Abstract: A grinding engine includes a work spindle; a work chuck cooperated with the work spindle; a grind spindle; a grind wheel cooperated with the grind spindle; and a plurality of alignment adjustment systems positioned relative to and around the grind spindle, wherein adjustment from any one of the alignment adjustment systems is configured to cause a change in alignment between the work spindle and the grind spindle.

Abstract: Some embodiments provide methods of processing wafers comprising: positioning a stacked wafer into a position to be ground, wherein the stacked wafer comprises a first wafer secured with a carrier-wafer, wherein the first wafer is secured with the carrier-wafer such that a surface of the first wafer is exposed to be ground; initiating a grinding of the first wafer while supported by the carrier-wafer; activating one or more sensors relative to the first wafer while grinding the first wafer; determining, while grinding the first wafer, a thickness of the first wafer separate from a thickness of the carrier-wafer as a function of data from the one or more sensors; determining whether the determined thickness of the first wafer has a predefined relationship with a first thickness threshold; and halting the wafer grinding when the thickness of the first wafer has the predefined relationship with the first thickness threshold.

Abstract: A method of processing a device wafer in a wafer stack by chucking the wafer stack device side down and grinding the exposed side of the carrier wafer to parallel with the device wafer, and thereafter flipping the wafer stack and chucking the wafer stack carrier side down and grinding residual silicon from the device wafer.

Abstract: A method of processing a device wafer in a wafer stack by chucking the wafer stack device side down and grinding the exposed side of the carrier wafer to parallel with the device wafer, and thereafter flipping the wafer stack and chucking the wafer stack carrier side down and grinding residual silicon from the device wafer.

Abstract: Systems and methods are provided for use in processing and/or grinding wafers or other work products. Some embodiments provide a grinding apparatus that comprise a base casting; a rotary indexer configured to rotate within the base casting; a work spindle secured with the rotary indexer; a work chuck coupled with the first work spindle, wherein the first work spindle is configured to rotate the first work chuck; a bridge casting secured relative to the base casting, wherein the bridge casting bridges across at least a portion of the rotary indexer and is supported structurally forming a closed stiffness loop; a grind spindle secured with the bridge casting; and a grind wheel cooperated with the grind spindle, wherein the bridge casting secures the grind spindle.

Abstract: A grinding engine includes a work spindle; a work chuck cooperated with the work spindle; a grind spindle; a grind wheel cooperated with the grind spindle; and a plurality of alignment adjustment systems positioned relative to and around the grind spindle, wherein adjustment from any one of the alignment adjustment systems is configured to cause a change in alignment between the work spindle and the grind spindle.

Abstract: The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

Abstract: A grinding machine wherein coarse and fine grind wheels are mounted to a single rotating spindle. A multiple grind wheel mount is attached to the lower portion of the rotating spindle, the coarse and fine wheels being supported by the wheel mount, the wheel mount containing the mechanism for moving the inner coarse wheel down relative to the stationary outer fine wheel.

Abstract: A grinding machine wherein coarse and fine grind wheels are mounted to a single rotating spindle. A multiple grind wheel mount is attached to the lower portion of the rotating spindle, the coarse and fine wheels being supported by the wheel mount, the wheel mount containing the mechanism for moving the inner coarse wheel down relative to the stationary outer fine wheel.

Abstract: The present embodiments provide methods, systems and apparatuses for use in grinding work pieces, such as wafers. Some embodiments provide methods that position a grind spindle to contact a first grinding spindle to a face of a work piece, remove a portion of the face, and control the removing of the portion of the face according to a control algorithm. This control algorithm can comprise determining a force applied to the work piece during the removing of the portion of the face, adjusting a feed rate of the first grind spindle when the force applied to the work piece has a predefined relationship with a first threshold level; and dressing a portion of the first grinding portion when the force applied to the work piece has a predefined relationship with a second threshold level that is greater than the first threshold.

Abstract: A pivoting wafer carrier having a minimum of internal friction and a smooth, continuous pivoting motion. The pivot mechanism includes a lower ring mounted on a pressure plate, an upper ring mounted on a housing upper plate and ball transfer units disposed on the lower ring. Corresponding bearing wedges depend downwardly from the upper ring. As the pressure plate tilts during the polishing process, the load balls of the ball transfer units roll against the corresponding wedges, thus producing a smooth, continuous pivoting motion. A universal joint may be provided to the carrier to effect the rotation of the carrier and to aid the smooth, continuous pivoting motion of the wafer carrier.

Abstract: A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perform both edge and face grinding with a single grind spindle. A non-contact position sensor in a work spindle measures work spindle displacement during grinding and provides feedback to the grind spindle to regulate the force imparted on the work piece by the grind spindle. In variations, an abrasive wheel disposed radially with respect to an axis of spindle rotation is utilized to perform edge grinding of the work piece. In other variations cleaning, polishing and grinding are carried out in a single grinding assembly. In yet other variations, a wheel dressing apparatus is utilized to dress the wheel when one or more forces to maintain productivity of the grind wheel exceed a threhold.

