Patents by Inventor Thomas A. Kim
Thomas A. Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11444043Abstract: Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.Type: GrantFiled: May 10, 2019Date of Patent: September 13, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hong In Kim, Thomas A Kim, Tae Sung Jeong
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Patent number: 11165137Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.Type: GrantFiled: June 30, 2020Date of Patent: November 2, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hong In Kim, Thomas A. Kim, Ho Kyung Kang
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Patent number: 10965028Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.Type: GrantFiled: November 26, 2019Date of Patent: March 30, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jeong Ki Ryoo, Sang Hyun Kim, Seung Goo Jang, Thomas A. Kim, Hong In Kim, Nam Ki Kim
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Publication number: 20200335851Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.Type: ApplicationFiled: June 30, 2020Publication date: October 22, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Hong In KIM, Thomas A. KIM, Ho Kyung KANG
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Patent number: 10784564Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.Type: GrantFiled: November 25, 2019Date of Patent: September 22, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hong In Kim, Thomas A. Kim, Ho Kyung Kang
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Patent number: 10770793Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.Type: GrantFiled: May 31, 2018Date of Patent: September 8, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jeong Ki Ryoo, Sang Hyun Kim, Seung Goo Jang, Thomas A. Kim, Hong In Kim, Nam Ki Kim
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Patent number: 10707556Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.Type: GrantFiled: July 5, 2019Date of Patent: July 7, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hong In Kim, Thomas A. Kim, Ho Kyung Kang
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Patent number: 10679955Abstract: A semiconductor package includes a substrate portion including a core layer having a device accommodating portion formed therein, and a buildup layer stacked on each of opposing sides of the core layer; an electronic device disposed in the device accommodating portion; and heat dissipating conductors disposed in the buildup layer to externally emit heat generated by the electronic device.Type: GrantFiled: October 19, 2017Date of Patent: June 9, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Hyun Kim, Thomas A. Kim, Kyu Bum Han
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Patent number: 10622313Abstract: A shielded electronic device module includes a substrate that includes a first conductive member and a second conductive member separated from each other, a metal housing covering a mounting space on the substrate and connected to the first conductive member and the second conductive member, and a first terminal and a second terminal disposed on a surface of the substrate and connected to the first conductive member and the second conductive member.Type: GrantFiled: October 6, 2016Date of Patent: April 14, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Thomas A Kim, Chang Moo Jung, Kyung In Kang
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Publication number: 20200112100Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.Type: ApplicationFiled: November 26, 2019Publication date: April 9, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jeong Ki RYOO, Sang Hyun KIM, Seung Goo JANG, Thomas A. KIM, Hong In KIM, Nam Ki KIM
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Publication number: 20200091585Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.Type: ApplicationFiled: November 25, 2019Publication date: March 19, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Hong In KIM, Thomas A. KIM, Ho Kyung KANG
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Patent number: 10595413Abstract: A printed circuit board includes a board portion and an electronic element. The board portion includes a first substrate having an element accommodating portion and second substrates laminated on outer surfaces of the first substrate. The electronic element is disposed in the element accommodating part. The electronic element includes a heat generating element and a heat radiating member coupled to an inactive surface of the heat generating element.Type: GrantFiled: April 14, 2017Date of Patent: March 17, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Se Jong Kim, Won Gi Kim, Thomas A Kim, Jeong Hae Kim
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Publication number: 20190334224Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.Type: ApplicationFiled: July 5, 2019Publication date: October 31, 2019Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Hong In KIM, Thomas A. KIM, Ho Kyung KANG
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Publication number: 20190267338Abstract: Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.Type: ApplicationFiled: May 10, 2019Publication date: August 29, 2019Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hong In KIM, Thomas A KIM, Tae Sung JEONG
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Patent number: 10396432Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.Type: GrantFiled: November 20, 2017Date of Patent: August 27, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hong In Kim, Thomas A Kim, Ho Kyung Kang
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Patent number: 10340234Abstract: Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.Type: GrantFiled: October 20, 2017Date of Patent: July 2, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hong In Kim, Thomas A Kim, Tae Sung Jeong
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Publication number: 20190198995Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.Type: ApplicationFiled: May 31, 2018Publication date: June 27, 2019Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jeong Ki RYOO, Sang Hyun KIM, Seung Goo JANG, Thomas A. KIM, Hong In KIM, Nam Ki KIM
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Patent number: 10170410Abstract: A semiconductor package includes a frame having a through hole, an electronic component disposed in the through hole, a metal layer disposed on either one or both of an inner surface of the frame and an upper surface of the electronic component, a redistribution portion disposed below the frame and the electronic component, and a conductive layer connected to the metal layer.Type: GrantFiled: May 19, 2017Date of Patent: January 1, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Hyun Kim, Thomas A. Kim, Kyu Bum Han, Tae Hoon Kim
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Publication number: 20180286822Abstract: Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.Type: ApplicationFiled: October 20, 2017Publication date: October 4, 2018Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hong In KIM, Thomas A KIM, Tae Sung JEONG
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Patent number: 10068855Abstract: A semiconductor package includes a frame including a through-hole, an electronic component disposed in the through-hole, a redistribution portion disposed below the frame and the electronic component, a metal layer disposed on an inner surface of the frame, and a conductive layer disposed between the metal layer and the electronic component, and covering the frame and the electronic component.Type: GrantFiled: May 18, 2017Date of Patent: September 4, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Hyun Kim, Thomas A. Kim, Kyu Bum Han, Kwan Hoo Son