Abstract: IC devices including transformers that includes two electrically conductive layers are disclosed. An example IC device includes a transformer that includes a first coil, a second coil, and a magnetic core coupled to the two coils. The first coil includes a portion or the whole electrically conductive layers at the backside of a support structure. The second coil includes a portion or the whole electrically conductive layers at either the frontside or the backside of the support structure. The two coils may have a lateral coupling, vertical coupling, or other types of couplings. The transformer is coupled to a semiconductor device over or at least partially in the support structure. The semiconductor device may be at the frontside of the support structure. The transformer can be coupled to the semiconductor device by TSVs. The IC device may also include BPRs that facilitate backside power delivery to the semiconductor device.

Abstract: A semiconductor die is provided. The semiconductor die includes a plurality of transistors arranged at a front side of a semiconductor substrate and an electrically conductive structure and a trench extending from a backside of the semiconductor substrate into the semiconductor substrate. A length of the trench is equal or larger than a lateral dimension of the semiconductor substrate.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a plurality of transistors arranged at a front side of a semiconductor substrate and a test structure located at the front side of the semiconductor substrate. Further, the semiconductor structure comprises a first electrically conductive connection extending from the test structure through the semiconductor substrate to a backside test pad arranged at a backside of the semiconductor substrate.

Abstract: A distribution system is disclosed for use in an induction system with an object processing system. The distribution system provides distribution of dissimilar objects into one of a plurality of receiving units. The distribution system includes an urging system for urging an object on a conveyor from the conveyor to one of a plurality of adjacent receiving stations via a receiving chute, wherein each receiving station is lower than the conveyor.

Abstract: Signal routing using structures based on buried power rails (BPRs) is described. An example IC device includes a support structure, a plurality of IC components provided over the support structure, and first and second electrically conductive structures having respective portions that are buried in the support structure, such structures referred to as “buried signal rails” (BSRs). The first BSR may be electrically coupled to a terminal of one of the plurality of IC components, the second BSR may be electrically coupled to a terminal of another one of the plurality of IC components, and the IC device may further include a bridge interconnect embedded within the support structure, the bridge interconnect having a first end in contact with the first BSR and a second end in contact with the second BSR. Implementing BSRs in IC devices may allow significantly increasing standard cell library density and provide geometry-free signal routing.

Abstract: An object processing system is disclosed that includes a plurality of track sections, and a plurality of remotely actuatable carriers for controlled movement along at least portions of the plurality of track sections, wherein each of the remotely controllable carriers is adapted to support and transport an object processing bin.

Abstract: A box handling system is disclosed for use in an object processing system. The box handling system includes a box tray including a recessed area for receiving a box, and the recessed area includes a plurality of floor and edge portions for receiving the box that contains objects to be processed.

Abstract: A maintenance system is disclosed for assisting in maintaining an automated carrier system for moving objects to be processed. The maintenance system includes a plurality of automated carriers that are adapted to move on an array of discontinuous standard track sections, each said automated carrier including a carrier body that is no larger in either a length or width direction that a standard track section, and an automated maintenance carrier that is adapted to move on the array of discontinuous track sections, said automated maintenance system including a maintenance body that is larger in at least one of a length or width direction than the standard track section.

Abstract: An end effector is disclosed for an articulated arm. The end effector includes a valve assembly including a plurality of supply channels, each supply channel including a supply conduit, a pressure sensor in fluid communication with the supply conduit, and a supply conduit plug. The supply conduit is in fluid communication with a vacuum source. During use, each supply conduit is either at vacuum such that the pressure within the supply conduit is substantially at a vacuum pressure, or is at a pressure that is substantially higher than vacuum pressure because the supply conduit plug has moved to block a portion of the supply conduit. The pressure sensor of each supply conduit provides a pressure sensor signal responsive to whether the pressure in the conduit is either substantially at vacuum or is at a pressure that is substantially higher than vacuum.

Abstract: An automated carrier system is disclosed for moving objects to be processed. The automated carrier system includes a discontinuous plurality of track sections on which an automated carrier may be directed to move, and the automated carrier includes a base structure on which an object may be supported, and at least two wheels assemblies being pivotally supported on the base structure for pivoting movement from a first position to a second position to effect a change in direction of movement of the carrier.

