Abstract: A dental x-ray sensor holder includes at least two clamping faces wherein at least one of the faces includes at least one and preferably a plurality of resiliently deformable gripping protrusions. The clamping faces are positioned in a moveable, spaced opposing relation, such that the faces may be physically moved together to physically impinge the x-ray sensor therebetween.

Abstract: A dental x-ray sensor holder includes at least two clamping faces wherein at least one of the faces includes at least one and preferably a plurality of resiliently deformable gripping protrusions. The clamping faces are positioned in a moveable, spaced opposing relation, such that the faces may be physically moved together to physically impinge the x-ray sensor therebetween.

Abstract: A dental x-ray sensor holder includes at least two clamping faces wherein at least one of the faces includes at least one and preferably a plurality of resiliently deformable gripping protrusions. The clamping faces are positioned in a moveable, spaced opposing relation, such that the faces may be physically moved together to physically impinge the x-ray sensor therebetween.

Abstract: A modular coolant manifold for use with a power electronics device having a heat sink is disclosed. The modular coolant manifold comprises a base unit having an inlet side, an outlet side, and a pair of interconnecting sidewalls. A portion of the base unit defines a recess adapted to receive the heat sink of the electronics device. The base unit includes an internal coolant passage extending between an inlet port defined in the inlet side and an outlet port defined in the outlet side. The coolant passage is in flow communication with the recess. An inlet manifold is adapted for attachment to the base unit inlet side. The inlet manifold includes an inlet port, a transfer port, and a coolant passage interconnecting the inlet port and the transfer port. The inlet manifold transfer port is in flow communication with the base inlet port. An outlet manifold is adapted for attachment to the base unit outlet side.

Abstract: A power electronics device incorporating a modular packaging concept and having an integrated device cooler is disclosed. A modular power electronics die cooler is designed for use with a coolant manifold adapted to circulate a coolant medium past a mounting receptacle. The modular power electronics die cooler comprises a base unit adapted for mounting to the manifold, with the base unit having an upper portion and a lower portion. The upper portion includes a plurality of sidewalls defining an enclosure, and the lower portion includes a heat sink and is adapted for insertion in the manifold receptacle. At least one electronic component is mounted within the enclosure. Accordingly, upon mounting the base unit to the manifold, the heat sink is positioned in the coolant medium and thereby dissipates heat produced by the electronic component.