Patents by Inventor Thomas A. Kim

Thomas A. Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11444043
    Abstract: Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: September 13, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Thomas A Kim, Tae Sung Jeong
  • Patent number: 11165137
    Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: November 2, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Thomas A. Kim, Ho Kyung Kang
  • Patent number: 10965028
    Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: March 30, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Ki Ryoo, Sang Hyun Kim, Seung Goo Jang, Thomas A. Kim, Hong In Kim, Nam Ki Kim
  • Publication number: 20200335851
    Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In KIM, Thomas A. KIM, Ho Kyung KANG
  • Patent number: 10784564
    Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: September 22, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Thomas A. Kim, Ho Kyung Kang
  • Patent number: 10770793
    Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: September 8, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Ki Ryoo, Sang Hyun Kim, Seung Goo Jang, Thomas A. Kim, Hong In Kim, Nam Ki Kim
  • Patent number: 10707556
    Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: July 7, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Thomas A. Kim, Ho Kyung Kang
  • Patent number: 10679955
    Abstract: A semiconductor package includes a substrate portion including a core layer having a device accommodating portion formed therein, and a buildup layer stacked on each of opposing sides of the core layer; an electronic device disposed in the device accommodating portion; and heat dissipating conductors disposed in the buildup layer to externally emit heat generated by the electronic device.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: June 9, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hyun Kim, Thomas A. Kim, Kyu Bum Han
  • Patent number: 10622313
    Abstract: A shielded electronic device module includes a substrate that includes a first conductive member and a second conductive member separated from each other, a metal housing covering a mounting space on the substrate and connected to the first conductive member and the second conductive member, and a first terminal and a second terminal disposed on a surface of the substrate and connected to the first conductive member and the second conductive member.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: April 14, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Thomas A Kim, Chang Moo Jung, Kyung In Kang
  • Publication number: 20200112100
    Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.
    Type: Application
    Filed: November 26, 2019
    Publication date: April 9, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Ki RYOO, Sang Hyun KIM, Seung Goo JANG, Thomas A. KIM, Hong In KIM, Nam Ki KIM
  • Publication number: 20200091585
    Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
    Type: Application
    Filed: November 25, 2019
    Publication date: March 19, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In KIM, Thomas A. KIM, Ho Kyung KANG
  • Patent number: 10595413
    Abstract: A printed circuit board includes a board portion and an electronic element. The board portion includes a first substrate having an element accommodating portion and second substrates laminated on outer surfaces of the first substrate. The electronic element is disposed in the element accommodating part. The electronic element includes a heat generating element and a heat radiating member coupled to an inactive surface of the heat generating element.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: March 17, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Se Jong Kim, Won Gi Kim, Thomas A Kim, Jeong Hae Kim
  • Publication number: 20190334224
    Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
    Type: Application
    Filed: July 5, 2019
    Publication date: October 31, 2019
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In KIM, Thomas A. KIM, Ho Kyung KANG
  • Publication number: 20190267338
    Abstract: Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.
    Type: Application
    Filed: May 10, 2019
    Publication date: August 29, 2019
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong In KIM, Thomas A KIM, Tae Sung JEONG
  • Patent number: 10396432
    Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: August 27, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Thomas A Kim, Ho Kyung Kang
  • Patent number: 10340234
    Abstract: Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: July 2, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Thomas A Kim, Tae Sung Jeong
  • Publication number: 20190198995
    Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.
    Type: Application
    Filed: May 31, 2018
    Publication date: June 27, 2019
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Ki RYOO, Sang Hyun KIM, Seung Goo JANG, Thomas A. KIM, Hong In KIM, Nam Ki KIM
  • Patent number: 10170410
    Abstract: A semiconductor package includes a frame having a through hole, an electronic component disposed in the through hole, a metal layer disposed on either one or both of an inner surface of the frame and an upper surface of the electronic component, a redistribution portion disposed below the frame and the electronic component, and a conductive layer connected to the metal layer.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: January 1, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hyun Kim, Thomas A. Kim, Kyu Bum Han, Tae Hoon Kim
  • Publication number: 20180286822
    Abstract: Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.
    Type: Application
    Filed: October 20, 2017
    Publication date: October 4, 2018
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong In KIM, Thomas A KIM, Tae Sung JEONG
  • Patent number: 10068855
    Abstract: A semiconductor package includes a frame including a through-hole, an electronic component disposed in the through-hole, a redistribution portion disposed below the frame and the electronic component, a metal layer disposed on an inner surface of the frame, and a conductive layer disposed between the metal layer and the electronic component, and covering the frame and the electronic component.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: September 4, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hyun Kim, Thomas A. Kim, Kyu Bum Han, Kwan Hoo Son