Patents by Inventor Thomas Allan Koes

Thomas Allan Koes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8193274
    Abstract: In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: June 5, 2012
    Assignee: Arlon
    Inventors: Sam Najjar, Chenghong Li, Thomas Allan Koes, Daniel Chang
  • Publication number: 20090176918
    Abstract: In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.
    Type: Application
    Filed: January 8, 2008
    Publication date: July 9, 2009
    Inventors: Ousama Najjar, Chenghong Li, Thomas Allan Koes, Daniel Chang
  • Publication number: 20090176106
    Abstract: In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.
    Type: Application
    Filed: August 1, 2008
    Publication date: July 9, 2009
    Inventors: Sam Najjar, Chenghong Li, Thomas Allan Koes, Daniel Chang
  • Patent number: 7364672
    Abstract: In accordance with the present invention, we have developed compositions useful for the preparation of prepregs, laminates, and the like having excellent performance properties. Invention compositions comprise a combination of a first component (i.e., a low loss, low dielectric constant, hydrocarbyl thermoplastic resin), a second component (i.e., a component which is capable of crosslinking to produce a thermoset in the presence of the first component), a free radical source, and optionally, one or more additives and/or diluents. Invention compositions can be prepared from widely available and inexpensive starting materials. As a result, invention compositions not only provide fabricated articles having outstanding performance properties, in addition, the cost of producing the resulting articles compares quite favorably with the cost of making competitive materials which require the use of more expensive, less readily available starting materials.
    Type: Grant
    Filed: December 6, 2004
    Date of Patent: April 29, 2008
    Assignee: Arlon, Inc.
    Inventors: Thomas Allan Koes, Ousama Najjar