Patents by Inventor Thomas Alan Bishop

Thomas Alan Bishop has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CABLE SEALANT ARRANGEMENT WITH PORT SIZE REDUCER
    Publication number: 20240264398
    Abstract: The present disclosure relates to a sealed closure having modular components, enhanced cable sealing, modular connection interfaces, enhanced cable anchoring and enhanced fiber management.
    Type: Application
    Filed: January 17, 2024
    Publication date: August 8, 2024
    Applicant: COMMSCOPE TECHNOLOGIES LLC
    Inventors: Johan GEENS, Philippe COENEGRACHT, Pieter DOULTREMONT, William B. BRYAN, William Alan CARRICO, Eddy Luc CAMS, Erik David BISHOP, Thomas Ross MARMON, Bart Mattie CLAESSENS, Alan Armando GARCIA GONZALEZ, Roel Modest Willy BRYON, Roger ALAERTS, Conny VAN DE VELDE, Jos BRANTS, El Moïz Mohammed Michel GHAMMAM, Jozef Christiaan Mathieu VERSLEEGERS, Marc Eugène Willem BERVOETS, Barry Wayne ALLEN, Maarten AERTS
  • Fabrication of optical devices and assemblies
    Patent number: 8021058
    Abstract: A method of forming a waveguide or an optical assembly includes molding a waveguide material, optionally in alignment with one or more optical components. The one or more optical components are aligned in a precision mold that is also used to form the waveguide. A cladding and encapsulation material can also be molded. The molded materials can be used to hold the components together in alignment in a single assembly. A connector structure can be molded as part of the assembly or can be prefabricated and incorporated into the molded assembly to facilitate connecting the assembly to other components without requiring active alignment or polishing of optical fiber ends.
    Type: Grant
    Filed: August 18, 2008
    Date of Patent: September 20, 2011
    Inventors: Kenneth Noddings, Daniel Marshall Andrews, Thomas Alan Bishop, Michael Anthony Olla
  • Fabrication of optical devices and assemblies
    Patent number: 7413688
    Abstract: A method of forming a waveguide or an optical assembly includes molding a waveguide material, optionally in alignment with one or more optical components. The one or more optical components are aligned in a precision mold that is also used to form the waveguide. A cladding and encapsulation material can also be molded. The molded materials can be used to hold the components together in alignment in a single assembly. A connector structure can be molded as part of the assembly or can be prefabricated and incorporated into the molded assembly to facilitate connecting the assembly to other components without requiring active alignment or polishing of optical fiber ends.
    Type: Grant
    Filed: September 17, 2001
    Date of Patent: August 19, 2008
    Inventors: Kenneth Noddings, Daniel Marshall Andrews, Michael Anthony Olla, Thomas Alan Bishop
  • Fabrication of optical devices and assemblies
    Publication number: 20030053770
    Abstract: A method of forming a waveguide or an optical assembly includes molding a waveguide material, optionally in alignment with one or more optical components. The one or more optical components are aligned in a precision mold that is also used to form the waveguide. A cladding and encapsulation material can also be molded. The molded materials can be used to hold the components together in alignment in a single assembly. A connector structure can be molded as part of the assembly or can be prefabricated and incorporated into the molded assembly to facilitate connecting the assembly to other components without requiring active alignment or polishing of optical fiber ends.
    Type: Application
    Filed: September 17, 2001
    Publication date: March 20, 2003
    Inventors: Kenneth Noddings, Daniel Marshall Andrews, Michael Anthony Olla, Thomas Alan Bishop
  • Tab tape-based bare chip test and burn-in carrier
    Patent number: 5656941
    Abstract: TAB tape is used to contact integrated circuit chip electrodes (without actual metallurgical bonding) at approximately 10 grams per lead contact force. The chip is clamped to the TAB leads, and held in place so that the tape site can be transported, tested, and burned-in like a TAB chip on tape. A TAB tape frame is utilized with the inner lead bond fingers angled upwards so that the ends of the fingers perform a scrubbing action on the chip contacts when the IC chip is engaged with the TAB tape slide carrier socket. A silicone bead provides a spring-like action underneath the fingers.
    Type: Grant
    Filed: February 14, 1995
    Date of Patent: August 12, 1997
    Inventors: Thomas Alan Bishop, Ernest Ricky Nolan