, RONALD M. TAYLOR, THOMAS A. DEGENKOLB, WARD K. EVERLY, MORGAN D. MURPHY
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Patent number: 8471380Abstract: An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.Type: GrantFiled: September 9, 2011Date of Patent: June 25, 2013Assignee: Delphi Technologies, Inc.Inventors: Scott D. Brandenburg, Suresh K. Chengalva, Thomas A. Degenkolb
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Publication number: 20120001319Abstract: An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.Type: ApplicationFiled: September 9, 2011Publication date: January 5, 2012Applicant: DELPHI TECHNOLOGIES, INC.Inventors: SCOTT D. BRANDENBURG, SURESH K. CHENGALVA, THOMAS A. DEGENKOLB
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Patent number: 8026597Abstract: An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.Type: GrantFiled: December 17, 2008Date of Patent: September 27, 2011Assignee: Delphi Technologies, Inc.Inventors: Scott D. Brandenburg, Suresh K. Chengalva, Thomas A. Degenkolb
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Patent number: 7759778Abstract: A leaded semiconductor power module includes a first heatsink, an electrically insulated substrate thermally coupled to the first heatsink, one or more semiconductor chips, a leadframe substrate, and a second heatsink thermally coupled to the leadframe substrate, the assembly being overmolded with an encapsulant to expose the first heatsink, the second heatsink and peripheral terminals of the leadframe substrate. The semiconductor chips are electrically and structurally coupled to both the insulated substrate and the leadframe substrate, and conductive spacers electrically and structurally couple the insulated substrate to the leadframe substrate.Type: GrantFiled: September 15, 2008Date of Patent: July 20, 2010Assignee: Delphi Technologies, Inc.Inventors: Michael J. Lowry, Eric A. Brauer, Thomas A. Degenkolb, Victor C. M. Wong
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Publication number: 20100065950Abstract: A leaded semiconductor power module includes a first heatsink, an electrically insulated substrate thermally coupled to the first heatsink, one or more semiconductor chips, a leadframe substrate, and a second heatsink thermally coupled to the leadframe substrate, the assembly being overmolded with an encapsulant to expose the first heatsink, the second heatsink and peripheral terminals of the leadframe substrate. The semiconductor chips are electrically and structurally coupled to both the insulated substrate and the leadframe substrate, and conductive spacers electrically and structurally couple the insulated substrate to the leadframe substrate.Type: ApplicationFiled: September 15, 2008Publication date: March 18, 2010Inventors: Michael J. Lowry, Eric A. Brauer, Thomas A. Degenkolb, Victor C.M. Wong
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Patent number: 7621757Abstract: An electrical connector assembly and method of connecting an electrical connector to a substrate are provided. The electrical connector assembly includes a substrate having first electrical circuitry formed on a surface, an elastomer, and second electrical circuitry disposed at least partially between the substrate and the elastomer. Elements of the second electrical circuitry are pressed into contact with contact pads of the first electrical circuitry. The electrical connector assembly also includes a holder securing the elastomer in a compressed state to provide a pressure contact between the circuit elements and the contact pads.Type: GrantFiled: June 23, 2006Date of Patent: November 24, 2009Assignee: Delphi Technologies, Inc.Inventors: Scott D. Brandenburg, Thomas A. Degenkolb
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Patent number: 7616448Abstract: An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly.Type: GrantFiled: September 14, 2007Date of Patent: November 10, 2009Assignee: Delphi Technologies, Inc.Inventors: Thomas A. Degenkolb, Scott D. Brandenburg, Larry M. Mandel, Kin Yean Chow, Ching Meng Fang, Sim Ying Yong
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Patent number: 7537464Abstract: An electrical connector assembly and method of connecting an electrical connector to a substrate are provided. The electrical connector assembly includes a substrate having electrical circuitry, a shroud, and a plurality of conductive pins. The conductive pins are pressed into contact with contact pads of the electrical circuitry. The electrical connector assembly also includes an overmolding material securing the shroud such that the conductive pins contact the electrical circuitry.Type: GrantFiled: June 23, 2006Date of Patent: May 26, 2009Assignee: Delphi Technologies, Inc.Inventors: Scott D. Brandenburg, Thomas A. Degenkolb
