Patents by Inventor Thomas Aisenbrey

Thomas Aisenbrey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160365564
    Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.
    Type: Application
    Filed: August 29, 2016
    Publication date: December 15, 2016
    Inventor: THOMAS AISENBREY
  • Publication number: 20160176095
    Abstract: A moldable capsule device (1) includes a bundle of micron conductive fiber (3) and a resin-based material layer (5) overlying the bundle along the length (L) of the capsule wherein thickness of the resin-based material layer is not uniform (T1 and T2), A method (100) to form a moldable capsule (1) including extruding/pultruding resin-based material layer (5) onto the length (L) of a bundle of micron conductive fiber (3), The resin-based material layer (5) has a first thickness (T1) and a second thickness (T2), The first thickness (T1) is disposed around multiple first surfaces (7) of the bundle. The second thickness (T2) is .disposed around multiple second surfaces (9) of the bundle. The second thickness (T2) is at least twice that of the first thickness (T1). The extended/pultruded resin-based material and bundle are section into moldable capsules.
    Type: Application
    Filed: February 29, 2016
    Publication date: June 23, 2016
    Inventor: THOMAS AISENBREY
  • Publication number: 20150213917
    Abstract: A moldable capsule includes a conductive element core and a resin-based material radially surrounding the conductive element core. The base resin host can include a single resin-based polymer material. The capsule can have a length of approximately 2-14 millimeters.
    Type: Application
    Filed: April 8, 2015
    Publication date: July 30, 2015
    Inventor: THOMAS AISENBREY
  • Publication number: 20140322532
    Abstract: A moldable capsule device (1) includes a bundle of micron conductive fiber (3) and a resin-based material layer (5) overlying the bundle along the length (L) of the capsule wherein thickness of the resin-based material layer is not uniform (T1 and T2). A method (100) to form a moldable capsule (1) including extruding/pultruding a resin-based material layer (5) onto the length (L) of a bundle of micron conductive fiber (3). The resin-based material layer (5) has a first thickness (T1) and a second thickness (T2). The first thickness (T1) is disposed around multiple first surfaces (7) of the bundle. The second thickness (T2) is disposed around multiple second surfaces (9) of the bundle. The second thickness (T2) is at least twice that of the first thickness (T1). The extruded/pultruded resin-based material and bundle are section into moldable capsules.
    Type: Application
    Filed: July 9, 2014
    Publication date: October 30, 2014
    Applicant: INTEGRAL TECHNOLOGIES, INC.
    Inventor: Thomas AISENBREY
  • Publication number: 20140290430
    Abstract: Automotive housings are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
    Type: Application
    Filed: June 18, 2014
    Publication date: October 2, 2014
    Inventor: Thomas AISENBREY
  • Publication number: 20140284076
    Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.
    Type: Application
    Filed: June 6, 2014
    Publication date: September 25, 2014
    Applicant: INTEGRAL TECHNOLOGIES, INC.
    Inventor: THOMAS AISENBREY
  • Publication number: 20140272117
    Abstract: Vehicle electrical and electronic components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
    Type: Application
    Filed: June 2, 2014
    Publication date: September 18, 2014
    Applicant: INTEGRAL TECHNOLOGIES, INC.
    Inventor: THOMAS AISENBREY
  • Publication number: 20140246800
    Abstract: Electric motor components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
    Type: Application
    Filed: May 15, 2014
    Publication date: September 4, 2014
    Applicant: INTEGRAL TECHNOLOGIES, INC.
    Inventor: THOMAS AISENBREY
  • Publication number: 20140079950
    Abstract: A moldable capsule includes a conductive element core and a resin-based material radially surrounding the conductive element core. The base resin host may include a single resin-based polymer material. The capsule may have a length of approximately 2-14 millimeters.
    Type: Application
    Filed: March 15, 2013
    Publication date: March 20, 2014
    Applicant: Integral Technologies, Inc.
    Inventor: Thomas Aisenbrey
  • Publication number: 20130130089
    Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.
    Type: Application
    Filed: January 16, 2013
    Publication date: May 23, 2013
    Applicant: Integral Technologies, Inc.
    Inventor: Thomas Aisenbrey
  • Patent number: 8377585
    Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.
    Type: Grant
    Filed: April 13, 2010
    Date of Patent: February 19, 2013
    Assignee: Integral Technologies, Inc.
    Inventor: Thomas Aisenbrey
  • Publication number: 20130031774
    Abstract: Electric motor components are formed of a conductive loaded resin-based, material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
    Type: Application
    Filed: August 10, 2012
    Publication date: February 7, 2013
    Applicant: INTEGRAL TECHNOLOGIES, INC.
    Inventor: Thomas Aisenbrey
  • Publication number: 20120321836
    Abstract: A moldable capsule device (1) includes a bundle of micron conductive fiber (3) and a resin-based material layer (5) overlying the bundle along the length (L) of the capsule wherein thickness of the resin-based material layer is not uniform (T1 and T2), A method (100) to form a moldable capsule (1) including extruding/pultruding a resin-based material layer (5) onto the length (L) of a bundle of micron conductive fiber (3), The resin-based material layer (5) has a first thickness (T1) and a second thickness (T2), The first thickness (T1) is disposed around multiple first surfaces (7) of the bundle. The second thickness (T2) is disposed around multiple second surfaces (9) of the bundle. The second thickness (T2) is at least twice that of the first thickness (T1). The extruded/pultruded resin-based material and bundle are section into moldable capsules.
    Type: Application
    Filed: August 10, 2012
    Publication date: December 20, 2012
    Applicant: INTEGRAL TECHNOLOGIES, INC.
    Inventor: Thomas Aisenbrey
  • Patent number: 8268222
    Abstract: Electric motor components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
    Type: Grant
    Filed: May 12, 2005
    Date of Patent: September 18, 2012
    Assignee: Integral Technologies, Inc.
    Inventor: Thomas Aisenbrey
  • Publication number: 20110024275
    Abstract: Key actuators and other switching devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.
    Type: Application
    Filed: September 7, 2010
    Publication date: February 3, 2011
    Inventor: Thomas Aisenbrey
  • Patent number: 7872405
    Abstract: Spark plug devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
    Type: Grant
    Filed: April 28, 2007
    Date of Patent: January 18, 2011
    Assignee: Integral Technologies, Inc.
    Inventor: Thomas Aisenbrey
  • Publication number: 20100326236
    Abstract: Automotive housings are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
    Type: Application
    Filed: September 7, 2010
    Publication date: December 30, 2010
    Inventor: Thomas Aisenbrey
  • Patent number: 7829006
    Abstract: Automotive housings are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
    Type: Grant
    Filed: June 2, 2005
    Date of Patent: November 9, 2010
    Assignee: Integral Technologies, Inc.
    Inventor: Thomas Aisenbrey
  • Patent number: 7829807
    Abstract: Key actuators and other switching devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.
    Type: Grant
    Filed: September 29, 2006
    Date of Patent: November 9, 2010
    Assignee: Integral Technologies, Inc.
    Inventor: Thomas Aisenbrey
  • Publication number: 20100192361
    Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.
    Type: Application
    Filed: April 13, 2010
    Publication date: August 5, 2010
    Inventor: Thomas Aisenbrey