Abstract: A sensing manipulator of an articulated arm is disclosed. The sensing manipulator includes a compliant section and a movement detection system provided along a first direction of the compliant section such that movement of the compliant section along both the first direction and at least one direction transverse to said first direction, are detectable by the movement detection system.

Abstract: In accordance with disclosed embodiments, there is a method of integrating and accessing passive components in three-dimensional fan-out wafer-level packages. One example is a microelectronic die package that includes a die, a package substrate attached to the die on one side of the die and configured to be connected to a system board, a plurality of passive devices over a second side of the die, and a plurality of passive device contacts over a respective passive die, the contacts being configured to be coupled to a second die mounted over the passive devices and over the second side of the die.

Abstract: The present invention relates to compositions comprising a silicate and methods of use thereof. In particular, the compositions of the present invention are suitable for treating inflammatory conditions, cancer, bacterial and viral infections, and infected and uninfected wounds. The compositions of the present invention can also be useful in treating spinal cord injury, tissue remodeling, and promoting bone growth and repair.

Abstract: A processing system for processing objects using a programmable motion device is disclosed. The processing system a perception unit for perceiving identifying indicia representative of an identity of an object associated with an input conveyance system, and an acquisition system for acquiring the object from a plurality of objects at an input area using an end effector of the programmable motion device, wherein the programmable motion device is adapted for assisting in the delivery of the object to an identified processing location. The identified processing location being associated with the identifying indicia and said identified processing location being provided as one of a plurality of processing locations. The processing system also includes a delivery system for receiving the object in a carrier and for delivering the object toward the identified processing location.

Abstract: A semiconductor device is disclosed, comprising a first semiconductor die comprising a plurality of transistors; a second semiconductor die comprising power supply circuitry configured to generate a supply voltage for the plurality of transistors of the first semiconductor die; and a heat spreader structure. A power supply routing for a reference voltage or a power supply voltage which extends from the heat spreader structure through the second semiconductor die to the first semiconductor die.

Abstract: A semiconductor die is provided. The semiconductor die comprises a plurality of transistors arranged at a front side of a semiconductor substrate and an electrically conductive structure. A top surface of the electrically conductive structure is contacted at the front side of the semiconductor substrate and a bottom surface of the electrically conductive structure is contacted at a backside of the semiconductor substrate. Further, the semiconductor die comprises a backside metallization layer stack attached to the backside of the semiconductor substrate. A first portion of a wiring structure is formed in a first metallization layer of the backside metallization layer stack and a second portion of the wiring structure is formed in a second metallization layer of the backside metallization layer stack.

Abstract: A semiconductor device and method is disclosed. Devices shown include a die coupled to an integrated routing layer, wherein the integrated routing layer includes a first width that is wider than the die. Devices shown further included a molded routing layer coupled to the integrated routing layer.

Abstract: A storage, retrieval and processing system is disclosed for processing objects. The system includes a plurality of bins including objects to be distributed by the processing system, said plurality of bins being provided in at least a partially generally circular arrangement, a programmable motion device that includes an end effector for grasping and moving any of the objects, said programmable motion device being capable of reaching any of the objects within the plurality of bins, and a plurality of destination containers for receiving any of the objects from the plurality of bins, said plurality of destination containers being provided in a region that is generally within the at least partially generally circular arrangement of the plurality of bins.

Abstract: A sensing manipulator of an articulated arm is disclosed. The sensing manipulator includes a compliant section and a movement detection system provided along a first direction of the compliant section such that movement of the compliant section along both the first direction and at least one direction transverse to said first direction, are detectable by the movement detection system.

Abstract: An automated carrier system is disclosed for moving objects to be processed. The automated carrier system includes a discontinuous plurality of track sections on which an automated carrier may be directed to move, and the automated carrier includes a base structure on which an object may be supported, and at least two wheels assemblies being pivotally supported on the base structure for pivoting movement from a first position to a second position to effect a change in direction of movement of the carrier.