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Publication number: 20090108439Abstract: An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.Type: ApplicationFiled: December 17, 2008Publication date: April 30, 2009Inventors: Scott D. Brandenburg, Suresh K. Chengalva, Thomas A. Degenkolb
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Publication number: 20090073663Abstract: An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly.Type: ApplicationFiled: September 14, 2007Publication date: March 19, 2009Inventors: Thomas A. Degenkolb, Scott D. Brandenburg, Larry M. Mandel, Kin Yean Chow, Ching Meng Fang, Sim Ying Yong
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Patent number: 7485957Abstract: An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.Type: GrantFiled: January 17, 2007Date of Patent: February 3, 2009Assignee: Delphi Technologies, Inc.Inventors: Scott D. Brandenburg, Suresh K. Chengalva, Thomas A. Degenkolb
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Patent number: 7447041Abstract: An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to establish compression electrical connections between the electrodes and corresponding electrically conductive elements.Type: GrantFiled: March 1, 2007Date of Patent: November 4, 2008Assignee: Delphi Technologies, Inc.Inventors: Scott D. Brandenburg, Thomas A. Degenkolb, Shing Yeh
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Patent number: 7422448Abstract: A surface mount connector and assembly including the surface mount connector is shown and described. The assembly comprises a substrate and a connector including a carrier, and at least one electrical connecting element having first and second ends, wherein at least a portion of the first end extends through the carrier to electrically adjoin and physically secure the connector to the substrate. A reinforcement medium is disposed about at least a portion of surface mount connector and said substrate.Type: GrantFiled: July 28, 2005Date of Patent: September 9, 2008Assignee: Delphi Technologies, Inc.Inventors: Scott D. Brandenburg, Thomas A. Degenkolb, Matthew R. Walsh
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Publication number: 20080212296Abstract: An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to establish compression electrical connections between the electrodes and corresponding electrically conductive elements.Type: ApplicationFiled: March 1, 2007Publication date: September 4, 2008Applicant: DELPHI TECHNOLOGIES, INC.Inventors: Scott D. Brandenburg, Thomas A. Degenkolb, Shing Yeh
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Patent number: 7364684Abstract: A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that surrounds the package components. Preferably, the encapsulant channels are defined in part by heat producing components of the package so that coolant fluid directly contacts such components. The coolant fluid can be electrically conductive or non-conductive depending on the type of components being cooled. The coolant channels are formed by insert-molding a form in the encapsulant, and removing the form following the molding process. Alternately, the encapsulant is formed in two or more pieces that are joined to form the package, and the coolant channels are defined by recesses formed in at least one of the encapsulant pieces.Type: GrantFiled: August 16, 2004Date of Patent: April 29, 2008Assignee: Delphi Technologies, Inc.Inventors: Scott D. Brandenburg, Suresh K. Chengalva, Thomas A. Degenkolb
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Patent number: 7324342Abstract: An electronics assembly is provided having a carrier that provides a controlled height variability between electronics packages and a heat sink device. The electronics assembly includes a substrate and electronics packages connected to the substrate. The assembly also includes a heat sink device positioned in thermal communication with a first side of the electronics packages. The assembly further includes a carrier disposed between the substrate and the heat sink device. The carrier has a resilient wall that biases the electronics packages towards the heat sink device such that a controlled bond line is provided between the first side of the electronics packages and the heat sink device.Type: GrantFiled: October 19, 2005Date of Patent: January 29, 2008Assignee: Delphi Technologies, Inc.Inventors: Ralph S. Taylor, Thomas A. Degenkolb, Loren H. Rasmussen