Abstract: A substrate includes a metal portion and an underplate that is laser sintered to the metal portion. The metal portion has a melting point that is lower than a sintering temperature of the underplate.

Abstract: A multi-layer substrate includes a ground structure, a plurality of dielectric layers on the ground structure and a plurality of conductive layers separating the plurality of dielectric layers. The conductive layers include a first conductive layer and a second conductive layer and a connection electrically coupling the first conductive layer and the second conductive layer. The first conductive layer and the ground structure are configured to define a first parasitic capacitance there between and the first conductive layer and the second conductive layer are configured to define a second, negating parasitic capacitance there between.

Abstract: An optical voltage converter has an emitter array and a receiver array. Each of the emitter array and the receiver array have at least one LED. The LEDs are arranged such that light from the emitter LED directly strikes the receiver LED.

Abstract: A multi-layer substrate includes a ground structure, a plurality of dielectric layers on the ground structure and a plurality of conductive layers separating the plurality of dielectric layers. The conductive layers include a first conductive layer and a second conductive layer and a connection electrically coupling the first conductive layer and the second conductive layer. The first conductive layer and the ground structure are configured to define a first parasitic capacitance there between and the first conductive layer and the second conductive layer are configured to define a second, negating parasitic capacitance there between.

Abstract: According to one non-limiting embodiment, a low conductive emission substrate includes a plurality of thin high dielectric strength insulating layers separated by a corresponding plurality of conductive layers, wherein one of the plurality of conductive layers is shorted to another one of the plurality of conductive layers.

Abstract: A semiconductor device includes an inorganic coating layer to at least partially cover a junction termination extension.

Abstract: A substrate includes a metal portion and an underplate that is laser sintered to the metal portion. The metal portion has a melting point that is lower than a sintering temperature of the underplate.

Abstract: An optical voltage converter has an emitter array and a receiver array. Each of the emitter array and the receiver array have at least one LED. The LEDs are arranged such that light from the emitter LED directly strikes the receiver LED.

Abstract: A passive electrical component includes an inorganic dielectric coating layer laser applied to a conductor layer.

Abstract: A passive electrical component includes an inorganic dielectric coating layer laser applied to a conductor layer.

Abstract: A passive electrical component includes an inorganic dielectric coating layer laser applied to a conductor layer.

Abstract: A high power DC-DC converter uses wide bandgap semiconductor switches and capacitors as a charge pump to convert a DC input to a DC output of a different potential. Each capacitor is connected to the output of one of the stages of the charge pump. A wide bandgap semiconductor switch is connected between the input and output of each stage, and the conductive state of the switch is controlled by a circuit that compares voltage at the input and output of the stage. A multiphase drive alternates drive voltage applied to the capacitors to cause charge to be passed from stage-to-stage through the charge pump.

Abstract: A semiconductor device includes an inorganic coating layer to at least partially cover a junction termination extension.

Abstract: According to one non-limiting embodiment, a low conductive emission substrate includes a plurality of thin high dielectric strength insulating layers separated by a corresponding plurality of conductive layers, wherein one of the plurality of conductive layers is shorted to another one of the plurality of conductive layers.

Abstract: A method of forming multiple bonds on an electronic device includes heating first bonding metals at a predetermined temperature to form a first bond comprising a first melting temperature above the predetermined temperature. The first bond and second bonding metals are then heated at the predetermined temperature to form a second bond comprising a second melting temperature above the predetermined temperature.

Abstract: A voltage excursion control system for limiting transient voltage peaks in electrical circuits otherwise occurring across selected components therein in response to changing conditions in such circuits has a plurality of silicon carbide diode dice series-interconnected in a succession such that each cathode region of each die face toward a common end of the succession. First and second electrically conductive electrodes are each electrically interconnected with a corresponding one of the dice at opposite ends of the succession.

Abstract: A high-temperature, regulated power supply uses wide band gap transistors to drive a Royer circuit. Pulses output from the Royer circuit are gated through a pulse width modulator to control the duty cycle of wide band gap transistors that drive an output transformer. The output of the transformer is rectified and filtered to provide the regulated D.C. output voltage. Regulation is accomplished by sampling the output voltage, comparing it to a reference voltage and using the difference between the output voltage and the reference voltage to control the pulse width modulator. High temperature operability is provided by using wide band gap transistors and iron or steel core transformers. This technique also provides a radiation hard assembly.