Patents by Inventor Thomas A. Knapp

Thomas A. Knapp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10240772
    Abstract: A heat sink comprises a heat sink body, which in some embodiments is a plastic heat sink body, and a thermally conductive layer disposed over the heat sink body. In some embodiments the thermally conductive layer comprises a copper layer. A light emitting diode (LED)-based lamp comprises the aforementioned heat sink and an LED module including one or more LED devices in which the LED module is secured with and in thermal communication with the heat sink. Some such LED-based lamps may have an A-line bulb configuration or an MR or PAR configuration. Disclosed method embodiments comprise forming a heat sink body and disposing a thermally conductive layer on the heat sink body. The forming may comprise molding the heat sink body, which may be plastic. In some method embodiments the heat sink body includes fins and the disposing includes disposing the thermally conductive layer over the fins.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: March 26, 2019
    Assignee: GE Lighting Solutions, LLC
    Inventors: Ashfaqul I. Chowdhury, Gary R. Allen, Thomas A. Knapp
  • Publication number: 20110242816
    Abstract: A heat sink comprises a heat sink body, which in some embodiments is a plastic heat sink body, and a thermally conductive layer disposed over the heat sink body. In some embodiments the thermally conductive layer comprises a copper layer. A light emitting diode (LED)-based lamp comprises the aforementioned heat sink and an LED module including one or more LED devices in which the LED module is secured with and in thermal communication with the heat sink. Some such LED-based lamps may have an A-line bulb configuration or an MR or PAR configuration. Disclosed method embodiments comprise forming a heat sink body and disposing a thermally conductive layer on the heat sink body. The forming may comprise molding the heat sink body, which may be plastic. In some method embodiments the heat sink body includes fins and the disposing includes disposing the thermally conductive layer over the fins.
    Type: Application
    Filed: December 28, 2010
    Publication date: October 6, 2011
    Inventors: Ashfaqul I. Chowdhury, Gary R. Allen, Thomas A. Knapp
  • Patent number: D715972
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: October 21, 2014
    Assignee: GE Lighting Solutions LLC
    Inventors: Bruce R. Roberts, Thomas A. Knapp