Abstract: Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure.

Abstract: New methods and configurations are provided that allow for a large memory capacity, as well as minimized interconnect distances between the memory chips and one or more processors, and the HUB chip-set. The apparatus, configurations and methods include providing a printed circuit board having one or more processor conductive portions and one or more z-axis connector conductive portions in close proximity with each other, and connecting the one or more processors on one side of a printed circuit board, and connecting the one or more z-axis connectors for the memory daughter cards on the opposite side of the processor board. Standoffs are used to support and secure the horizontally disposed z-axis memory daughter cards and to ensure proper spacing between the z-axis daughter cards and the processor board Standoffs include an alignment pin portion and a spacer portion. The alignment pin portion includes an alignment portion, foot, and urging portion.

Abstract: New methods and configurations are provided that allow for a large memory capacity, as well as minimized interconnect distances between the memory chips and one or more processors, and the HUB chip-set. The apparatus, configurations and methods include providing a printed circuit board having one or more processor conductive portions and one or more z-axis connector conductive portions in close proximity with each other, and connecting the one or more processors on one side of a printed circuit board, and connecting the one or more z-axis connectors for the memory daughter cards on the opposite side of the processor board. Standoffs are used to support and secure the horizontally disposed z-axis memory daughter cards and to ensure proper spacing between the z-axis daughter cards and the processor board Standoffs include an alignment pin portion and a spacer portion. The alignment pin portion includes an alignment portion, foot, and urging portion.

Abstract: Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure.

Abstract: Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure.

Abstract: A printed circuit board apparatus, configurations and methods are presented which provide for close spacing between the HUB and multiple processors as well as a common configuration for two or four processor boards. A printed circuit board is provided with conductive apertures and portions corresponding to an efficient Packaging allowing for the attachment of the processor-chip on one side of the printed circuit board, and the HUB and other supporting electronic components on the other side of the printed circuit board. This configuration allows for the close spacing of the electrical conductors of the HUB and the processors without the limitations imposed by the physical dimensions of the respective hardware. Additionally, a symmetric packaging of the conductive apertures and portions about a centerline of the printed circuit board allows for a simple design modification to allow for a two two-processor board to be manufactured from a similarly configured four-processor board.