Abstract: The methods and devices described below allow users of CMP tools to quickly calibrate Spindle Force, Wafer Force, and Retaining Ring Force using mechanisms, load cells, a control computer, and force equations. The control computer can test a variety of pressures in the inflatable seal or the inflatable membrane, depending on the wafer carrier configuration, to determine a unique calibration in real time for the particular wafer carrier that is being tested and used during the polishing process.

Abstract: A pivoting wafer carrier having a minimum of internal friction and a smooth, continuous pivoting motion. The pivot mechanism includes a lower ring mounted on a pressure plate, an upper ring mounted on a housing upper plate and ball transfer units disposed on the lower ring. Corresponding bearing wedges depend downwardly from the upper ring. As the pressure plate tilts during the polishing process, the load balls of the ball transfer units roll against the corresponding wedges, thus producing a smooth, continuous pivoting motion. A universal joint may be provided to the carrier to effect the rotation of the carrier and to aid the smooth, continuous pivoting motion of the wafer carrier.

Abstract: A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perform both edge and face grinding with a single grind spindle. A non-contact position sensor in a work spindle measures work spindle displacement during grinding and provides feedback to the grind spindle to regulate the force imparted on the work piece by the grind spindle. In variations, an abrasive wheel disposed radially with respect to an axis of spindle rotation is utilized to perform edge grinding of the work piece. In other variations cleaning, polishing and grinding are carried out in a single grinding assembly. In yet other variations, a wheel dressing apparatus is utilized to dress the wheel when one or more forces to maintain productivity of the grind wheel exceed a threhold.

Abstract: A method and apparatus for planarizing silicon wafers initially having wavy surfaces, such as might result from having been cut from a boule by means of a wire saw. A vacuum is applied to one side of a porous ceramic plate, and a perforated resilient pad is applied to the opposite side of the porous ceramic plate. The resilient pad is affixed to the ceramic plate by a peelable adhesive, and the vacuum extends through the perforations of the resilient pad to permit a wafer to be mounted on the exposed side of the resilient pad. The perforations in the resilient pad are distributed uniformally across the wafer, so that the atmospheric pressure pushing the wafer against the resilient pad is also uniform across the wafer. However, the wafer is not deformed while it is held in place for grinding. Because the wafer is not held in an elastically deformed condition while it is ground, the wafer has no tendency to spring back to its original wavy shape.

Abstract: Apparatus for polishing semiconductor wafers comprises a housing, a mounting apparatus within the housing for wax mounting a first face of a semiconductor wafer to a first face of a polishing block, and a first semiconductor wafer polisher within the housing for polishing a second face of the semiconductor wafer. The second face of the semiconductor wafer is opposite the first face of the semiconductor wafer. A first transfer mechanism is within the housing for delivering the polishing block and semiconductor wafer from the mounting apparatus to adjacent the first semiconductor wafer polisher. A controller controls operation of the mounting apparatus, the first semiconductor wafer polisher, and the first transfer mechanism.

Abstract: Method and apparatus for forming an electrical contact between mounting pins extending from an electrical component and insulated wires from the component that are wrapped around the pins in which the tips of the pins are held in a flowing pool of molten solder until the heat travelling up the pins loosens the insulation up to a desired level, and the pins are then quickly immersed up to that level and then quickly removed so as to cause the solder to melt and carry away the loosened insulation but to leave substantially intact the insulation that is not loosened.

Abstract: Programmable electric and hydraulic machine for shaping laps such as are used to form or polish opthalmic lenses, comprises vertically oscillatable, longitudinally displaceable arm carrying a point cutter which is functionally engageable by radially extensible, rotating lap carried by upstanding spindle. Alternately, spindle is operable by oscillating drive when lap is radially retracted. Toroidal or spherical laps having a large range of variance in two dimensions, i.e. curvatures, are thus obtained by using relevant cutter and lap locations, as well as appropriate drive settings. Concave laps are produced by exchanging locations of lap and cutter so workpiece is carried by vertical-moving arm.

Abstract: A programmable machine for automatically cutting and/or resurfacing a selected arcuate pattern upon either a convex or concave lap, particularly such laps as may then be used for forming and polishing opthalmic lenses. A lap positioning unit and a cutter positioning unit are located respectively on adjacent upright and horizontal supports so as to bring the lap and cutter into mutual engagement, each unit initially being longitudinally adjustable from a respective pivot point by a selected amount so as to determine the particular arcuate curvature obtained, which curvatures jointly form the two-dimentional arcuate pattern chosen for the lap face. In operation, the lap is oscillated vertically and a rotary milling cutter is driven back and forth transverse thereto.